Kenichi Takahata

University of British Columbia Canada

Kenichi Takahata received the B.S. degree in physics from Sophia University, Japan, in 1990 and the M.S. and Ph.D. degrees in electrical engineering from the University of Michigan, Ann Arbor, in 2004 and 2005, respectively. He held industrial research positions with Panasonic in Japan and 3M in USA, conducting R&D of micro devices and fabrication technologies for over ten years. Presently, he is an Assistant Professor at the University of British Columbia, Canada, as well as a Canada Research Chair. Prof. Takahata has published many papers and holds several issued patents in MEMS and micro/nanofabrication. He has served on committees for international conferences such as the IEEE MEMS and the IEEE Transducers. He also served as the editor of an InTech book Micro Electronic and Mechanical Systems. His research interests are in the areas of MEMS, nanotechnology, and micro/nanomanufacturing, including wireless microdevices, bioMEMS, nanomaterials and microstructures integration, and microplasma control and application.

Kenichi Takahata

2books edited

Latest work with IntechOpen by Kenichi Takahata

MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.

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