Open access peer-reviewed Edited Volume

Titanium Alloys - Recent Progress in Design, Processing, Characterization, and Applications

Ram Krishna

Madanapalle Institute of Technology & Science

Researcher in advanced materials and their advanced characterization techniques, Dr. Krishna completed his Ph.D. at the University of Leicester, UK, and held postdoctoral positions at the University of Manchester, UK, and North Carolina State University, US. Appointed as Associate Dean for the Industry Institute Interaction Cell at his college, he is a Fellow Member of The Institution of Engineers (India).

Covering

Extreme Temperature Application High Strength Corrosion Resistance Electron Microscopy Microstructure Additive Manufacturing Titanium Matrix Composite Load-Displacement Curves Selective Laser Melting Sustainable Thermomechanical Processing Weldability Superplasticity

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About the book

Titanium alloys are used in the most advanced applications and to achieve greater everyday usage in all types of products, which is undoubtedly justified in terms of comprehending recent developments in their design, processing, and properties. These alloys are recognized as critical industrial structural materials and are effectively employed in a wide range of sectors such as automotive industries, aerospace, military, energy, and biomaterials. The optimization of material properties is based on a thorough understanding of physical metallurgy, alloys design processes, deformation mechanisms, the impact of extreme environments, or the interaction of protective layers and protected alloys, and is contextualized in relation to more recent development activities. This book will address the latest developments and potential applications of this lightweight, high-strength engineering alloy in terms of its design, processing, characterization, properties, and applications. Authors are encouraged to present papers on current achievements and the most significant contributions in modern titanium alloy grades that have the potential to influence future scientific innovation and research-based advancements in all fields.

Publishing process

Book initiated and editor appointed

Date completed: February 22nd 2022

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline Extended: Open for Submissions

Potential authors submit chapter proposals ready for review by the academic editor and our publishing review team.

Approved chapters written in full and submitted

Deadline for full chapters: June 26th 2022

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: September 14th 2022

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

Book compiled, published and promoted

Expected publication date: November 13th 2022

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About the editor

Ram Krishna

Madanapalle Institute of Technology & Science

After getting his Master's degree in Materials and Metallurgical Engineering from the Indian Institute of Technology Kanpur, Dr. Ram Krishna continued his studies at the University of Leicester in the United Kingdom, where he got his Ph.D. in 2011. He held postdoctoral positions at the University of Manchester in the United Kingdom and North Carolina State University in Raleigh, North Carolina. His knowledge includes a wide range of materials for high temperatures applications and understanding their behavior and performance through mechanical testing at high temperatures, as well as advanced characterization techniques, as evidenced by his h-index of 10 and designation as co-inventor of 13 patents. He has authored or coauthored more than 30 research papers that have appeared in journals and conference proceedings. His current research focuses on 3D printing and materials for 3D printing applications.

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