Abhijit Kar

Jagadis Bose National Science Talent Search

Dr. Abhijit Kar received his PhD in Chemistry-Materials Science from Jadavpur University, India. Dr. Kar has carried out his postdoctoral research in different parts of the world e.g. Sungkyunkwan University, South Korea, Swiss Federal Laboratory at Zürich, Switzerland; visiting scientist at Rϋhr Universität, Germany. Dr. Kar has about 17 years of research & teaching experience. His current research interest comprises of Application of Nanotechnology for Advanced Materials. He has worked on different similar and dissimilar materials joining methods & techniques, He is one of the first and pioneer research scientist worked on lead free solder for electronics/microelectronics applications from India. He has developed expertise on Different Materials Characterization Techniques, Mechanical & Functional Property Evaluation of Materials. Dr. Kar has published ~40 research papers in Journals; edited book “Nanoelectronics and Materials Development” and contributed in book chapter on Electron Microscopy. He serves as reviewer of many International Peer Reviewed Journals from Elsevier, Springer. He represented as editorial board member of Journal of Materials Sciences and Applications, American Association for Science & Technology, Journal of Energy and Natural Resources etc.

2books edited

2chapters authored

Latest work with IntechOpen by Abhijit Kar

This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.

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