Thermophysical Properties of Complex Materials

This book assists in the exchange of research and progress outcomes concerned with the latest issues in thermophysical properties (TPPs) of complex liquids research, development, and production. Topics cover the control of transport properties of metallic alloys, thermal analysis of complex plasmas and instabilities in plasma devices, thermophysical properties at nanolevel, theoretical background ...

This book assists in the exchange of research and progress outcomes concerned with the latest issues in thermophysical properties (TPPs) of complex liquids research, development, and production. Topics cover the control of transport properties of metallic alloys, thermal analysis of complex plasmas and instabilities in plasma devices, thermophysical properties at nanolevel, theoretical background of viscosities of hydrocarbons at varying temperature and pressure ranges, molecular modeling, and experimental investigations based on nanofluids and ionic conduction in solid-state electrolytes for thermodynamic data. This book enables global researchers to tackle the challenges that continue to generate cost-effective TPPs and the latest understanding in the development of complex materials and the collaboration of modern thermophysical generating technologies. Moreover, it provides a platform for different regional authors to exchange scientific knowledge and generate enthusiasm for science and technology.

Order Print Copy Recommend to Your Library

Your name

Your email address

Your Library’s email address

Department

Institution/Company

Loading...

Country

Loading...

Message of recommendation Dear Librarian, I would like to recommend the following IntechOpen book to be added to our library catalog: TITLE: 'Thermophysical Properties of Complex Materials' PRINT ISBN: 978-1-78984-888-5 Libraries are offered a 20% discount on retail book prices. For a quote, please contact the IntechOpen Print Sales Department directly at orders@intechopen.com Best regards.

I recommend this publication for the following reasons

Loading...

By submitting the form you agree to IntechOpen using your personal information in order to fulfil your library recommendation. In line with our privacy policy we won’t share your details with any third parties and will discard any personal information provided immediately after the recommended institution details are received. For further information on how we protect and process your personal information, please refer to our privacy policy.

Submit