Physical properties of pure bulk copper.
\r\n\tIn recent decades, numerous studies have been carried out on eukaryotic microorganisms viz., fungi, protozoa and algae to unravel the disease mechanisms caused by them and also their potential use in genetic engineering. The current book will accumulate the latest findings related to eukaryotic microorganisms in order to guide the future research and to uplift this area of microbiology for potential applications in medical and agricultural sciences.
",isbn:null,printIsbn:"979-953-307-X-X",pdfIsbn:null,doi:null,price:0,priceEur:0,priceUsd:0,slug:null,numberOfPages:0,isOpenForSubmission:!1,isSalesforceBook:!1,isNomenclature:!1,hash:"111dd972fdc98d1968c9f854910f7188",bookSignature:"Dr. Asghar Ali Kamboh",publishedDate:null,coverURL:"https://cdn.intechopen.com/books/images_new/8963.jpg",keywords:"Mycology, Protozoology, Phycology, Gut eukaryotic microbiota, Antifungal / Antiprotozoal agents, Manipulating the Genes of Eukaryotes, Use of Eukaryotes in genetic engineering",numberOfDownloads:null,numberOfWosCitations:0,numberOfCrossrefCitations:0,numberOfDimensionsCitations:0,numberOfTotalCitations:0,isAvailableForWebshopOrdering:!0,dateEndFirstStepPublish:"August 27th 2019",dateEndSecondStepPublish:"September 17th 2019",dateEndThirdStepPublish:"November 16th 2019",dateEndFourthStepPublish:"February 4th 2020",dateEndFifthStepPublish:"April 4th 2020",dateConfirmationOfParticipation:null,remainingDaysToSecondStep:"3 years",secondStepPassed:!0,areRegistrationsClosed:!0,currentStepOfPublishingProcess:5,editedByType:null,kuFlag:!1,biosketch:null,coeditorOneBiosketch:null,coeditorTwoBiosketch:null,coeditorThreeBiosketch:null,coeditorFourBiosketch:null,coeditorFiveBiosketch:null,editors:[{id:"225390",title:"Dr.",name:"Asghar Ali",middleName:null,surname:"Kamboh",slug:"asghar-ali-kamboh",fullName:"Asghar Ali Kamboh",profilePictureURL:"https://mts.intechopen.com/storage/users/225390/images/system/225390.jpeg",biography:"Dr. Asghar Ali Kamboh was born in Mehrabpur, Sindh, Pakistan. He completed his studies in Veterinary Medicine and Masters in Veterinary Microbiology in 2003 and 2007 respectively, with distinguished grades. In 2009, he was awarded an overseas scholarship by the Government of Pakistan and proceeded to China for doctoral studies. Currently, he is working as an Associate Professor in the Department of Veterinary Microbiology, Sindh Agriculture University, Tandojam. He has edited two books and published more than 100 research and review articles in national and international peer-reviewed journals. He has supervised/co-supervised more than 35 M.Phil students. He is also the author of many books and book chapters. In addition, he is an editor/editorial board member of many scholarly journals in the area of animal health and production.",institutionString:"Sindh Agriculture University",position:null,outsideEditionCount:0,totalCites:0,totalAuthoredChapters:"0",totalChapterViews:"0",totalEditedBooks:"1",institution:{name:"Sindh Agriculture University",institutionURL:null,country:{name:"Pakistan"}}}],coeditorOne:null,coeditorTwo:null,coeditorThree:null,coeditorFour:null,coeditorFive:null,topics:[{id:"13",title:"Immunology and Microbiology",slug:"immunology-and-microbiology"}],chapters:null,productType:{id:"1",title:"Edited Volume",chapterContentType:"chapter",authoredCaption:"Edited by"},personalPublishingAssistant:{id:"305835",firstName:"Ketrin",lastName:"Polesak",middleName:null,title:"Mrs.",imageUrl:"https://mts.intechopen.com/storage/users/305835/images/9351_n.png",email:"ketrin@intechopen.com",biography:"As an Author Service Manager my responsibilities include monitoring and facilitating all publishing activities for authors and editors. From chapter submission and review, to approval and revision, copyediting and design, until final publication, I work closely with authors and editors to ensure a simple and easy publishing process. I maintain constant and effective communication with authors, editors and reviewers, which allows for a level of personal support that enables contributors to fully commit and concentrate on the chapters they are writing, editing, or reviewing. I assist authors in the preparation of their full chapter submissions and track important deadlines and ensure they are met. I help to coordinate internal processes such as linguistic review, and monitor the technical aspects of the process. As an ASM I am also involved in the acquisition of editors. Whether that be identifying an exceptional author and proposing an editorship collaboration, or contacting researchers who would like the opportunity to work with IntechOpen, I establish and help manage author and editor acquisition and contact."}},relatedBooks:[{type:"book",id:"8470",title:"Poultry",subtitle:"An Advanced Learning",isOpenForSubmission:!1,hash:"88f09746e2b424573c8dc0bd927e9dbb",slug:"poultry-an-advanced-learning",bookSignature:"Asghar Ali Kamboh",coverURL:"https://cdn.intechopen.com/books/images_new/8470.jpg",editedByType:"Edited by",editors:[{id:"225390",title:"Dr.",name:"Asghar Ali",surname:"Kamboh",slug:"asghar-ali-kamboh",fullName:"Asghar Ali Kamboh"}],productType:{id:"1",chapterContentType:"chapter",authoredCaption:"Edited by"}},{type:"book",id:"1591",title:"Infrared Spectroscopy",subtitle:"Materials Science, Engineering and Technology",isOpenForSubmission:!1,hash:"99b4b7b71a8caeb693ed762b40b017f4",slug:"infrared-spectroscopy-materials-science-engineering-and-technology",bookSignature:"Theophile Theophanides",coverURL:"https://cdn.intechopen.com/books/images_new/1591.jpg",editedByType:"Edited by",editors:[{id:"37194",title:"Dr.",name:"Theophile",surname:"Theophanides",slug:"theophile-theophanides",fullName:"Theophile Theophanides"}],productType:{id:"1",chapterContentType:"chapter",authoredCaption:"Edited by"}},{type:"book",id:"3161",title:"Frontiers in Guided Wave Optics and Optoelectronics",subtitle:null,isOpenForSubmission:!1,hash:"deb44e9c99f82bbce1083abea743146c",slug:"frontiers-in-guided-wave-optics-and-optoelectronics",bookSignature:"Bishnu Pal",coverURL:"https://cdn.intechopen.com/books/images_new/3161.jpg",editedByType:"Edited by",editors:[{id:"4782",title:"Prof.",name:"Bishnu",surname:"Pal",slug:"bishnu-pal",fullName:"Bishnu Pal"}],productType:{id:"1",chapterContentType:"chapter",authoredCaption:"Edited by"}},{type:"book",id:"371",title:"Abiotic Stress in Plants",subtitle:"Mechanisms and Adaptations",isOpenForSubmission:!1,hash:"588466f487e307619849d72389178a74",slug:"abiotic-stress-in-plants-mechanisms-and-adaptations",bookSignature:"Arun Shanker and B. 