Open access peer-reviewed chapter

Thermoelectric Cooling

Written By

Raghied M. Atta

Submitted: October 15th, 2017 Reviewed: February 21st, 2018 Published: July 11th, 2018

DOI: 10.5772/intechopen.75791

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In this chapter, design and analysis study of thermoelectric cooling systems are described. Thermoelectric (TE) cooling technology has many advantages over the conventional vapor-compression cooling systems. These include: they are more compacted devices with less maintenance necessities, have lower levels of vibration and noise, and have a more precise control over the temperature. These advantages have encouraged the development of new applications in the market. It is likely to use TE modules for cooling the indoor air and hence compete with conventional air-conditioning systems. These systems can include both cooling and heating of the conditioned space. In order to improve the performance of the TE cooling systems, the hot side of the TE should be directly connected to efficient heat exchangers for dissipation of the excessive heat. Finally, TE cooling systems can be supplied directly by photovoltaic to produce the required power to run these cooling systems.


  • thermoelectric coolers
  • heat transfer
  • heat exchangers
  • thermal modeling
  • cooling performance
  • solar power

1. Introduction

There are three main types of cooling systems used in air conditioners and refrigerators; each has its own advantages and disadvantages [1]. Air conditioners, however, have better performance than refrigerators as only a smaller temperature difference than refrigerators is required [1]. Vapor compression coolers have a high coefficient of performance (COP) and high cooling capacities. However, they have a noisy operation and use refrigerants with high global warming potential (GWP) such as R134a. R513A is a lower GWP alternative of R134a; however, it generally reduces the COP of the cooling systems [2]. Absorption coolers have moderate values of COP with the advantage of recovering waste heat. However, such systems are usually heavy and bulky. Thermoelectric (TE) coolers are portable with no noise, but they have relatively low COPs. Various studies on thermoelectricity have examined its operation with power directly supplied by photovoltaic to produce the required electricity to run the cooling systems [3, 4]. The electrical current supplied by photovoltaic which is consumed by TE devices, is a direct current so that no DC/AC inverter is required.

Using TE modules, several researchers reported cooling small volumes such as submarines [5]. TE modules have been proposed to be used in building applications using active building envelopes [6, 7]. Such studies underlined the promising future of the TE modules in cooling applications.

General comparison between these three types of coolers for air conditioners is shown in Table 1 [8].

Table 1.

Comparison between the three types of coolers for air conditioners.

Recent studies provide two possible directions that can lead to considerable progress in TE cooling [3]:

  1. improving intrinsic efficiencies of TE materials, and

  2. improving thermal design and optimization of the current available TE cooling modules.

Introducing efficient heat sinks at both the hot and cold side of TE coolers greatly influences the cooling COP. Air cooled heat sink forced convection with fan [9, 10], water cooled heat sink [11] and heat sink integrated with heat pipe [12, 13] are frequently employed techniques. This review will focus on the development of TE cooling with great concerns on advances in materials, modeling and optimization approaches.


2. Thermoelectric coolers

When two different metals or semiconductors are connected together and the two connections held at different temperatures, there are many irreversible phenomena that can take place at the same time [14]. These are the Joule effect, Fourier effect, Thomson effect, Seebeck effect and Peltier effect. The Peltier effect is the most interesting among them for TE cooling. If a circuit contains two connections between different conductors or semiconductors, applying a DC volt will cause heat to transfer from one junction to the other. For producing the Peltier effect, semiconductor alloy materials, such as Bi2Te3 and SiGe, are better than metals [15]. The principle of TE coolers utilizing semiconductor Peltier effects is shown in Figure 1. The heat is transferred from the cooled space to the hot-side heat sink through n-type and p-type semiconductor thermoelements which rejects the heat to the environment. The heat flow direction through the semiconductor materials will be reversed if the electric current direction is reversed.

Figure 1.

Principle of thermoelectric coolers utilizing semiconductor Peltier effects.

A typical TE module usually consists of a large number of n-type and p-type bulk semiconductor thermoelements that are connected electrically in series and thermally in parallel and sandwiched between two ceramic plates, as illustrated in Figure 2.

Figure 2.

A conventional thermoelectric module with multiple thermoelements.


3. Applications using thermoelectric coolers

Commercially available TE coolers are used in applications where design criteria of the cooling system include factors such as high reliability, low weight, small size, intrinsic safety for hazardous electrical environments and accurate temperature control. TE coolers are more appropriate for unique applications such as space missions, medical and scientific equipment where low COP is not an apparent disadvantage.

TE cooling devices are used for cooling small volumes, such as portable and domestic refrigerator, portable icebox and beverage can cooler [12, 16, 17, 18, 19, 20, 21], where the cooling requirements are not too high. In general, the COP for both domestic and portable thermoelectric refrigerators is usually less than 0.5, when operating at an inside/outside temperature difference between 20 and 25°C.

Electronic devices like PC processors produce very large amount of heat during their operation which add great challenge to the thermal management as reliable operation temperature for these electronic devices has to be maintained. TE cooling devices have also been applied to scientific and laboratory equipment cooling for laser diodes and integrated circuit chips [22] to reduce the thermal noise and the leakage current of the electronic components where conventional passive cooling technologies cannot fully meet the heat dissipation requirements. For example, cooling CdZnTe detectors for X-ray astronomy between 30 and 40°C can reduce the leakage current of the detectors and allows the use of pulsed reset preamplifiers and long pulse shaping times, which significantly improves their energy resolution. Integrating thin film TE coolers with microelectronic circuits has been implemented using micromachining technology.

TE cooler appears to be especially favorable for automotive applications [23]. Besides the automobile air-conditioning system and automobile mini refrigerators, researchers also utilized TE device to control car seat temperature to either cooling down or heating up [24].

Some researchers are trying to improve thermoelectric domestic air-conditioning systems [25, 26, 27] hoping that these systems can be competitive with the current widely used vapor compression systems. They investigated TE cooling devices for small-scale space’s conditioning application in buildings [26]. A TE cooling unit was assembled and generated up to 220 W of cooling capacity with a maximum COP of 0.46 under the input electrical current of 4.8 A for each module.

