In this contribution, a combined electric field/magnetic field surface/volume integral equation approach is presented with special features for the characterization of substrate integrated waveguide (SIW) components. Due to the use of a parallel-plate waveguide Green’s function, only a small number of volume current basis functions are necessary to model the vias of the SIW sidewalls. The focal point is set on the specification of microstrip-SIW transitions using a via and a pad/antipad configuration for the coupling between the microstrip parts and the SIW and transitions with a two-stage ridged substrate integrated waveguide (SIW) where the SIW has a very thick substrate with regard to the microstrip line making it well suited for the design of a new class of compact end-fire SIW antennas for phased array applications which are partly characterized with CST Microwave Studio. An effective S-parameter extraction is used with both microstrip and special SIW waveguide ports.
Part of the book: Antennas and Wave Propagation