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Spraying is used in internal combustion engines, application of agrochemicals over cultivated fields and greenhouses, irrigation systems, among others. Some questions raised by this topic of engineering can be studied using the computational simulation of multiphase flows. There are currently different ways to implement these tools. In the Eulerian approach, the physical domain is subdivided into cells of a grid space. Each cell has a portion of its volume filled by the liquid phase and the other part by the air. Continuity, momentum, energy and species, for a single-fluid mixture conservation equations, are solved in all pass time of the simulation [1, 2]. On the other hand, the Lagrangian approach at one particle proposes the velocities and positions of particles simulation (solids, liquid, vapor, or scalar species) by solving a stochastic equation following the Markov chains. The deterministic term is obtained from the average air velocity values, while the random term is like a white noise following a Brownian motion. The coupled Eulerian large-eddy simulation (LES) with Lagrangian one-particle stochastic method (STO) has been proposed in order to obtain more details on the turbulent properties of the fluid carrying the particles. Several studies using this coupling methodology (LES-STO) can be found [3, 4, 5, 6, 7, 8, 9, 10, 11]. In this chapter, we focus on the ejection of droplets in air environment from a spray nozzle. The sprayed liquid is a water at 20°C temperature, and the ejection pressure reaches 3 bar. The atmosphere temperature is like the water ejected, but the air pressure is 1.013 bar. These conditions are like as Nuyttens experience [12]. The author carries out paired measurements of droplet diameters and velocities at 25 cm below the spray nozzle using phase Doppler particle analyzer (PDPA) instrument. The particle’s Euler-Lagrangian double-way coupling code LES-STO is proposed for to simulate the trajectory of these particles in their liquid phase. The original finite-difference Eulerian LES code named advanced regional prediction systems (ARPS) developed by the University of Oklahoma’s Center for Analysis and Forecasting of Storms (CAPS) [13] has been adapted by Aguirre [14] for the simulation of fluid particles in order to validate it with measurements of concentration of a passive gas made in a wind tunnel over flat ground [15] and in the presence of a gentle sloping hill [16]. First time, we present a random ejection algorithm of droplet diameters whose probability density function replies to the two-parameter Weibull distribution. These parameters are previously obtained using laboratory experimental data. Second time, we present the theoretical approach for obtaining the results of collision droplets into the spray. The binary collision droplet model [17, 18, 19] has been performed in the LES-STO code. This model uses the concept of symmetric weber number [20] to consider the relationship between the kinetic and surface energy of the two colliding droplets. Finally, an agrochemical spraying over a cultivated field in low wind velocity and high air temperature conditions is showed.
In this section, we present a random ejection algorithm for simulating different diameters of droplets whose probability density function matches a Weibull distribution. The scale and shape parameters of Weibull distribution are previously obtained from laboratory experimental data using a phase Doppler particle analyzer (PDPA) performed by Nuyttens [12] from an HARDI™ spray nozzle. The sprayed liquid in laboratory experience has been water at 20°C temperature, and the ejection pressure reaches 3 bar. The atmosphere temperature is like the water ejected, but the air pressure is 1.013 bar and a calm wind.
The initial conditions of ejection droplets are as follows:
The nozzle height was located at
The elliptical shape A (Figure 1) for exit droplets. It was located at
The angle of the spray in the transverse direction is
The minor semiaxis of A ellipse (transverse direction
The major semiaxis of A ellipse (longitudinal direction
The initial vertical velocity of liquid particles is adopted from the confined fluid simulation [21]
The initial horizontal component velocity of each liquid particle will depend on the initial position within the A ellipse (Figure 1):
where (
where
Spray cone HARDI ™ ISO F 110-O3 nozzle follows Nuyttens laboratory experience [
All particles are located at the
The Rosin-Rammler (R-R) distribution function is a cumulative function of continuous random variable whose probability density function (p.d.f.) is a two-parameter Weibull. This distribution function is used [22, 23] to adjust experimental data of droplet diameter measurements as a function of liquid-sprayed fraction volume in order to obtain the shape
Once the shape and scale parameters of the Weibull p.d.f. are obtained, which characterize the diameters of drops ejected from the spray nozzle, it is necessary to carry out a temporal sequence for the simulation of these diameters. An algorithm based on the function of the random variable
where
With this method, it is possible to simulate diameters of liquid particles that follow the normal distribution from random number generation
where
However, in Eq. (4), we do not consider the asymmetry of the Weibull p.d.f. For this, it is necessary to incorporate the mode (
Incorporating this value into Eq. (4), the random variable
Eqs. (1), (2), and (7) provide the initial conditions of velocities, positions, and diameters of the ejected liquid particles from the HARDI™ ISO F110-O3 nozzle.
Several simplifications are imposed at ejection and trajectory simulation of liquid particle phenomena:
Particles are considered to have a constant spherical shape in their trajectory.
The rotating motion of the particle is not considered.
The ratio between droplet and air densities is very large.
Assuming these simplifications, the force per unit mass to which the liquid particles are submitted is based on a balance between gravity and drag forces per unit mass:
where
where
Several drag coefficient expressions have been analyzed [27]. The authors showed that Turton expression [28] has given better results in this simulation case:
When the drag and gravity forces are balanced, the liquid particles reach the sedimentation regime. In this case of free fall, the droplets have only vertical velocity component. This velocity is named sedimentation velocity
Note that
The time elapsed until the particle reaches the sedimentation velocity can be written as:
This is an important parameter of liquid particles because if the time elapsed until the liquid particle reaches the ground is longer than the sedimentation time, it will be exposed to drift.
The double-way coupled model presents a bidirectional coupling between the Eulerian and Lagrangian equation systems. Based on the Eulerian approach, the large-eddy simulation (LES) technique is proposed to obtain a detailed turbulent flow. The turbulent intensity of the fluid that transports the liquid particles is taken into account in the simulation of its trajectories. In this approach, it is not possible to obtain a full description of all eddies, so the LES technique is applied for resolving the larges scales of turbulence. The small scales are modeled by subgrid eddy viscosity model (SGS). A dynamic SGS model proposed by Germano [29] is implemented in ARPS by Aguirre [14]. On the other hand, the Lagrangian form is proposed to simulate the trajectories of the liquid particles. In the double-way-coupled LES-STO model, it is considered that the intensity of turbulent flow is taken into account in Lagrangian stochastic equation, and the presence of the liquid particles is taken into account in the momentum equation for LES.