Active thermal window (ATW) and transparent active thermoelectric wall (PTA) were also introduced for room cooling application in applications where conventional air-conditioning system is not easy to install [28, 29]. Thermoelectric cooling has also been applied in other occasions, such as generating fresh water [30, 31, 32, 33] and active building envelope system [7, 34].

TE systems can be directly connected to a PV panel. Since TE devices are low voltage driven devices, they can accept a power supplied by PV panel without conversion. This advantage makes TE devices attractive for building air-conditioning applications [27, 30]. This solar cooling technique can reduce the energy consumption and the environmental impact issues raised by conventional refrigeration and air-conditioning systems. Batteries can also be used to store DC voltages when sunlight is available while supplying DC electrical energy in a discharging mode in the absence of daylight. A battery charge regulator is needed to protect the battery form overcharging. Solar thermoelectric can be used in cooled ceiling applications to remove of a large fraction of sensible cooling load. In this case, the TE modules are connected in series and sandwiched between aluminum radiant panels and heat pipe sinks in ceilings [35].


4. Analysis of thermoelectric elements

The basic unit of the TE cooler is the n-type and p-type thermoelements. A bottom-up modeling approach is to construct the model at element level with the assumption that both types of thermoelements are exactly the same but opposite direction of the Peltier-Seebeck effect.

In the cooling mode, the cooling capacity Qc = (mcp)c (Tcout - Tcin), the heat dissipated in the hot-side heat sink Qh = (mcp)h (Thout - Thin), the electric input power W = Qh - Qc, and the cooling COPc can be expressed by:

COP c = Q c W = 1 T hout T hin T cout T cin C r 1 E1

where Tcin is the temperature of the inlet fluid in the cold side of the TE system, Tcout is the temperature of the outlet fluid in the cold side of the TE system, Thin is the temperature of the inlet fluid in the hot side of the TE system, Thout is the temperature of the outlet fluid in the hot side of the TE system, (mcp)c is the thermal conductance of cold side of the TE system, (mcp)h is the thermal conductance of hot side of the TE system, m is the mass rate of the fluid, cp is the specific heat capacity of the fluid and Cr = mc p h mc p c is the heat capacity ratio. In the heating mode, COPh = Q h W = 1 + COPc.

If some of the parameters for TE elements are available, the ideal COPc (COPC,id) and COPh (COPh,id) can be expressed as:

COP C , id = Q c W = α pn T c KR T V 1 2 V V + α pn T E2
COP h , id = Q h W = α pn T h KR T V R + 1 2 V V + α pn T E3

where αpn is the Seebeck coefficient, R is the electrical resistivity, K is the thermal conductivity, V is electrical applied volt and ∆T = ThTc is the temperature difference between the cold and the hot side of thermoelements at the ceramic plate locations.

For the optimum working voltage Vopt and optimum working current Iopt,

V opt = α pn T 1 + Z T m 1 E4
I opt = V opt R = α pn T / R 1 + Z T m 1 E5

The corresponding maximum COPc,d, i.e., COPc,opt, will be;

COP c , opt = Tc T h T c 1 + Z T m T h T c 1 + Z T m + 1 E6

where Tm is the average temperature of the thermocouple defined as:

T m = 1 2 T h + T c E7

Similarly, the optimum coefficient of performance of heating COPh,opt can be expressed as:

COP h , opt = T h T h T c 1 2 1 + Z T m 1 Z T m E8

A comprehensive parameter that described the thermoelectric characteristics is the figure of merit of the thermocouple Z which can be defined as:

Z = α p α n 2 KR min = α pn 2 KR min E9

This parameter can be made dimensionless by multiplying it by T (the average temperature of the hot side and the cold side of the TE module):

ZT = α pn 2 T KR min E10

The value of Z is related only to the physical properties of the thermocouple material. The higher the figure of merit Z for the material, the better the thermoelectric properties it has. The best commercial thermoelectric materials currently have ZT values around 1.0. The highest ZT value reported in research is about 3 at temperature of 550 K [36].

Maximizing Qc and COP can been obtained by optimizing some parameters like the number of thermoelement pairs for each stage and the applied electrical current [37]. For cascaded coolers, the expression for the cooling rate qi per unit area for the ith stage, depending on the COP of the ith stage and on the cooling rate per unit area of the ith stage qI in connection with the heat source, can be presented by [38]:

q i = q i 1 + COP I 1 1 + COP I 1 1 . 1 + COP I i 1 E11

In this context, each stage, that is considered from the heat source to the heat sink, must have a cooling capacity higher than the one in the previous stage. Truly, each stage will reject both the extracted heat from the previous stage and the electrical power supplied to the stage. Theoretical study for internally cascaded multistage TE couples showed that an enhancement of a 25.2% in the maximum COP can be achieved by using cascaded 3-stage TE modules [39]. A 1400 W TE air-conditioning system using multiple TE modules was investigated [40].


5. Development of thermoelectric materials

As shown by the primary criterion of merit, a good thermoelectric material should possess high Seebeck coefficient, low thermal conductivity and high electrical conductivity. However, these three parameters are interrelated; hence they have to be optimized to get the maximized ZT [41, 42]. The changes in these parameters will unlikely lead to a net increase in ZT, since any favorable change in one parameter will be accompanied by an unfavorable change in the other parameters. For instance, if the electrical conductivity is too low, we might like to increase the carrier concentration. However, during increasing the carrier concentration which in turn will increase the electrical conductivity, the Seebeck coefficient will also decrease and the electronic contribution to the thermal conductivity will increase. This dilemma forced the maximum ZT of any thermoelectric material to be held at ZT = 1 for many years [43]. The devices made of these materials were operated at a power conversion efficiency of only 4–5%.

