Reliable and high-precision Cu/glass stacks are particularly desirable for microelectromechanical systems and packaging technologies. One solution for improving the adhesion strength of Cu/glass stacks is to form adhesion layers between the Cu films and the glass substrate. Many studies have shown that a strong adhesion layer is formed at the interface by high-temperature annealing when a Cu alloy is used instead of pure Cu. It is important to reduce the temperature and process time in order to reduce the thermal budget and fabrication cost. Therefore, the room-temperature process for fabrication of Cu/glass stack is desirable. In this chapter, typical advanced low-temperature processes including room-temperature process are introduced.
Part of the book: Lead Free Solders