The governing equations of the liquid particles trajectories are based on a Lagrangian stochastic model at a one-particle and one-time scale following the classical equation of Langevin. The air velocity model at liquid particle position
The tensors
It is necessary to simulate the air velocity at liquid particle position
The LES code advanced regional prediction system (ARPS) developed by Center of Analysis and Prediction of Storm (CAPS) and Oklahoma University [13] numerically integrates the time-dependent equations of mass balance, forces and energy of the largest turbulent scales. Filtered continuity as in Eq. (17), filtered momentum of fluid velocity as in Eq. (18), and filtered momentum of scalars as in Eq. (19) are described as follows:
where
From Lagrangian stochastic equation to the Eulerian LES model taken into account, the number of liquid particles is very large near the nozzle. The coupling has been computed by adding
where
Aguirre and Brizuela [11] show that the coupling LES-STO model allows to find the expressions of the deterministic and random terms of Eq. (14) using the velocity-filtered density function (VFDF) proposed by Gicquel et al. [30]:
The material derivatives of the velocity-filtered air flow, subgrid turbulent kinetic energy
The subgrid turbulent kinetic energy is solved by 1.5 order transport equation [31] and
The unresolved velocity component
where the subscript (
With Eqs. (16) and (22–25), it is possible to calculate the air velocity at the liquid particle position. The equations describing the motion of the liquid particle in its discrete form are:
It is necessary to note that in the first Eq. (26), the rate
Once the droplets ejected from the spray nozzle and having simulated their positions, velocities and diameters along their trajectory, it is necessary to consider the collision. Binary droplet collision models are a widely used theoretical approximation to obtain the outcome of the interaction droplets [17, 18, 19, 20, 33, 34, 35, 36, 37, 38, 39]. This model consists of estimating the positions, velocities, and diameters of droplets after the collision. In addition, satellite droplets can be created from the ligament breakup as a consequence of it.
The binary droplet collision is simulated using three important parameters. The ratio of the droplet diameters ∆ (Eq. (27)), the dimensionless symmetric Weber number (Wes) [20] relating kinetic energy vs. surface energy (Eq. (28)), and the dimensionless impact parameter (Imp) takes into account the way in which the two droplets impact (Eq. (29)):
where the subscripts
Scheme of small droplet S and large droplet L before collision (dashed line) and at contact instant (solid line).
In Eq. (30),
The relative velocity droplets of the mass center can be resumed using Eq. (27):
For the impact parameter in Eq. (29), it is necessary to compute
So, inserting Eq. (34) into Eq. (33) results in:
It is necessary to obtain
In each time of numerical simulation, it checks whether the collision between two droplets occurs. For obtaining a more optimize algorithm, collision boxes are placed around and inside the liquid particle ejection spray. The sizes of grid boxes vary dynamically, adjusting to the boundaries of the particle domain as shown in Figure 3a. The size of the boxes is the same as the Eulerian calculation grid in horizontal direction Δ
(a) Collision boxes around and inside the spray ejection of droplets and (b) droplets inside the collision box at
Positions of droplets before and after the collision for a time lapse Δ
The outcomes of collision droplets are computed using the map collision theory. Once the droplets collided and the effects of collision are into account on the droplets, they are repositioned by advancing the same pass time Δ
The outcomes of the binary droplet collision model propose different scenarios:
Figure 5 shows a time sequence of the binary droplet collision for each outcome described above. It is important to note that the result of the binary collision depends not only on the velocity of both drops but also on their relative size and impact coefficient. Two of the four possible outcomes of the binary collision are susceptible to generating satellite droplets. These droplets are usually much smaller in size than the parent-drops and are, therefore, more prone to drift and evaporation. If these droplets are composed of a phosphonate-acid solution (such as glyphosate), then after evaporation, the solute will drift away from the airflow very quickly.
Time sequence diagram of the binary droplet collision and its outcomes.
The outcomes of collision droplets are defined using a map collision. This map is the graphic representations between the Wes vs. Imp (Wes-Imp) frontier curves among the different outcomes of binary collision that are displayed on this map. Several researchers proposed equations for frontier curves. The transition impact factor between coalescence and stretching separation (Impc-s) is according to Rabe [20] as follows:
The transition impact factor between coalescence and reflexive separation (Impc-r) is:
The transition impact factor between reflexive and stretching separation appears when the Wes > 2.5 and can be considered a constant value Impr–s = 0.28.
It should be noted that the boundary curve between coalescence and reflexive separation Impc-r increases with the increase of Wes to the value of Imp = 0.28. This behavior indicates that for low Imp values (on-head collision) and relatively low droplet velocities before collision, surface energy is greater than kinetic energy and the result of the collision is stable coalescence. However, for the same Imp values but with higher velocities, the kinetic energy is predominant; the droplets have an unstable coalescence and then separate. This separation can generate satellite droplets. On the other hand, if the Imp is higher (tangential collision of the droplets), then coalescence as a result of the collision is more improbable since only a fraction of the volume of the drops interacts during the collision. The contact surface of both drops is smaller and therefore the surface energy as well. This reduces the likelihood of stable coalescence as a consequence of the collision. This behavior is evident in the Impc-s frontier curve, which decreases the coalescence area as the Imp increases.
For bounce, the model proposed by Estrade [35] calculates the number of transition Weber Web according to the Imp, Δ and a shape parameter,
where
and
The transition bounces into Wes-Imp map collision droplets, and the Weber symmetric bounce frontier Wesb is used. So, it is obtained from Web (Eq. (40)) as:
The Wes-Imp map collision droplets define areas
Map collision droplets with areas of outcomes collision.
The binary droplet collision model allows obtaining the diameters and velocities of the droplets after the collision. The values of these variables are obtained according to the proposed models [17, 18, 19, 34] (coalescence, reflexive, and stretching separations) and [35] (bounce outcome).
For coalescence outcome, the two droplets coalesce into one. This occurs preferably at low Weber numbers as surface tensions exceed kinetic energy. The new droplet velocity is the velocity of mass center before the collision
Munnannur and Reitz [17] calculate the interaction volume between the droplets. This volume is released from both drops creating a ligament that gives rise (or not) to satellite droplets. This volume is computed and taken into account the magnitude of the opposing surface (Esurten), stretching (Estrtch), and viscous dissipation energies (Edissip) by using a separation coefficient (
where
The relative velocities of mass center after collision can be written by using momentum conservation equation:
The velocities after collision can be obtained by using Eqs. (30) and (31). The diameters of droplets after collision are unaltered.
where ΨS and ΨL are the fraction of volumes lost from the smaller and large droplets to form the ligament [17, 18], and
Collision model for the stretching outcome. (a) Formation instant time of ligament and (b) temporal evolution ligament.
The diameter of satellite droplets can be determined by following Georjon [41]:
The number of satellite droplets is calculated from the mass conservation by assuming uniform satellites size
where the diameters of parent droplets after collision are:
The volume of ligament is the entire temporarily merged mass of two droplets. The model of satellite droplet formation is similar at stretching outcome, but the initial radius of ligaments is
When
In this case, the droplets bounce maintaining their diameters after the impact. In the general case, oblique collision between droplets is considered. The droplet velocities after collision must be decomposed into a normal component and a tangential component to the plane of impact. The tangential component after impact remains unchanged, but the normal component is affected by a soft inelastic rebound assuming a restitution coefficient
where
where
In order to obtain the Weibull p.d.f. corresponding to the droplet diameters as described in Section 2.1, the scale
Regression line of R-R distribution function and data measurement of droplet diameters.
The trajectories of liquid particles are simulated with an Euler-Lagrangian double-way coupled model descript in Section 2.2. The influence of droplets to air velocity is shown in Figure 9 (a) for
Influence of droplets to air velocity at different instant times of the simulation. (a)
Position of droplets at
The results of the vertical droplet velocities distribution as a function of the droplet diameters obtained at 0.35 m below the nozzle are shown in Figure 11. These are compared with the laboratory measurements of Nuyttens [12]. It is observed that the dispersion of velocity values for each diameter class is greater in laboratory measurements than in simulation. In addition, for diameters less than 200 μm, the model slightly underestimates the vertical velocity values relative to the laboratory results.
