Open access peer-reviewed Edited Volume

Polyimide for Electronic and Electrical Engineering Applications

Sombel Diaham

University of Toulouse


Low-k & High-k dielectrics Electrical insulation & Breakdown Energy storage Intermetal layer & Thin films transistors Sensors & Actuators Capacitors Power device packaging Digital isolators & Isolated-gate drivers Enamel wires Print Circuit Board (PCB) Thermal management & High temperature Space charge & Partial discharges

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About the book

Polyimide is nowadays fully acknowledged as one of the most efficient polymers in many industries for its excellent thermal, electrical and mechanical properties, as well as for its easy processability. Particularly, in the Electronic and Electrical Engineering industries, polyimide is widely used for decades thanks to its very good dielectric and insulating properties at high electric field and high temperature up to 250°C in long term-service.

Since its discovery in the mid-50’s, a wide range of applications from low to high voltage appeared, putting polyimide as a key material to design more performing and reliable electrical devices and systems. On another hand, polyimide appears also essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability or flexibility are required in order to sustain the growing electrical energy consumption needs of the global society.
Consequently, polyimide materials have and will have to face new exciting fundamental, technological and environmental challenges among which:
• a better understanding of its intrinsic electrical properties to identify current limitations and propose new advanced device designs,
• the development of innovative composites and nanocomposites structuration to tailor its physical properties by involving classical and original nanoparticles such as graphene layer, carbon nanotubes, metal, silicates, nitrides, etc.,
• the development of polyimide composites for energy storage, thermal management, reinforced nanodielectrics and corona-resistant nanocomposites,
• the development of new low and ultra-low dielectric constant polyimide for microelectronics (fluorinated polyimides, nanoporous, mesoporous),
• the development of new higher temperature reliable polyimide (high glass transition, high degradation temperature),
• the emergence of solvent-free processes to fit with environmental purposes
Moreover, many challenges regarding the aging mechanisms understanding under single or multiple constraints and the realistic lifetime prediction using robust physical modelling is a ubiquitous questioning in most of the electronic industries.
This book will target to review both the state-of-the-art and new researches on Polyimide for Electronic and Electrical Engineering Applications. It will present interdisciplinary chapters on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. Chapter proposals related to one of the following topics and their keywords (but not only restricted to them) are very welcome to be submitted for this book publication project:
• General Considerations and Technological Processes of Polyimide for Electronics and Electrical Systems
Processability, Photosensitive and non-photosensitive polyimide, Curing temperature,
Spin-coating, Dip-coating, Extruded enameled wires, Other casting methods
• Polyimide in Microelectronic Applications
Dielectric properties, Intermetal layer, Ultra Large-Scale Integration (ULSI), Low-k dielectrics, Fluorinated polyimide, Nanoporous polyimide, Flexible substrates, Thin film transistors, LCD devices, sensors and actuators (gas, humidity, pressure, tactile…)
• Polyimide in Medium and High Voltage Applications
Electrical insulation properties (conduction, breakdown), Digital isolators, Power electronics and devices, Power modules, Power integration, Passivation, Packaging, High voltage power systems, Enameled wires for fed-inverter rotating machine

Publishing process

Book initiated and editor appointed

Date completed: October 11th 2019

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline Extended: Open for Submissions

Potential authors submit chapter proposals ready for review by the academic editor and our publishing review team.

Approved chapters written in full and submitted

Deadline for full chapters: May 1st 2020

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: July 20th 2020

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

Book compiled, published and promoted

Expected publication date: September 18th 2020

All chapters are copy-checked and typesetted before being published. IntechOpen regularly submits its books to major databases for evaluation and coverage, including the Clarivate Analytics Book Citation Index in the Web of ScienceTM Core Collection. Other discipline-specific databases are also targeted, such as Web of Science's BIOSIS Previews.

About the editor

Sombel Diaham

University of Toulouse

Sombel Diaham received his M.Sc. degree in 2005 and his PhD degree in 2007 in Electrical Engineering both from the University of Toulouse, France. In 2008, he joined the University of Toulouse and the LAPLACE Research Institute as an Associate Professor in Electrical Engineering. His research field deals with insulating polymers and composites for high voltage power electronic applications. He studies the electrical properties of polymers and elastomers for power devices and power modules isolation and among others he has worked on polyimide for 15 years so far. His interests concern the physics of dielectrics, electrical characterizations, properties-process relationships, electrostatic modeling and aging of polymers under high electric field. Meanwhile, he develops and investigates composites and nanocomposites for power electronics. On this topic, he consecutively obtained two highly selective ANR national researcher programs (2013 and 2018) to work on field grading composites tailored by electric field. In 2018, he has been invited as Researcher in the European R&D Centre of Analog Devices in Limerick (Ireland) to work on high voltage digital isolators based on polyimide. In 2019, he obtained an International Young Scientist Fellowship funded by the National Natural Science Foundation of China (NSFC) for research activities on nanocomposites for HVDC in collaboration with the Northeast Electric Power University in Jilin. From 2019-2021, he obtained one of the prestigious Marie Skłodowska-Curie Individual European Fellowship (MSCA-IF) to pursue the development of advanced isolation technologies for digital isolators with Analog Devices and the Bernal Institute of the University of Limerick. Sombel Diaham is an IEEE Dielectrics and Electrical Insulation Society member (DEIS). He has been an executive committee member for the organization of the IEEE CEIDP 2018 and 2019 conferences as the Publication and Publicity Chair and has been an elected Board member of this conference since 2016. He has been the coordinator of the French Research Network on Dielectrics since 2016. He authored and co-authored more than 40 papers in international scientific journals, more than 100 international and national conference papers, 2 book chapters and 7 patents.

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