Conventional thermoelectric materials are bulk alloy materials such as Bi2Te3, PbTe, SiGe and CoSb3. Eventually it was determined that the most efficient bulk thermoelectric materials are high carrier concentration alloyed semiconductors. The high carrier concentration results in a good electrical conductivity while optimizing the electrical properties can be achieved by varying the carrier concentration. Transport of phonons (quantized lattice vibrations which carry heat) can be disrupted by alloying, which results in a reduced thermal conductivity. For this approach, it was discovered that good thermoelectric materials are phonon-glass electron-crystal material [44, 45], where high mobility electrons are free to transport charge and heat but the phonons are disrupted at the atomic scale from transporting heat. The recent trend to optimize the thermoelectric material’s performance is achieved by reducing the material thermal conductivity, especially the lattice thermal conductivity [46]. Reducing the lattice thermal conductivity can be achieved by adding low sound velocity heavy elements, such as Bi, Te, and Pb. Examples of commercial thermoelectric alloys include BixSb2_xTe3 at room temperature, PbTe–PbSe at moderate temperature, and Si80Ge20 at high temperature.

A new strategy for high efficiency “phonon-liquid electron-crystal” thermoelectric materials where a crystalline sublattice for electronic conduction is surrounded by liquid like ions was introduced. The results of an experiment performed on a liquid like behavior of copper ions around a crystalline sublattice of Se in Cu2−xSe showed a very low lattice thermal conductivity which increased the value of ZT in this simple semiconductor [47].

The efficiency of TE devices can be further enhanced through nanostructural engineering [44] using two primary approaches: bulk materials containing nano-scale constitutes and nano-scale materials themselves. By the introduction of nanostructures, ZT was pushed to about 1.7 [48] with power conversion efficiency of 11–15%.

Many reviews have summed up progress on thermoelectric materials [49, 50], bulk thermoelectric materials [45] and low-dimensional thermoelectric materials [43, 51, 52]. Low-dimensional materials, including 2-D quantum wells, 1-D quantum wires and 0-D quantum dots, possess the quantum confinement effect of the electron charge carriers that would enhance the Seebeck coefficient and thus the power factor [53]. Furthermore, the introduced various interfaces will scatter phonons more effectively than electrons so that it reduces the thermal conductivity more than the electrical conductivity [18].

Two-dimensional Bi2Te3 quantum well improved ZT due to the enhancement of thermopower [54]. The ZT of Bi2Te3 quantum well structures are estimated to be much higher than its bulk material. The highest ZT observed was 2.4 using Bi2Te3–Sb2Te3 quantum well superlattices with a periodicity of 6 nm [55]. Similarly, the highest ZT value for its bulk material is only 1.1. Quantum-dot superlattices in the PbTe–PbSeTe system were developed under the quantum confinement may lead to an increased Seebeck coefficient and therefore higher ZT [56]. PbSe nanodots were embedded in a PbTe matrix and showed ZT of 1.6, which is much higher than their bulk materials of 0.34 [52]. Serial compound Ag1–xPb18SbTe20 has a high ZT value of 2.2 at 800 K due to the special nanostructure that is still the most competitive TE material [57] and has ignited broad research interest [58, 59, 60, 61]. These new technologies have pushed ZT to 2.4 [62] with predicted increase in the device conversion efficiency to a value between 15 and 20%.


6. Modeling approaches for thermoelectric cooling

Both system cooling power output and cooling COP should be considered for enhancing TE cooling system performance. There are three methods that can possibly lead to this enhancement. First, TE module design and optimization, such as number of thermocouples [63, 64, 65, 66], thermoelement length [67, 68, 69, 70] and thermoelement length to cross-sectional area ratio [71, 72, 73]. Second, cooling system thermal design and optimization [74], which includes investigation of heat sinks’ geometry [75, 76, 77], identification of the heat transfer area and heat transfer coefficients of both hot and cold side heat sinks [78, 79, 80], more effective heat sinks (i.e. heat sink integrated with thermosyphon and phase change material) [16, 81, 82], thermal and electrical contact resistances and interface layer analysis [83, 84, 85]. Third, the TE cooling system working conditions (i.e. electric current input [86, 87, 88]), heat sink coolant and coolant’s mass flow rate [10, 89].

In order to achieve this, a variety of system optimization methods have been adopted. The simplified energy equilibrium model for TE cooler can satisfy many different TE cooling applications including electronic devices cooling and air conditioning [90, 91, 92, 93, 94]. If the TE modules are employed with time-varying temperature distribution and cooling power output, either 1D or 3D transient modeling is needed to better capture the system performance. To capture the module performance, modeling temperature change in all thermoelements is very complicated. Therefore, energy equilibrium model can be applied to simplify the numerical analysis process, especially for those systems which include heat sinks in hot and cold sides.

Positive Thomson coefficient improves TE cooling performance by 5–7% [95], while negative Thomson coefficient reduces cooling performance [96]. However, for commercially available TE coolers, Thomson effect is often small and negligible. Dimensionless analysis is a powerful tool to evaluate the performance of TE cooling system. New dimensionless parameters, such as dimensionless entropy generation number [78], dimensionless thermal conductance ratio and dimensionless convection ratio [64] have been defined.

Both COP and cooling capacity are dependent on the length of thermoelement, and this dependence becomes highly significant with the decrease in the length of thermoelement [97]. As a result, a long thermoelement is preferred to obtain a large COP, while a short thermoelement would be preferable to achieve maximum heat pumping capacity. Therefore, it is obvious that the design of the optimum module will be a tradeoff between the requirements for the COP and the heat pumping capacity. Most commercially available TE modules have thermoelement length range from 1.0 to 2.5 mm. Cooling power density also increases with decreasing the ratio of thermoelement length to the cross-sectional area.

Typical TE modules have a size range from 4 × 4 × 3 mm3 to about 50 × 50 × 50 mm3. The development of micro-TE devices to further reduce the dimensions, that is compatible with standard microelectronic fabrication technology [98], has the potential to improve the microelectronic systems performance, achieve considerable reductions in size and improve the TE devices performance, which opens up new commercial applications.

Electrical and thermal contact resistances, especially thermal contact resistance at the thermoelement interface layer, are critical to achieve a further improvement in both TE cooling capacity and COP [84]. An enhanced formula for the COP of a Peltier module which takes into consideration both the electrical and the thermal contact resistances can be written as [34]:

COP opt = l l + 2 r l c T c T h T c β T h / T c 1 + β r l c l E12


β = 1 + lZT M n + l 1 / 2 , n = 2 R c R , r = k k c , l is the thermoelement length, lc is the thickness of the contact layer, k is the thermal conductivity of the thermoelements, kc is the thermal conductivity of the contact layers and TM = T h + T c 2 .