Distribution of vertical droplet velocities in (m/s) as a function of the diameters (μm).
The collision map for binary droplet model descripted in Section 2.3 is shown in Figure 12. The map allows showing the events of coalescence, bounce, reflexive, and stretching separation. When considering the total number of droplet binary collision events, 21.1% corresponds to coalescence, 0.6% to reflexive separation, 8.8% to stretching separation, and 69.5% to bounce. The amount of satellite droplets arising from the separation by reflexive and stretching is displayed with numbers. It is noted that the number of satellite drops increases with the number of symmetrical Weber for both separately. This behavior indicates that the greater velocity the droplets are ejected from the spray nozzle, the more likely it is that satellite droplets will appear as a result of reflexive and stretching separation. As mentioned above, this can cause an increase in the proportion of sprayed product not reaching its destination, leaving it adrift.
Map outcomes from binary droplet collision model.
Figure 13 shows the drift simulation of droplets spraying over cultivate field with a nozzle at 0.75 m above the ground.
Drift of spraying droplets from a nozzle at 0.75 m over ground.
The meteorological conditions of air temperature at nozzle level are 30°C with 2 m s−1 velocity wind. The simulation time shown in Figure 13 is 20 s after the start of spraying. The drift of small droplets (less than 50 μm in diameter) exceeds 8 m in the area of application. Of the total liquid sprayed, 0.43% corresponds to droplets smaller than 50 μm measured by Nuyttens [12] in wind tunnel at 50 cm below the spray nozzle. In the simulation shown in Figure 13, this percentage does not change because the satellite droplets generated are greater than 80 μm. The number of satellite droplets generated by stretching and reflective separation in these conditions was obtained. Of the 120 satellite droplets analyzed, 35.3% have diameters less than 150 μm, 61.3% have diameters between 150 and 250 μm, and 3.4% have diameters between 250 and 350 μm. There were no satellite droplets with diameters larger than 350 μm.
In the present work, it was possible to simulate and validate the ejection velocity of the liquid particles from an HARDI™ ISO F110 03 nozzle placed at 0.75 m over ground. The diameters of the drops were randomized to the volume applied following a procedure of Rosin-Rammler distribution function for obtaining the parameters of Weibull probability density function with a correlation coefficient R2 = 0.997. The double-way coupled Euler-Lagrangian model has been used for obtaining the trajectory of droplet spraying. Eddies at both sides of spraying have been captured by the model. These extend up to 3 m from the center of the spray. The vertical component droplet velocity was simulated and validated with laboratory measurements. The velocity of droplets smaller than 200
The present work is funded through the PIO CONICET-UNER 2015–2016 project and the FCyT-UADER research project “Development of a simulation model for the study of the drift of agricultural sprayings, using a flat fan nozzle, from trailing equipment.” We are also grateful to the Laboratory of Prototyping of Electronics and 3D Printing of the School of Engineering, UNER, for the work of printing the nozzle.
The Weibull probability density function (Weibull p.d.f.) can be used for describing a lot of technical applications for which the distribution of ground material, particles dispersion, or droplet diameters in spray jet normally in the μm-band have behaviors with a random characteristic. In this case, the diameters of droplets ejected from a spray nozzle are simulated using a Weibull p.d.f.
Let us name the random variable
In this p.d.f.,
To take these data into account, the cumulative function of the Weibull distribution, named Rosin-Rammler (R-R), is used.
The R-R distribution function
Eq. (A.2) can be written as:
If we associate Eq. (A.3) with a linear equation
With these two parameters (
Copper and copper alloys are one of the major groups of commercial metals. Pure copper is defined as having a minimum copper content of 99.3% [1].
While pure copper is used extensively for electrical components, such as cables and contacts, alloys like brass or bronze are used for thermal energy transfer applications, such as radiators and heat exchangers [2].
While the laser-based additive manufacturing of alloyed coppers, such as brass or bronze, was successfully done, approaches in processing pure copper with, at the time, available infrared laser sources were not satisfying in terms of electrical conductivity, density, and process stability. Electron beam-based AM technologies overcame this and reached densities close to 99.8% [3], however, the coarse powders combined with the high-thermal conductivity resulted in higher surface roughness and hindered de-powdering of fine channels. Sintered-based AM technologies recently reached densities above 95%, but as in metal injection molding (MIM), their mechanical properties are behind their laser or electron beam-melted counterparts.
With the availability of a powerful green laser source, some of the drawbacks in terms of the processing could be overcome resulting in highly dense and conductive parts. However technological aspects, such as a bigger laser spot diameter reduces the ability to produce for instance thin-walled or other intricate features.
Copper has unique properties that make it an outstanding engineering material, however, those properties can make the processing a particular challenge in the context of additive manufacturing and demands specific approaches.
Copper possesses the second highest electrical and thermal conductivity of all metals. The high-thermal conductivity of copper is a particular challenge during welding processes whether it is during the direct laser metal deposition or powder bed laser processing. For powder bed, this results in higher surface roughness, because the heat zone (due to the heat spreading into the powder bed) is wider causing particles to partially sinter to the consolidated body.
Due to its crystalline structure (fcc), pure copper also has high ductility. This also remains after the processing of pure copper parts from powders. Internal stresses, typically a problem for additively manufactured materials, are very low. This is beneficial since process and geometry-induced distortions are usually not a big problem. Further, an stress-relief annealing, is in most cases, not necessary but may be useful for the homogenization of the microstructure. Table 1 gives a brief overview of some physical properties of pure copper. While, based on the definition of pure copper, the absolute values often show deviations, however, the table should give an orientation.
Melting point | 1083°C | [4] |
Density | 8.94 g/cm3 @ 20°C | [4] |
Coef. thermal expansion | 17.0 x 106 /C (20–100°C) | [4] |
Thermal conductivity | 401 W/mK @ 20°C | [4] |
Electrical conductivity | 59.6 MS/m @ 20°C | [5] |
Ultimate tensile strength | 210–390 MPa | [6] |
Young’s modulus | 120 GPa | [6] |
Physical properties of pure bulk copper.
The electrical conductivity of copper and its alloys is often given relative to a copper wire test sample (international annealed copper standard, IACS) which was established in 1914. For comparison, 100% IACS is defined as 58×106 S/m at 20 °C, while the absolute maximum electrical conductivity measured for pure copper (Cu-ETP-1 or Cu-OF-1) is 58.58×106 S/m at 20°C (referring to 101% IACS). Thus, some electrical conductivity values may also exceed 100% IACS [7]. For pure copper (99.999%) value is 103.06% IACS and for pure silver it is 106% IACS [2].
The absorptivity of electromagnetic radiation into the material is wavelength-dependent. For all materials, the absorptivity generally increases with smaller wavelengths (Figure 1). For copper as a reflective material, there is a huge increase in absorptivity at 515 nm (green wavelength) compared to 1064 nm (infrared wavelength). This can be used for laser-based AM processes to change the laser source to smaller wavelengths to increase the absorptivity, thus energy can be transferred more effectively resulting in higher efficiency.
