The purpose of this chapter is to outline systematic implementation of the Six Sigma DMAIC methodology as a case study in solving the problem of poor wafer yields in semiconductor manufacturing. The chapter also describes well-known industry standard business processes to be implemented and benchmarked in a semiconductor wafer fabrication facility to manage defect and yield issues while executing a Six Sigma project. The execution of Six Sigma enabled identification of the key process factors, root cause analysis, desired performance levels, and Cpk improvement opportunities. Implementing multilevel factorial design of experiments (DOE) study revealed critical input parameters on process tools contributing to defect formation. Improvement performed on these process tools resulted in in-line defect reduction and ultimately improving final yields.
Part of the book: Applications of Design for Manufacturing and Assembly