In addition, an accurate fabrication technique is needed to provide high-quality and high-performance TE modules. The requirements include: precise measurements of the internal resistance for each module at ambient temperature; determination of the module supply leads resistance; consideration of optimum values for voltage and current of each module; verification of thermal efficiency of each module and calculations of temperature difference, maximum cooling capacity according to the measurement results, figure of merit and values of internal resistance [99].

Heat sink performance at the hot side is more important than heat sink at the cold side because the heat flux density at hot side is higher. Allocation of the heat transfer area or heat transfer coefficients between hot and cold sides is particularly important. For given hot and cold side fluid temperatures, there exists an optimum cooling capacity which leads to maximum COP [64, 80, 92].

The COP of TE devices could be improved by minimizing the difference in temperature between their hot and cold faces [100]. The hot side of the TE cooler exhibits very high power densities that demands sophisticated cooling infrastructure with high pumping power.


7. Heat transfer analysis of the heat exchanger

To enhance the heat transfer rate between the hot and the cold fluid flows, heat exchangers are commonly applied in air cooling systems. Relations between the hot and the cold side temperatures as well as the optimum heat transfer surface area can be calculated by applying energy balances to both the hot and the cold sides of the TE modules over a differential area [101].

The heat transfer on the hot side of the TE devices can be increased using cross air flow or counter air flow [102]. The COP of TE devices could be improved by minimizing the difference in temperature between their hot and cold faces while applying appropriate electrical power [100]. A TE system used for cooling or warming airflow with a high COP of 1.5 was reported [93]. To achieve such a relatively high COP, the temperature difference between the hot and the cold faces of the TE modules was maintained at 5°C.

Other favorable working strategies using different heat transfer methods such as liquid cooling with phase change materials were also reported [103]. Theoretical and experimental studies were conducted to examine the performance characteristics of TE water cooling system for electronic cooling applications under small heat loads [11]. A TE liquid chiller was developed with 430 ml capacity and a COP ranged between 0.2 and 0.8 for a temperature of 5–15°C below ambient [104]. A cylindrical, water-cooled heat sink for TE air conditioners was designed and characterized [105]. In this context, a thermosyphon with phase change was developed to improve the thermal resistance of the heat exchanger at the hot side of the TE by 36% [12]. This increased the COP of a TE module by 26% at an ambient temperature of 20°C and 36.5% at 30°C. Using evaporative cooling the COP of TE air-conditioning system was improved by 20.9% [106].

TE devices, as electronic components, do not allow direct contact with coolant. Therefore, instead of pumping coolant directly through TE coolers, channels plate liquid cooling system is used. A channels plate block is a heat conductive metal, such as aluminum or copper, which is filled with channels. The base of the water block is a flat metal surface that is placed directly on top of the hot side of the TE module being cooled using thermal paste to improve transferring the heat between the two surfaces. When the TE hot side heats the block, the liquid coolant absorbs the heat as it flows through all the channels, which will be dissipated through a radiator. The same system can be applied at the cold side for the transfer of the cool due to high thermal resistance between the cold side of the TE and the space being cooled.

Recently, heat transfer in mini channels within heat exchangers is drawing substantial attention trying to improve their performance. The proper selection of channel dimensions and nonuniform distribution of the channels can improve the cooling power [107]. Therefore, thermal and hydrodynamic characteristics of channels need to be examined and developed. A TE system using liquid cooling for electronic application using micro-channel heat sink was proposed and its experimental analysis performance was investigated [108]. The effect of channel width, coolant flow rate and heat sink material on the heat transfer rate was also examined [76].

Although micro-channel heat exchangers are able to dissipate higher heat flux densities, the slow flow rate creates a large increase in the temperature alongside the direction of the coolant flow in both channel material and the coolant. Surface roughness also participates in the heat transfer characteristics and the drop of pressure of coolant flow in a channel. Many studies clearly reported that the roughness has an effect on the flow of the coolant and heat transfer characteristics, in addition to the laminar and turbulent transition [109, 110]. Micro channel heat exchangers with different designs and coolants were manufactured and tested and the experimental results confirmed the superiority of this cooling technique [111, 112].

Heat removal through parallel channels involves a complex combination of convection, conduction and coolant flow. In a rectangular channel plate with width W, height H and length L, taking the advantage of the symmetry of the channels, a unit cell containing only one channel with the surrounding metal is chosen. The results obtained can easily be applied to the whole plate. Heat transport in the unit cell is a conjugate problem that mixes heat conduction in the metal and convective heat transfer to the coolant. The dissipated heat in the surrounding regions conducts to the channel side walls, which is then absorbed, through convection, by the coolant and carried away by the circulation.

These parameters can be summarized by stating them as thermal resistances. Conductive resistance, Rcond, is determined by thermal characteristics of aluminum that conducts the dissipated heat in the region surrounding the sidewalls of the channel. Convection resistance, Rconv, is a result of the convection from sidewalls of the channel to the coolant. Heat resistance, Rheat, is a result of heating up of coolant in the downstream direction as the flow is pushed toward the channel exits. These can be expressed as:

R conv = 1 h A E13

where A is the channel surface area. Assuming that heat is transmitted from all the sidewalls, the surface area will be:

A = 2 L W + H E14

here h is the convective heat transfer coefficient:

h = N u K f D h E15

where Kf is coolant thermal conductivity, Nu is the Nusselt number calculated with the Dittus-Boelter equation [113],

N u = 0.023 P r 0.4 R e 0.8 E16

in which Pr is Prandtl number and Re is Reynolds number. Dh, the hydraulic diameter, is defined as:

D h = 4 cross sectional area perimeter = 4 WH 2 W + H E17

Hence the convective can be expressed as:

R conv = D h 2 N u K f L W + H E18

The heat resistances can be expressed as:

R heat = 1 C p ρ c f E19

where Cp is the coolant specific heat and ρc is coolant density. f is the volumetric flow rate for each channel which is defined as:

f = coolant velocity cross sectional area = v W H E20

The coolant viscosity and thermal conductivity vary according to the temperature [114]. The conductive resistances can be expressed as:

R cond = W k L H E21

where k is the thermal conductivity of the channels plates material.