Absorption of different solid metals. Data extracted from Spisz et al. [
To mitigate the low absorptivity in the infrared region, higher laser power can be used. Recently this approach become more attention due to the well-developed system technology, especially for big build sizes. However, the higher energy input into the powder bed can lead to smaller processing windows.
While the absorptivity of copper does not affect the sintering capabilities of the copper powder, binder jetting and metal fused filament fabrication can be well compared to other powder metallurgical processes since a sintering step is clearly necessary to obtain functional metallic parts. For powder metallurgy of pure copper, the Copper Development Association Inc., an industrial board for copper, copper alloys, and their applications, mentions that “it is impractical to achieve a density of 8.94 g/cm3 by pressing and sintering alone” [9]. To achieve high density, in classical powder metallurgy, non-spherical powders are used and pressure for compaction of 207–248 MPa is recommended. Pre-compaction at higher pressures of up to 730 MPa can further increase the sintered density of simple geometries up to 97.6% [10] but might be impractical for parts that are more complex. The sintering density of the parts is then a function of sintering time and temperature, as shown in Figure 2. To show a more recent example, hot pressing of copper for 4 minutes at 600, 700, and 800°C at 50 MPa resulted in density values between 97.9 and 99.1% [11]. Interestingly, also at the highest measured density, electrical conductivity was corresponding to 90.2% IACS. This example may illustrate, that even achieving high physical density is still no guarantee to achieve high electrical conductivity, too. Besides pressurized sintering, also sintering atmosphere or other modifications are mentioned to influence the sintering activity positively, as the use of reactive gases ore use of powders having a thin oxide layer.
Dependency of physical density from sintering temperature and time for copper powder compacts [
Ott et al. investigated the heat conductivity of pressureless sintered Cu-powders and analyzed the influence of residual porosity, but also elemental impurities on that physical parameter and backed their analysis with simulated data. The conclusion of that study was, that impurities, especially Fe, cause a stronger depression of thermal conductivity than pores. According to that group, porosity of 2–5% causes loss of 10 W/mK, while 200 mg/kg Fe cause ~40 W/mK [12]. Due to the connection between thermal and electrical transport, known as Wiedemann–Franz law, also the electrical conductivity is strongly affected by impurities (Figure 3).
Relation between electrical conductivity and concentration of impurities [
During processing, oxygen from the ambient atmosphere or processing gas is the main contaminant. Fortunately, its effect on the conductivity is relatively small compared to other elements. However, using high-quality process gas (e.g. Argon with 99.999% purity) is highly recommended. Electrolytic-tough Pitch copper is allowed to have max. 400 ppm of oxygen. During LPBF processing we did not observe an additional rise in oxygen content for oxygen levels of 100 ppm in the processing gas during printing.
Ambient control with LMD is more challenging since normal shielding gas is often not enough to protect the part from oxidizing. Especially hot sections outside the working zone. Reasons are turbulences in the shielding gas stream down to the part. Technical solutions, such as a dedicated modular gas-shielding unit (e.g. COAXshield), showed good efficiency for Ti4Al4V but have to be verified for copper.
During the sintering of BJ and M-FFF parts, one can utilize hydrogen gas for the reduction of oxides and binder residue. However, during debinding carbon can potentially dissolve in copper causing a decrease in electrical conductivity.
Jadhav et al. showed (here in the case of nanoparticle addition for LPBF) that small impurities of 0.055 wt.-% carbon in the printed part can also reduce the electrical conductivity to 22.7 ×106 S/m (or 39.2% IACS) [14]. This explains the relatively lower electrical conductivity of binder-based sinter processes where complete binder burnout is often difficult to achieve.
Laser powder bed fusion is an AM process with the following repeating process steps—metal powder particles are spread evenly onto a substrate with a recoating system, then a laser source selectively melts the metal powder with specified parameters according to a previously prepared computer file with scanning strategy and laser parameters, such as laser powder, scanning velocity, and distance of single scanning tracks. Then the substrate plate is lowered by a specific layer thickness, a new powder layer is spread, and the process is repeated until the part is finished. Commercially available systems range in build volume, maximum laser power, amount of used laser sources, and laser type. Since the absorption of pure copper is poor in the infrared wavelength and commonly, LPBF machines were equipped with infrared fiber lasers, the processing of pure copper with LPBF was challenging in the past [15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25]. The energy input into the material was insufficient for complete melting leaving a lack of fusion defects. The highest achievable density for pure copper parts when using a common 200 W infrared laser source was 83–88% [23, 24]. There have been two approaches in LPBF of pure copper to increase the density and subsequently the electrical conductivity—increase the infrared laser power to above 1 kW or switch to a green laser source. Colopi et al. and Ikeshoji et al. [19, 25] have used infrared laser powers of 1 kW and were able to increase the relative densities to 99.1 and 99.6%. However, melt-pool instabilities were observed due to the high difference in absorptivity in the solid and molten state of the pure copper which led to parts with low surface quality. Also, the high reflectivity can harm the optic system of the machine. TRUMPF has released an LPBF machine with an integrated green laser and could prove that high electrical conductivity can be achieved with such a system around 100% IACS [26]. With this machine, complex-shaped pure copper parts can be manufactured with high quality regarding density and electrical conductivity, and therefore, the technology is now ready to produce parts for various applications.
At Fraunhofer IWS such a TruPrint1000 Green Edition machine, equipped with a TruDisk1020 frequency-doubled laser emitting 515 nm wavelength, is available since mid-2020. The characteristics of the laser machine include a maximum laser power of 500 W, a spot diameter of 200 μm and a build volume of 100 mm diameter with 100 mm build height. Ongoing research concentrates on the following:
process parameter development for pure copper and copper alloys to increase the build rate while maintaining the high part quality, such as density and electrical conductivity
different post-processing techniques and their effects on surface quality and geometrical accuracy
pure copper and copper alloy applications
The density of pure copper parts is above 99.5% and the electrical conductivity was proven to be above 100%IACS. The oxygen content in the final part is below 400 ppm.
As can be seen in Figure 4, the surface quality shows the high roughness of the pure copper parts. Therefore, the surface needs smoothening. With two benchmark geometries developed by Fraunhofer IWS (Figure 5) specific feature sizes and overhang angle roughness can be analyzed via 3D scan and tactile measurements. The effect of different post-processes, such as sandblasting, abrasive flow machining, or chemical processes, such as plasma or electropolishing can improve the surface quality. However, material removal can be irregular, and therefore the process itself and applied parameters must be adapted to each geometry and particular application (Figure 5).
Microsection of a density cube of pure copper (left), etched microstructure in the x-z axis (right) ©IWS.
Benchmark for resolution and different features (left), benchmark for overhang angles (right) ©IWS.
Currently, possible applications investigated are components for the nuclear accelerator community, such as radiofrequency quadrupoles or nozzle geometries for laser metal deposition. Individualized inductor coils are also a field predestined for AM (Figure 6).
Example of pure copper inductor coil geometry ©IWS.
Laser metal deposition (LMD) is an AM process that is assigned to the DED processes. Laser metal deposition is a well-established technology for coating and repair of metal components for more than a decade. Recently, it has been utilized for manufacturing metallic parts from micro to macro scale without any support structures. Compared to the well-known powder bed fusion process, LMD enhances manufacturing possibilities to overcome AM-specific challenges such as process inherent porosity, minor build rates, and limited part size. Moreover, the advantages aforementioned combined with conventional machining enable novel manufacturing approaches in various fields of applications.
