Open access peer-reviewed chapter

Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging

By L.C. Tsao

Submitted: April 18th 2011Reviewed: October 23rd 2011Published: March 30th 2012

DOI: 10.5772/33228

Downloaded: 2782

© 2012 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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L.C. Tsao (March 30th 2012). Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging, Corrosion Resistance, Hong Shih, IntechOpen, DOI: 10.5772/33228. Available from:

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