For fluid dynamical and thermal phenomena that occur in the channels with corrugated walls, different heat transfer characteristics can be observed. Generally, the wall corrugation enlarges the surface of the channels and creates turbulence. However, most studies stated that the rise in temperature of the walls along the direction of the flow is almost linear [115, 116, 117].

Recently, heat sinks with nano-fluid have shown potential to achieve lower thermal resistance [118, 119]. In addition, cooling technologies based on heat removal from the heat sinks using synthetic jet [120], either single-phase or two-phase flow, are noticeable.


8. Conclusions

In this chapter, a short review of technologies related to the TE cooling was presented. The new methodologies of system design and system analysis have enabled the design of high-performance TE cooling systems. This includes the use of the basic physical properties of TE modules and the flow equations to identify the TE cooling design parameters to maximize the COP of the TE cooling systems. To minimize the energy demands in TE cooling systems and increase their energy effectiveness, solar TE cooling technologies such as active building envelope, solar thermoelectric coolers are suggested to be used in zero-energy environments.


  1. 1. Martin A, Bansal P. Comparative study of vapour compression, thermoelectric and absorption refrigerators. International Journal of Energy Research. 2000;24:93-107
  2. 2. Mota-Babiloni A, Makhnatch P, Khodabandeh R. Navarro-Esbrí J:Experimental assessment of R134a and its lower GWP alternative R513A. International Journal of Refrigeration. 2017;74:682-688
  3. 3. Xia H, Luo L, Fraisse G. Development and applications of solar-based thermoelectric technologies. Renewable and Sustainable Energy Reviews. 2007;11:923-936
  4. 4. Le Pierres N, Cosnier M, Luo L, Fraisse G. Coupling of thermoelectric modules with a photovoltaic panel for air preheating and pre-cooling application; an annual simulation. International Journal of Energy Research. 2008;32:1316-1328
  5. 5. Stockolm J, Pujol-Soulet L, Sternat P. Prototype thermoelectric air conditioning of a passenger railway coach. In: 4th International Conference on Thermoelectric Energy Conversion, 10–12 March 1982; Arlington, TX. USA: IEEE. pp. 136-141
  6. 6. Khire R A, Messac A, Van Dessel S: Design of thermoelectric heat pump unit for active building envelope systems. International Journal of Heat and Mass Transfer. 2005;48:4028-4040
  7. 7. Xu X, Van Dessel S, Messac A. Study of the performance of thermoelectric modules for use in active building envelopes. Building and Environment. 2007;42:1489-1502
  8. 8. Riffat S, Qiu G. Comparative investigation of thermoelectric air-conditioners versus vapour compression and absorption air-conditioners
  9. 9. Chang Y-W, Chang C-C, Ming-TsunKe S-LC. Thermoelectric air-cooling module for electronic devices. Applied Thermal Engineering. 2009;29:2731-2737
  10. 10. Cheinv R, Chenv Y. Performance of thermoelectric cooler integrated with microchannel heat sinks. International Journal of Refrigeration. 2005;28:828-839
  11. 11. Huang H, Weng Y, Chang Y, Chen S, Ke M. Thermoelectric water-cooling device applied to electronic equipment. International Communication of Heat and Mass Transfer. 2010;37:140-146
  12. 12. Astrain D, Vian JG, Domınguez M. Increase of COP in the thermoelectric refrigeration by the optimisation of heat dissipation. Applied Thermal Engineering. 2003;23:2183-2200
  13. 13. Atta R. Solar thermoelectric cooling using closed loop heat exchangers with macro channels. Heat and Mass Transfer. 2017;53:2241-2254
  14. 14. Zemansky M, Dittman R. Heat and Thermodynamics. 6th ed. Vol. 1981. McGraw-Hill Book Company. pp. 431-442
  15. 15. Zhao D, Tan G. A review of thermoelectric cooling: Materials, modeling and applications
  16. 16. Min G, Rowe D. Experimental evaluation of prototype thermoelectric domestic-refrigerators. Applied Energy. 2006;83:133-152
  17. 17. Vian J, Astrain D. Development of a thermoelectric refrigerator with two phase thermosyphons and capillary lift. Applied Thermal Engineering. 2009;29:1935-1940
  18. 18. Dai Y, Wang R, Ni L. Experimental investigation and analysis on a thermoelectric refrigerator driven by solar cells. Solar Energy Materials & Solar Cells. 2003;77:377-391
  19. 19. Abdul-Wahab SA et al. Design and experimental investigation of portable solar thermoelectric refrigerator. Renewable Energy. 2009;34:30-34
  20. 20. Dai Y, Wang R, Ni L. Experimental investigation on a thermoelectric refrigerator driven by solar cells. Renewable Energy. 2003;28:949-959
  21. 21. Astrain D, Vian J, Albizua J. Computational model for refrigerators based on Peltier effect application. Applied Thermal Engineering. 2005;25:3149-3162
  22. 22. Mansour K, Qiu Y, Hill C, Soibel A, Yang R. Mid-infrared interband cascade lasers at thermoelectric cooler temperatures. Electronics Letters. 2006;42:1034-1036
  23. 23. Yang J, Stabler F. Automotive applications of thermoelectric materials. Journal of Electronic Materials. 2009;38:1245-1251
  24. 24. Choi H, Yun S, Whang K. Development of a temperature-controlled car-seat system utilizing thermoelectric device. Applied Thermal Engineering. 2007;27:2841-2849
  25. 25. Shen L, Xiao F, Chen H, Wang S. Investigation of a novel thermoelectric radiant air-conditioning system. Energy and Buildings. 2013;59:123-132
  26. 26. Gillott M, Jiang L, Riffat S. An investigation of thermoelectric cooling devices for small-scale space conditioning applications in buildings. International Journal of Energy Research. 2010;34:776-786