For small and filigree additive manufactured components, LPBF is usually considered due to the freedom of design and short-lead times [27]. However, even this innovative technology has manufacturing constraints, such as the need for support structures or high build-up times. That affects cost efficiency and process stability. In contrast to powder bed processes or competing direct methods (e.g. WAAM and EBAM), additive manufacturing via powder LMD provides
support-less manufacturing (cf. PBF),
high productivity (cf. PBF),
high flexibility due to local shielding (cf. PBF, EBAM),
precise energy input—beneficial microstructure (cf. WAAM, EBAM),
low porosity—HIP not needed (cf. PBF) and
hybrid manufacturing in one machine (cf. PBF, EBAM)
That makes this technology suitable for the realization of high-performance component designs. Besides, a further advantage of LMD is that conventionally manufactured semi-finished parts can be used adding new features via LMD. This approach decreases manufacturing time and potentiates the advantages of hybrid AM processes. Hence, powder LMD has been established in several branches, e. g. aerospace, medical, or tooling industry for the production of components for jet engines, implants, or drilling tools [28]. To deposit material on a substrate, the powder material is blown into the process zone by a nozzle, partially preheated in the laser beam, and finally reabsorbed in the laser as illustrated in Figure 7.
Principle of laser metal deposition (LMD) using powder ©IWS.
During the manufacturing process, the bulk material is melted using a laser as a heat source and powder is transported via a carrier gas, like helium or argon [29], into the melting pool using a coaxial nozzle. The powder interacts there with the melting pool and gets absorbed to manufacture the desired part. To fully absorb the powder into the melting pool minimal energy is needed, which can be called line energy. The Marangoni effect causes a strong melt pool movement, which is driven by the surface tension of the melt and leads to a strong mixing of the filler (powder) and part of the substrate material [30]. That also results in potential pores being discharged, improved density, and increased building rates. The subsequent formation of a certain microstructure during solidification is mainly driven by the material selection and the local and temporal gradient, which is affected by process parameters, material, and boundary conditions. When the powder is deposited, heat transfer through prior layers can result in an additional modification of the microstructure.
By tailoring energy input and distribution as well as powder particle size, a wide range of materials could be applied even on various substrate materials (e.g. Stellite on Inconel 718, Brass on Steel, Al2O3 on Al-Alloy) [31, 32]. However, the processing of pure copper using established infrared laser sources has been associated with major challenges. Low absorptivity ends up in a lack of fusion and high porosity [33]. High reflection can damage the laser source or may cause overheating of applied nozzles.
The use of green (495–570 nm) and blue (~445 nm) laser sources can increase the laser absorption of pure copper by a factor of 10 [34].
Specialized processing heads enable dense cooper parts manufactured on substrates, as well as complex prototypes [28, 35, 36].
Moreover, in contrast to powder bed-based additive manufacturing, LMD enables hybrid manufacturing (additive, subtractive) approaches and multi-material processes. Various powders could be applied, exchanged, and mixed
Laser Metal Deposition with a green laser to build up multi-material mold inserts (pure Cu/steel 1.2764) ©IWS.
Binder Jetting of pure copper has been intensively studied by Virginia Polytechnic Institute and State University. The main question of this research was how to increase the physical density of copper parts produced by binder jetting. Different approaches to achieve high density were taken under investigation of the influence of particle size of the feedstock (D50 = 15 μm or 75 μm) [38], including bimodal powder compositions [39] where a small fraction of very fine powder should fill up the spaces between the larger particles. Different sintering atmospheres (Ar and H2) were also part of the analysis. Modified binders were investigated, comprising MOD (metal–organic decomposition) inks [40] and nanoparticle [41] enhanced binders. The expectation for the latter both approaches is that introduction of nanoparticles will decrease the temperature for the sintering process to start, but also introduce additional copper into the green body. Also, the influence of HIP post-treatment was investigated [42]. For all the previously described experiments sintering temperature was quite high 1075–1080°C compared to the theoretical melting point of copper 1084°C. Dwell time was varied between 2–10 h, most sintering regimes employed H2 as reducing atmosphere.
The following Table 2 sums up the results of that group.
Use of powder with D50 = 15 μm in comparison to D50 = 75 μm leads to 85.5 % instead of 63.2% of the theoretical density of copper, applying a 4 h @ 1080°C sintering regime | [38] |
Using bi modal powders (30 μm + 5 μm with a mixing ratio of 17% + 73% respectively) results in a density of 92.3%. All bimodal compositions show significantly less shrinkage | [39] |
By using HIP treatment of test samples from bimodal powders, the density could be further increased to 99.7%. | [42] |
Using Metal-Organic-decomposition inks, the part density of the core section could be increased. The overall density however was lower as 73.3% in comparison to non-modified binder (80.8%). | [40] |
By using nanoparticle loaded inks, the sintered part density is 86.1% compared to 80.9%, when using a neat binder, | [41] |
Use of fine copper powders (~5 μm) with new recoating equipment. | [43] |
Effect of different approaches by the Virginia polytechnic group on the relative density of BJ copper parts.
Additionally, the same group published work using a copper feedstock that incorporates a foaming agent introduced by mechanical milling for modification of the porosity of printed parts [44].
It should be also mentioned that companies, active in the development of binder jetting machines, try to qualify materials to be processed on their equipment. Currently, DigitalMetal [45] and ExOne [46] have announced qualified processes with pure copper for applications, such as antennas, heat exchangers, and windings for electric drives.
To further investigate the influence of bimodal powder compositions on the electrical properties of binder-jetted parts, two powder feedstocks were selected, printed, and compared regarding the final part electrical conductivity at IWS. The powders were a monomodal and a bimodal composition, the latter consisted of 73% coarse and 27% fine powder. The powder size distribution of the feedstock is shown in Table 3.
Powder | D10 [μm] | D50 [μm] | D90 [μm] |
---|---|---|---|
m4p PureCu.04 | 3 | 8 | 15 |
m4p PureCu1.0 | 18 | 26 | 38 |
D10, D50, and D90 of the fine (m4p PureCu.04) and coarse powder (m4p PureCu1.0).
Parts were printed on an ExOne binder jetter (model MFlex). After optimizing the parameters of roller speed, roller transverse speed, layer thickness, and binder saturation, a set of flat samples (25 × 25 × 1 mm3) and cubes (10 × 10 × 10 mm3) for measuring electrical conductivity, physical density, and dilatometry were printed. Although the focus was on the influence of the powder composition, also three different dwell times for sintering, and two different layer thicknesses during printing were compared. The density is analyzed by standard metallography, the electrical conductivity is measured by the eddy current test method (Sigmascope 350, Karl-Fischer), and the dilatometry was done with a DIL 402 Expedis Classic (Netzsch). As expected, longer dwell times lead to higher conductivity (Figure 9). The achieved maximum is found at 84.7% IACS for the bimodal powder and a layer thickness of 80 μm, while for the same configuration the monomodal sample led to 52.6%. For all sintering times, samples made of bimodal powder delivered better conductivity. The observation for the influence of layer thickness is that for monomodal powders, 50 μm leads to the same or slightly better results, while for the bimodal configuration the better values are found for 80 μm. Though, at 12 h that difference disappears.
