About the book
Polyimide is nowadays fully acknowledged as one of the most efficient polymers in many industries for its excellent thermal, electrical and mechanical properties, as well as for its easy processability. Particularly, in the Electronic and Electrical Engineering industries, polyimide is widely used for decades thanks to its very good dielectric and insulating properties at high electric field and high temperature up to 250°C in long term-service.
Since its discovery in the mid-50’s, a wide range of applications from low to high voltage appeared, putting polyimide as a key material to design more performing and reliable electrical devices and systems. On another hand, polyimide appears also essential for the development of new electronic devices where further considerations such as high power density, integration, higher temperature, thermal conduction management, energy storage, reliability or flexibility are required in order to sustain the growing electrical energy consumption needs of the global society.
Consequently, polyimide materials have and will have to face new exciting fundamental, technological and environmental challenges among which:
• a better understanding of its intrinsic electrical properties to identify current limitations and propose new advanced device designs,
• the development of innovative composites and nanocomposites structuration to tailor its physical properties by involving classical and original nanoparticles such as graphene layer, carbon nanotubes, metal, silicates, nitrides, etc.,
• the development of polyimide composites for energy storage, thermal management, reinforced nanodielectrics and corona-resistant nanocomposites,
• the development of new low and ultra-low dielectric constant polyimide for microelectronics (fluorinated polyimides, nanoporous, mesoporous),
• the development of new higher temperature reliable polyimide (high glass transition, high degradation temperature),
• the emergence of solvent-free processes to fit with environmental purposes
Moreover, many challenges regarding the aging mechanisms understanding under single or multiple constraints and the realistic lifetime prediction using robust physical modelling is a ubiquitous questioning in most of the electronic industries.
This book will target to review both the state-of-the-art and new researches on Polyimide for Electronic and Electrical Engineering Applications. It will present interdisciplinary chapters on the state of knowledge of each topic under consideration through a combination of overviews and original unpublished research. Chapter proposals related to one of the following topics and their keywords (but not only restricted to them) are very welcome to be submitted for this book publication project:
• General Considerations and Technological Processes of Polyimide for Electronics and Electrical Systems
Processability, Photosensitive and non-photosensitive polyimide, Curing temperature,
Spin-coating, Dip-coating, Extruded enameled wires, Other casting methods
• Polyimide in Microelectronic Applications
Dielectric properties, Intermetal layer, Ultra Large-Scale Integration (ULSI), Low-k dielectrics, Fluorinated polyimide, Nanoporous polyimide, Flexible substrates, Thin film transistors, LCD devices, sensors and actuators (gas, humidity, pressure, tactile…)
• Polyimide in Medium and High Voltage Applications
Electrical insulation properties (conduction, breakdown), Digital isolators, Power electronics and devices, Power modules, Power integration, Passivation, Packaging, High voltage power systems, Enameled wires for fed-inverter rotating machine