  27. 27. Cheng TC, Cheng CH, Huang Z, Liao G. Development of an energy-saving module via combination of solar cells and thermoelectric coolers for green building applications. Energy. 2011;36:133-140
  28. 28. Arenas A, Palacios R, Rodríguez-Pecharromán R, Pagola F: Full-size prototype of active thermal windows based on thermoelectricity. In: Proceedings of ECT2008e6th European Conference on Thermoelectrics, July 24, 2008, O.18.1:O.18.4. Paris, France
  29. 29. Vázquez J, Sanz-Bobi M, Palacios R, Arenas A: An active thermal wall based on thermoelectricity. in: Sixth European Workshop on Thermoelectrics. Freiburg, Germany, Sep 2001
  30. 30. Esfahani J, Rahbar N, Lavvaf M. Utilization of thermoelectric cooling in a portable active solar still – An experimental study on winter days. Desalination. 2011;269:198-205
  31. 31. Rahbar N, Esfahani J. Experimental study of a novel portable solar still by utilizing the heat pipe and thermoelectric module. Desalination. 2012;284:55-61
  32. 32. Milani D et al. Evaluation of using thermoelectric coolers in a dehumidification system to generate freshwater from ambient air. Chemical Engineering Science. 2011;66:2491-2501
  33. 33. Atta R. Solar water condensation using thermoelectric coolers. International Journal of Water Resources and Arid Environments. 2011;1:142-145
  34. 34. Dessel S, Foubert B. Active thermal insulators: Finite elements modeling and parametric study of thermoelectric modules integrated into a double pane glazing system. Energy and Buildings. 2010;42:1156-1164
  35. 35. Liu Z, Zhang L, Gong G, Li H, Tang G. Review of solar thermoelectric cooling technologies for use in zero energy buildings. Energy and Buildings. 2015;102:207-216
  36. 36. Harman T, Walsh M, Laforge B, Turner G. Nanostructured thermoelectric materials. Journal of Electronic Materials. 2005;34:19-22
  37. 37. Cheng YH, Shih C. Maximizing the cooling capacity and COP of two-stage thermoelectric coolers through genetic algorithm. Applied Thermal Engineering. 2006;26:937-947
  38. 38. Goldsmid J. Introduction to Thermoelectricity. Series in Material Science. Berlin Heidelberg: Springer; 2010
  39. 39. Yu J, Wang B. Enhancing the maximum coefficient of performance of thermoelectric cooling modules using internally cascaded thermoelectric couples. International Journal of Refrigeration. 2009;32:32-39
  40. 40. Melero A, Astrain D, Vian JG, Aldave L, Albizua J, Costa C. Application of thermoelectricity and photovoltaic energy to air conditioning. Thermoelectrics, Twenty-Second International Conference on – ICT. 2003:627-630
  41. 41. Zhang X, Zhao L. Thermoelectric materials: Energy conversion between heat and electricity. Journal of Materiomics. 2015;1:92-105
  42. 42. Li J, Liu W, Zhao L, Zhou M. High-performance nanostructured thermoelectric materials. NPG Asia Materials. 2010;2:152-158
  43. 43. Minnich A,Dresselhaus M, Ren Z, Chen G. Bulk nanostructured thermoelectric materials: Current research and future prospects. Energy & Environmental Science. 2009;2:466-479
  44. 44. Snyder G, Toberer E. Complex thermoelectric materials. Nature Materials. 2008;7:105-114
  45. 45. Nolas G, Poon J, Kanatzidis M. Recent developments in bulk thermoelectric materials. Materials Research Society Bulletin. 2006;31:199-205
  46. 46. Dresselhaus M, Chen G, Tang M, Yang R, Lee H, Wang D, Ren Z, Fleurial J, Gogna P. New directions for low-dimensional thermoelectric materials. Advanced Materials. 2007;19:1043-1053
  47. 47. Liu H, Xu F, Zhang L, Zhang W, Chen L, Li Q, Uher C, Day T, Snyder G. Copper ion liquid-like thermoelectrics. Nature Materials. 2012;11:422-425
  48. 48. Hsu KF, Loo S, Guo F, Chen W, Dyck JS, Uher C, et al. Cubic AgPb(m)SbTe(2+m): Bulk thermoelectric materials with high figure of merit. Science. 2004;303:818-821
  49. 49. Alam H, Ramakrishna S. A review on the enhancement of figure of merit from bulk to nano-thermoelectric materials. Nano Energy. 2013;2:190-212
  50. 50. Tritt T. Thermoelectric phenomena, materials, and applications. Annual Review of Materials Research. 2011;41:433-448
  51. 51. Liu W, Yan X, Chen G, Ren Z. Recent advances in thermoelectric nanocomposites. Nano Energy. 2012;1:42-56
  52. 52. Chen Z, Han G, Yang L, Cheng L, Zou J. Nanostructured thermoelectric materials: Current research and future challenge. Progress in Natural Science Material International. 2012;22:535-549
  53. 53. Medlin D, Snyder G. Interfaces in bulk thermoelectric materials a review for current opinion in colloid and interface science. Current Opinion in Colloid & Interface Science. 2009;14:226-235
  54. 54. Hicks LD, Dresselhaus MS. Effect of quantum-well structures on the thermoelectric figure of merit. Physical Review B. 1993;47:12727
  55. 55. Venkatasubramanian R, Siivola E, Colpitts T, O’Quinn B. Thin-film thermoelectric devices with high room-temperature figures of merit. Nature. 2001;413:597-602
  56. 56. Harman T, Taylor P, Walsh M, LaForge B. Quantum dot superlattice thermoelectric materials and devices. Science. 2002;297:2229-2232
  57. 57. Chen N et al. Macroscopic thermoelectric inhomogeneities in (AgSbTe2)x(PbTe)1−x. Applied Physics Letters. 2005;87:171903
  58. 58. Wang H, Li J, Zou M, Sui T. Synthesis and transport property of AgSbTe2AgSbTe2 as a promising thermoelectric compound. Applied Physics Letters. 2008;202106:93
  59. 59. Wang H et al. High-erformanceAg0.8Pb18+xSbTe20Ag0.8Pb18+xSbTe20 thermoelectric bulk materials fabricated by mechanical alloying and spark plasma sintering. Applied Physics Letters. 2006;88:092104