Graph showing the relation between sintering time and electrical conductivity for mono- and bimodal feedstock and different layer thicknesses during the printing process.
The differences between the mono and bimodal powder distribution are apparent in Figure 10. The shrinkage of the mono (black) and bimodal (green) sample over the time of the applied temperature profile during sintering is shown. The plots do not contain any compensation for thermal expansion. Two main information can be extracted from the dilatometer experiment. First, the overall shrinkage for the bimodal powder is much lower (12.4%) than for the monomodal powder (17.3%). Second, the onset temperature for begin of shrinkage is ~37 K less for the bimodal powder at 987.5°C.
Dilatometer plot, comparing shrinkage of mono and bimodal samples during the debinding and sinter profile.
In Figure 11, two etched cross sections of bimodal samples, sintered for 2 h (left) and 12 h (right) are shown. After 2 h of sintering, the density is clearly still low as it seems necking is just about to begin. After 12 h instead, a quite dense microstructure can be seen, nonetheless showing a lot and partially also quite large (> 50 μm) pores at the grain boundaries.
Metallographic comparison of 2 h (left) and 12 h (right) sintering at 1080°C of bimodal samples.
One of the main challenges in binder jetting obviously remains to achieve high sintered density since compaction of parts is not possible as in classic press and sinter processes. Bimodal powder compositions enhance green part density and stability, lead to higher sintered density, earlier sintering activity, and in the case of copper better electrical conductivity.
The sinter activity of shown samples is clearly low, as for comparison from Figure 2 after 2 h about 90% relative density should be achievable in classic press and sinter. Using bimodal powder compositions seems to be one possible way to tackle that challenge even though 12 h sintering time is still very long. Possible reasons for the poor sintering activity might be insufficient powder bed compaction during the printing process, an incomplete debinding process, or sinter impeding surface oxides on the copper particles.
Fused filament fabrication (FFF) belongs to the extrusion-based AM technologies. It was usually used for printing polymers, such as Acrylonitrile butadiene styrene (ABS) or Polylactide (PLA) [47], and became the most used AM technology worldwide due to its user-friendly handling [48, 49]. During the printing process, a filament is melted in a print head and extruded onto a build platform [50]. Layer after layer of molten filament is added to create a prototype or product. A sketch of the overall concept is shown in Figure 12.
Schematic representation of fused filament fabrication method [
Today, FFF is well established in many industries, such as the automotive sector [51, 52], in aviation (Airbus) [53], and the medical sector (printing biomedical implants, scaffolds, or other applications) [54]. The cost-efficiency of the FFF process suggested using FFF beyond polymers also for printing other materials.
Meanwhile, the upcoming metal FFF has demonstrated its capability in manufacturing sophisticated structures through a variety of materials [55, 56, 57, 58, 59]. Besides stainless steel (17-4PH) or titanium alloy (Ti6Al4V) [55, 60, 61, 62, 63], Fe-parts for electrical engines or glass-ceramic scaffolds for medical application were printed [64]. Recently was published a multi-material approach by printing and sintering 17-4PH and ZrO2 together [65, 66].
During the process, a filament based on a polymer-binder, containing thermoplastic polymers [55, 56], infiltrated with metal powder, is fed into a print head where the binder is melted, and the material is extruded onto a building platform (Figure 13). After having printed, a so-called green-part layer-by-layer, a catalytic debinding step or solvent debinding step is required for removing a certain fraction of the binder. The solvent debinding step creates pores in the green part. These pores allow gases to escape during the thermal debinding of the remaining binder in a furnace. The polymer that remains after solvent debinding, stabilizes the structure as backbone until sintering of the particles takes place. The thermal debinding of the backbone by pyrolysis is crucial because escaping gases can cause deformations and cracks.
FFF process, left to right: shaping the part by deposition of filament; two-step debinding process involving solvent extraction and thermal decomposition; finally sintering in a furnace, after [
The part shrinks during sintering usually around 13–20% in x-, y- and z-direction, which needs to be predicted for near net shape fabrication.
Significant advantages of FFF are as follows:
All kinds of powder materials and even nanoparticles can be utilized
Multi-material can be deposited by using different print heads
Microstructures related anisotropic mechanical behavior can be avoided due to homogeneously sintering [56]
Little investment costs and cost-efficient printing and sintering of metal and ceramic parts at atmospheric pressure
No powder particles are airborne, causing potential health problems for operators.
Additionally, high material throughput (1–10 g/min), material efficiency (no material waste), design freedom for printing even hollow structures, and the competitive material properties make FFF a highly competitive AM technology [56, 57, 65].
Nowadays companies, such as AM Extrusion GmbH [68] or BASF [69] offer an open filaments system for printing and sintering metal parts, such as copper, 316L, 17-4PH, or carbon steels, such as 440C, M2, or H13. Even filaments with unique materials can be prepared exclusively for customers.
Copper filaments by AM Extrusion GmbH (filled with 63 vol.% copper powder) can be printed with a modified BondTech extruder. Nozzle and print bed temperatures are 120 and 70°C. The recommended nozzle is a 300 μm hardened steel nozzle. The standard layer height is 80–200 μm [68]. Using a 300 μm nozzle line, the width is 360 μm and print speed 1000–3000 mm/min.
After solvent debinding in acetone at 45°C and sintering at 950°C in H2, a relative density of 96% can be obtained [68]. The shrinkage during sintering is 13% in x-, y-, z-direction. A final part accuracy of < ± 80 μm can be obtained [68]. Material properties of FFF printed Cu and printed parts are shown in Figure 14.
(left) Properties of FFF printed copper measured by accredited test laboratory, (middle) cross section of sintered copper (@950°C, 90 min, H2), (right) sintered copper robot gripper [
Compared to powder-bed technologies, FFF is safe and user-friendly. During the FFF process, no powder can be airborne, which may cause health issues for employees. In general, FFF is capable of manufacturing medium-sized complex metal and ceramic structures in small serial production.
Additive manufacturing of copper is emerging and additive fabrication methods, such as laser powder bed fusion, laser metal deposition, binder jetting, fused filament fabrication, or electron beam melting become more refined.
Recently, it is possible to fabricate complex copper parts with an electrical conductivity of 100% IACS. In addition, the fabrication of hybrid material parts, including copper, is possible. Thus, additive manufacturing of pure copper keeps up and excels conventional manufacturing methods in terms of geometrical complexity.
Due to its unique properties, copper is primarily used for electrical or thermal applications. Already realized use cases are components for electric vehicles by LPBF [70], cooling sockets for milling tools by FFF [71], or a horn waveguide antenna [72].
Also increased research interest in found in the manufacturing of complex propulsion systems, such as aerospike thrusters, made from alloyed copper [73].
Further, printed heat sinks, heat pipes, and complex coils are already demonstrated.
Further improvements, especially impeccable material properties in combination with new fabrication approaches, are pursued. For instance, the modification of the copper powder feedstock with a coating of metal oxides or metal hydroxides (approx. 5–30% coverage) increases the absorptivity, especially when using standard infrared laser sources [74].
