Zdravko Stanimirović

Vinča Institute of Nuclear Sciences, Serbia

Zdravko I. Stanimirović, Ph.D., has been active in research and development work for the last 29 years. He received his MS and PhD in Electrical Engineering from the Faculty of Electrical Engineering, University of Belgrade, Serbia, in 1999 and 2007, respectively. Dr. Stanimirović is currently an associate research professor at the “Vinča” Institute of Nuclear Sciences - National Institute of the Republic of Serbia, University of Belgrade. Over the years, he participated in several scientific projects funded by the Ministry of Science, Technological Development and Innovations of the Republic of Serbia. Dr. Stanimirović is the recipient of the IEEE Transactions on Components & Packaging Technologies Best Paper Award. His current research interests include material characterization measurements, MEMS, and micro/nanoscale sensors.

1books edited

5chapters authored

Latest work with IntechOpen by Zdravko Stanimirović

To present their work in the field of micromachining, researchers from distant parts of the world have joined their efforts and contributed their ideas according to their interest and engagement. Their articles will give you the opportunity to understand the concepts of micromachining of advanced materials. Surface texturing using pico- and femto-second laser micromachining is presented, as well as the silicon-based micromachining process for flexible electronics. You can learn about the CMOS compatible wet bulk micromachining process for MEMS applications and the physical process and plasma parameters in a radio frequency hybrid plasma system for thin-film production with ion assistance. Last but not least, study on the specific coefficient in the micromachining process and multiscale simulation of influence of surface defects on nanoindentation using quasi-continuum method provides us with an insight in modelling and the simulation of micromachining processes. The editors hope that this book will allow both professionals and readers not involved in the immediate field to understand and enjoy the topic.

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Micromachining

Edited by Zdravko Stanimirović

Chapters authored

Ceramic Injection Molding

By Zdravko Stanimirović and Ivanka Stanimirović

Part of the book: Some Critical Issues for Injection Molding

Optical MEMS for Telecommunications: Some Reliability Issues

By Ivanka Stanimirović and Zdravko Stanimirović

Part of the book: Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies

Low‐Frequency Noise and Resistance as Reliability Indicators of Mechanically and Electrically Strained Thick‐Film Resistors

By Zdravko Stanimirović

New contemporary applications of thick resistive films are inducing the need to investigate their behaviour under various stressing conditions. On the other hand, there is a growing interest in noise measurements as means of thick‐film resistor quality and reliability evaluation and evaluation of degradation under stress. For these reasons, this chapter presents effects of mechanical, electrical and simultaneous mechanical and electrical straining on performances of conventional thick‐film resistors that are analysed from micro‐ and macro‐structural, charge transport and low‐frequency noise aspects.

Part of the book: System Reliability

Thick‐Film Resistor Failure Analysis Based on Low‐Frequency Noise Measurements

By Ivanka Stanimirović

The chapter aims to present research results in the field of thick‐film resistor failure analysis based on standard resistance and low‐frequency noise measurements. Noise spectroscopy–based analysis establishes correlation between noise parameters and parameters of noise sources in these heterogeneous nanostructures. Validity of the presented model is verified experimentally for resistors operating under extreme working conditions. For the experimental purposes, thick‐film resistors of different sheet resistances and geometries, realized using commercially available thick‐film resistor compositions, were subjected to high‐voltage pulse (HVP) stressing. The obtained experimental results are qualitatively analysed from microstructure, charge transport mechanism and low‐frequency noise aspects. Correlation between resistance and low‐frequency noise changes with resistor degradation and failure due to high‐voltage pulse stressing is observed.

Part of the book: Failure Analysis and Prevention

Introductory Chapter: Temperature Sensing - The Book

By Ivanka Stanimirović and Zdravko Stanimirović

Part of the book: Temperature Sensing

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