  60. 60. Zhou M, Li J, Kita T. Nanostructured AgPbmSbTem+2 system bulk materials with enhanced thermoelectric performance. Journal of the American Chemical Society. 2008;130:4527-4532
  61. 61. Cai K et al. Preparation and thermoelectric properties of AgPbmSbTe2+m alloys. Journal of Alloys Compoundd. 2009;469:499-503
  62. 62. Pei YZ, Shi XY, LaLonde A, Wang H, Chen LD, Snyder GJ. Convergence of electronic bands for high performance bulk thermoelectrics. Nature. 2011;473:66-69
  63. 63. Jing-HuiMeng X-DW, Zhang X-X. Transient modeling and dynamic characteristics of thermoelectric cooler. Applied Energy. 2013;108:340-348
  64. 64. Lee H. Optimal design of thermoelectric devices with dimensional analysis. Applied Energy. 2013;106:79-88
  65. 65. Huang Y, Wang X, Cheng C, Lin D. Geometry optimization of thermoelectric coolers using simplified conjugate-gradient method. Energy. 2013;59:689-697
  66. 66. He W, Su Y, Wang YQ, Riffat SB, Ji J. A study on incorporation of thermoelectric modules with evacuated-tube heat-pipe solar collectors. Renewable Energy. 2012;37:142-149
  67. 67. Fraisse G, Lazard M, Goupil C, Serrat J. Study of a thermoelement’s behavior through a modeling based on electrical analogy. International Journal of Heat and Mass Transfer. 2010;53:3503-3512
  68. 68. Cheng Y, Lin W. Geometric optimization of thermoelectric coolers in a confined volume using genetic algorithms. Applied Thermal Engineering. 2005;25:2983-2997
  69. 69. Min G, Rowe D. Improved model for calculating the coefficient of performance of a Peltier module. Energy Conversion and Management. 2000;41:163-171
  70. 70. Yazawa K, Shakouri A. Optimization of power and efficiency of thermoelectric devices with asymmetric thermal contacts. Journal of Applied Physics. 2012;111:024509
  71. 71. Zhu W, Deng Y, Wang Y, Wang A. Finite element analysis of miniature thermoelectric coolers with high cooling performance and short response time. Microelectronics Journal. 2013;44:860-868
  72. 72. Sahin A, Yilbas B. The thermoelement as thermoelectric power generator: Effect of leg geometry on the efficiency and power generation. Energy Conversion and Management. 2013;65:26-32
  73. 73. Yang R, Chen G, Snyder G, Fleurial J. Multistage thermoelectric microcoolers. Journal of Applied Physics Junction. 2004;95:8226-8232
  74. 74. Lee H. Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells. USA: John Wiley & Sons; Inc; 2010
  75. 75. Wang C, Hung C, Chen W. Design of heat sink for improving the performance of thermoelectric generator using two-stage optimization. Energy. 2012;39:236-245
  76. 76. Naphon P, Wiriyasart S. Liquid cooling in the minirectangular fin heat sink with and without thermoelectric for CPU. International Communication of Heat and Mass Transfer. 2009;36:166-171
  77. 77. Gao X, Chen M, Snyder G, Andreasen S, Kaer S. Thermal management optimization of a thermoelectric integrated methanol evaporator using a compact CFD modeling approach. Journal of Electronic Materials. 2013;42:2035-2042
  78. 78. Wang X, Yu J, Ma M. Optimization of heat sink configuration for thermoelectric cooling system based on entropy generation analysis. International Journal of Heat and Mass Transfer. 2013;63:361-365
  79. 79. Zhu L, Tan H, Yu J. Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications. Energy Conversion and Management. 2013;76:685-690
  80. 80. Pan Y, Lin B, Chen J. Performance analysis and parametric optimal design of an irreversible multi-couple thermoelectric refrigerator under various operating conditions. Applied Energy. 2007;84:882-892
  81. 81. Qinghai L, Yanjin W, Pengfei Z. A novel thermoelectric airconditioner for a truck cab. In: International Conference on Advances in Energy Engineering (ICAEE), Beijing, China: 19–20 June 2010. IEEE; 2010. p. 178-181
  82. 82. Vian J, Astrain D. Development of a heat exchanger for the cold side of a thermoelectric module. Applied Thermal Engineering. 2008;28:1514-1521
  83. 83. Xuan X. Investigation of thermal contact effect on thermoelectric coolers. Energy Conversion and Management. 2003;44:399-410
  84. 84. Yamashita O. Effect of interface layer on the cooling performance of a single thermoelement. Applied Energy. 2011;88:3022-3029
  85. 85. Silva L. KavianyM: Micro-thermoelectric cooler: Interfacial effects on thermal and electrical transport. International Journal of Heat and Mass Transfer. 2004;47:2417-2435
  86. 86. Cheng C, Huang S, Cheng T. A three-dimensional theoretical model for predicting transient thermal behavior of thermoelectric coolers. International Journal of Heat and Mass Transfer. 2010;53:2001-2011
  87. 87. Zhang H. A general approach in evaluating and optimizing thermoelectric coolers. International Journal of Refrigeration. 2010;33:1187-1196
  88. 88. Taylor R, Solbrekken G. Comprehensive system-level optimization of thermoelectric devices for electronic cooling applications. IEEE Transactions on Components and Packaging Technologies. 2008;31:23-31
  89. 89. David B, Ramousse J, Luo L. Optimization of thermoelectric heat pumps by operating condition management and heat exchanger design. Energy Conversion and Management. 2012;60:125-133
  90. 90. Chein R, Huang G. Thermoelectric cooler application in electronic cooling. Applied Thermal Engineering. 2004;24:2207-2217
  91. 91. Zhang H, Mui Y, Tarin M. Analysis of thermoelectric cooler performance for high power electronic packages. Applied Thermal Engineering. 2010;30:561-568
  92. 92. Zhou Y, Yu J. Design optimization of thermoelectric cooling systems for applications in electronic devices. International Journal of Refrigeration. 2012;35:1139-1144