Another approach to utilize infrared lasers for the processing of pure copper is to use high laser power of 600–1000 W. Researchers from Politecnico di Milano achieved a density of ~ 97% using a 600 W laser on pure copper [75]. Yet this approach, in contrast to using green laser sources, has the advantage of using bigger build chambers. However, this advantage will disappear, since bigger LPBF setups with green laser sources are under development.
In addition, polymeric coatings of copper powder are under development for use in selective laser sintering machines. This process is advertised as cold metal fusion (or Metal SLS). Using this approach, lower laser powers are necessary to consolidate the powder, since only the polymer coating will be molten and sintered. Further, the commonly used infrared lasers can be used effectively. The printed part, however, needs to undergo a thermal sintering step though, comparable to binder jetting or FFF, to burn out the polymer and sinter the metal powder together [76].
All Authors declare that there is no conflict of interest.
This research was conducted within the High-Performance Center »Smart Production and Materials« and partially funded by the Fraunhofer-Gesellschaft, the German Federal Ministry of Education and Research and the State of Saxony.
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Completed the Course Medical Mycology, the Centraalbureau voor Schimmelcultures (CBS), Fungal Biodiversity Centre, Netherlands (2006). International Union of Microbiological Societies (IUMS) Fellow, and International Emerging Infectious Diseases (IEID) Fellow, Centers for Diseases Control and Prevention (CDC), Atlanta, USA. Diploma of Dermatological Scientist, Japanese Society for Investigative Dermatology. Ph.D. of Juntendo University, Japan. Bachelor’s and Master’s degree, Medicine, West China University of Medical Sciences. Chair of Sichuan Medical Association Dermatology Committee. General Secretary of The 19th Annual Meeting of Chinese Society of Dermatology and the Asia Pacific Society for Medical Mycology (2013). In charge of the Annual Medical Mycology Course over 20-years authorized by National Continue Medical Education Committee of China. Member of the board of directors of the Asia-Pacific Society for Medical Mycology (APSMM). Associate editor of Mycopathologia. Vice-chief of the editorial board of Chinses Journal of Mycology, China. Board Member and Chair of Mycology Group of Chinese Society of Dermatology.",institutionString:null,institution:{name:"Sichuan University",institutionURL:null,country:{name:"China"}}},editorTwo:null,editorThree:null},{id:"5",title:"Parasitic Infectious Diseases",coverUrl:"https://cdn.intechopen.com/series_topics/covers/5.jpg",isOpenForSubmission:!0,editor:{id:"67907",title:"Dr.",name:"Amidou",middleName:null,surname:"Samie",slug:"amidou-samie",fullName:"Amidou Samie",profilePictureURL:"https://mts.intechopen.com/storage/users/67907/images/system/67907.jpg",biography:"Dr. Amidou Samie is an Associate Professor of Microbiology at the University of Venda, in South Africa, where he graduated for his PhD in May 2008. He joined the Department of Microbiology the same year and has been giving lectures on topics covering parasitology, immunology, molecular biology and industrial microbiology. 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His research interests involve understanding the molecular mechanisms of host defense during human viral infections and developing new predictive, preventive, and therapeutic strategies for them using Japanese encephalitis virus (JEV), HIV, and emerging viruses as a model via stem cell and cell culture technologies. His research work has been published in various high-impact factor journals (Science, PNAS, Nature Medicine) with a high number of citations. He has received many awards and honors in India and abroad including various Young Scientist Awards, BBSRC India Partnering Award, and Dr. JC Bose National Award of Department of Biotechnology, Min. of Science and Technology, Govt. of India. 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Saxena is a vice dean and professor at King George's Medical University, Lucknow, India. His research interests involve understanding the molecular mechanisms of host defense during human viral infections and developing new predictive, preventive, and therapeutic strategies for them using Japanese encephalitis virus (JEV), HIV, and emerging viruses as a model via stem cell and cell culture technologies. His research work has been published in various high-impact factor journals (Science, PNAS, Nature Medicine) with a high number of citations. He has received many awards and honors in India and abroad including various Young Scientist Awards, BBSRC India Partnering Award, and Dr. JC Bose National Award of Department of Biotechnology, Min. of Science and Technology, Govt. of India. 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He is a vice-president of the Latin American Society for Travel Medicine (SLAMVI) and a Member of the Council of the International Society for Infectious Diseases (ISID). Since 2014, he has been recognized as a Senior Researcher, at the Ministry of Science of Colombia. He is a professor at the Faculty of Medicine of the Fundacion Universitaria Autonoma de las Americas, in Pereira, Risaralda, Colombia. He is an External Professor, Master in Research on Tropical Medicine and International Health, Universitat de Barcelona, Spain. He is also a professor at the Master in Clinical Epidemiology and Biostatistics, Universidad Científica del Sur, Lima, Peru. In 2021 he has been awarded the “Raul Isturiz Award” Medal of the API. Also, in 2021, he was awarded with the “Jose Felix Patiño” Asclepius Staff Medal of the Colombian Medical College, due to his scientific contributions to COVID-19 during the pandemic. 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He obtained a Master’s degree in Public Health and PhD in Public Health and Epidemiology. He has a background in Clinical Medicine and has taken courses at higher diploma levels in public health from University of Transkei, Republic of South Africa, and African Medical and Research Foundation (AMREF) in Nairobi, Kenya. Dr. Kasenga worked in different places in and outside Malawi, and has held various positions, such as Licensed Medical Officer, HIV/AIDS Programme Officer, HIV/AIDS resource person in the International Department of Diakonhjemet College, Oslo, Norway. He also managed an Integrated HIV/AIDS Prevention programme for over 5 years. He is currently working as a Director for the Health Ministries Department of Malawi Union of the Seventh Day Adventist Church. Dr. Kasenga has published over 5 articles on HIV/AIDS issues focusing on Prevention of Mother to Child Transmission of HIV (PMTCT), including a book chapter on HIV testing counseling (currently in press). Dr. Kasenga is married to Grace and blessed with three children, a son and two daughters: Happy, Lettice and Sungani.",institutionString:"Malawi Adventist University",institution:{name:"Malawi Adventist University",institutionURL:null,country:{name:"Malawi"}}}]}]},openForSubmissionBooks:{},onlineFirstChapters:{},subseriesFiltersForOFChapters:[],publishedBooks:{},subseriesFiltersForPublishedBooks:[],publicationYearFilters:[],authors:{}},subseries:{item:{},onlineFirstChapters:{},publishedBooks:{},testimonialsList:[]},submityourwork:{pteSeriesList:[],lsSeriesList:[],hsSeriesList:[],sshSeriesList:[],subseriesList:[],annualVolumeBook:{},thematicCollection:[],selectedSeries:null,selectedSubseries:null},seriesLanding:{item:null},libraryRecommendation:{success:null,errors:{},institutions:[]},route:{name:"chapter.detail",path:"/chapters/64075",hash:"",query:{},params:{id:"64075"},fullPath:"/chapters/64075",meta:{},from:{name:null,path:"/",hash:"",query:{},params:{},fullPath:"/",meta:{}}}},function(){var e;(e=document.currentScript||document.scripts[document.scripts.length-1]).parentNode.removeChild(e)}()