  93. 93. Cosnier M, Fraisse G, Luo L. An experimental and numerical study of a thermoelectric air-cooling and air-heating system. International Journal of Refrigeration. 2008;31:1051-1062
  94. 94. Seifert W, Ueltzen M, Muller E. One-dimensional modeling of thermoelectric cooling. Physical Status Solidi. 2002;194:277-290
  95. 95. Chen W, Liao C, Hung C. A numerical study on the performance of miniature thermoelectric cooler affected by Thomson effect. Applied Energy. 2012;89:464-473
  96. 96. Lee H. The Thomson effect and the ideal equation on thermoelectric coolers. Energy. 2013;56:61-69
  97. 97. Riffat S, Ma X. Improving the coefficient of performance of thermoelectric cooling systems: A review. International Journal of Energy Research. 2004;28:753-768
  98. 98. Gould C, Shammas N. A review of thermoelectric MEMS devices for micro-power generation, heating and cooling applications. In: Takahata K, editor. Micro Electronic and Mechanical Systems. Croatia: INTECH; 2009. pp. 572-581
  99. 99. Anatychuk L, Varych N, Shchedrin A. Methods and means of precise and rapid determinations of thermoelectric cooling and generating modules parameters. 17th International Conference on Thermoelectrics(ICT98); 18 May 1998; Nagoya, Japan: IEEE; 1998. P. 270-272
  100. 100. Rowe D. CRC Handbook of Thermoelectrics. CRC Press; 1995
  101. 101. Chen K, William G. An analysis of the heat transfer rate and efficiency of TE (thermoelectric) cooling systems. International Journal of Energy Research. 1996;20:399-417
  102. 102. Buist R, Fenton J, Lee J. A new concept for improving thermoelectric heat pump efficiency. In: Intersociety Energy Conversion Engineering Conference; 12–17 September 1976; New York. American Institute of Chemical Engineers; 1976. p. 1619-1622
  103. 103. Riffat S, Omer S, Ma X. A novel thermoelectric refrigeration system employing heat pipes and a phase change material: An experimental investigation. Renewable Energy. 2001;23:313-323
  104. 104. Faraji AY, Goldsmid HJ, Akbarzadeh A. Experimental study of a thermoelectrically-driven liquid chiller in terms of COP and cooling down period. Energy Conversion and Management. 2014;77:340-348
  105. 105. Riffat S, Qiu G. Design and characterization of a cylindrical, water-cooled heat sink for thermoelectric airconditioners. International Journal of Energy Research. 2006;30:67-80
  106. 106. Tipsaenporm W, Lertsatitthanakorn C, Bubphachot B, Rungsiyopas M, Soponronnarit S. Improvement of cooling performance of a compact thermoelectric air conditioner using a direct evaporative cooling system. Journal of Electronic Materials. 2012;41:1186-1192
  107. 107. Shi B, Srivastava A: Cooling of 3D-IC Using Non-Uniform Micro-channels and Sensor Based Dynamic Thermal Management. In: 49th Annual Allerton Conference Communication, Control, and Computing (Allerton);Septemer2011. p. 1400-1407
  108. 108. Khonsue O. Experimental on the liquid cooling system with thermoelectric for personal computer. Heat and Mass Transfer. 2012;48:1767-1771
  109. 109. Kandlikar S, Joshi S, Tian S. Effect of channel roughness on heat transfer and fluid flow characteristics at low reynolds numbers in small diameter tubes. In Proceedings of NHTC’01 35th National Heat Transfer Conference; 10–12 June 2001; Anaheim, California; NHTC01; 2001. p. 12134
  110. 110. Fabbri G. Heat transfer optimization in corrugated wall channels. International Journal of Heat and Mass Transfer. 2000;43:4299-4310
  111. 111. Mudawar I, Bowers MB. Ultra-high critical heat flux (CHF) for subcooled water flow boiling––I: CHF data and parametric effects for small diameter tubes. International Journal of Heat and Mass Transfer. 1999;42:1405-1428
  112. 112. Ravigururajan T, Cuta J, McDonald C, Drost M. Single-phase flow thermal performance characteristics of a parallel micro-channel heat exchanger. In: ASME proceedings of the 31 national heat transfer conference; 3–6 August 1996; Houston, TX. p. 157-166
  113. 113. Kuan C, Sheng I, Lin H, Lin P, Cheng Y, Chuang J, Liu Y, Tseng T, Chen J. Heat-Transfer Analysis of A Water-Cooled Channel for the Tps Front-End Components. In: Proceedings of Subsystems, Technology and Components IPAC2013; 12 to 17 May 2013; Shanghai, China 2013; p. 3466-3468
  114. 114. Meis M, Varas F, Velázquez A, Vega J. Heat transfer enhancement in micro-channels caused by vortex promoters. International Journal of Heat and Mass Transfer. 2010;53:29-40
  115. 115. Knight R, Goodling J, Hall D. Optimal thermal design of forced convection heat sinks-analytical. ASME Journal of Electronic Packaging. 1991;113:313-321
  116. 116. Knight R, Hall D, Goodling J, Jaeger R. Heat sink optimization with application to microchannels. IEEE Trans Components, Hybrids, Manufacturing Technology. 1992;15:832-842
  117. 117. Weisberg A, Bau H, Zemel J. Analysis of microchannels for integrated cooling. International Journal of Heat and Mass Transfer. 1992;35:2465-2474
  118. 118. Nnanna A, Rutherford W, Elomar W, Sankowski B. Assessment of thermoelectric module with nanofluid heat exchanger. Applied Thermal Engineering. 2009;29:491-500
  119. 119. Putra N, Iskandar F. Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment. Experimental Thermal and Fluid Science. 2011;35:1274-1281
  120. 120. Chaudhari M, Puranik B, Agrawal A. Heat transfer characteristics of synthetic jet impingement cooling. International Journal of Heat and Mass Transfer. 2010;53:1057-1069

Written By

Raghied M. Atta

Submitted: October 15th, 2017 Reviewed: February 21st, 2018 Published: July 11th, 2018