Encoded instruction format for the Processing Element.
\r\n\t
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He holds two PhDs in Mathematics and Prognostics from the Lebanese University and Aix-Marseille University. His research interests are in the field of mathematics.",coeditorOneBiosketch:null,coeditorTwoBiosketch:null,coeditorThreeBiosketch:null,coeditorFourBiosketch:null,coeditorFiveBiosketch:null,editors:[{id:"248271",title:"Dr.",name:"Abdo",middleName:null,surname:"Abou Jaoudé",slug:"abdo-abou-jaoude",fullName:"Abdo Abou Jaoudé",profilePictureURL:"https://mts.intechopen.com/storage/users/248271/images/system/248271.jpg",biography:"Abdo Abou Jaoudé has been teaching for many years and has a passion for researching and teaching mathematics. He is currently an Associate Professor of Mathematics and Statistics at Notre Dame University-Louaizé (NDU), Lebanon. He holds a BSc and an MSc in Computer Science from NDU, and three PhDs in Applied Mathematics, Computer Science, and Applied Statistics and Probability, all from Bircham International University through a distance learning program. He also holds two PhDs in Mathematics and Prognostics from the Lebanese University, Lebanon, and Aix-Marseille University, France. Dr. Abou Jaoudé's broad research interests are in the field of applied mathematics. He has published twenty-three international journal articles and six contributions to conference proceedings, in addition to seven books on prognostics, pure and applied mathematics, and computer science.",institutionString:"Notre Dame University - Louaize",position:null,outsideEditionCount:0,totalCites:0,totalAuthoredChapters:"4",totalChapterViews:"0",totalEditedBooks:"2",institution:{name:"Notre Dame University – Louaize",institutionURL:null,country:{name:"Lebanon"}}}],coeditorOne:null,coeditorTwo:null,coeditorThree:null,coeditorFour:null,coeditorFive:null,topics:[{id:"15",title:"Mathematics",slug:"mathematics"}],chapters:null,productType:{id:"1",title:"Edited Volume",chapterContentType:"chapter",authoredCaption:"Edited by"},personalPublishingAssistant:{id:"252211",firstName:"Sara",lastName:"Debeuc",middleName:null,title:"Ms.",imageUrl:"https://mts.intechopen.com/storage/users/252211/images/7239_n.png",email:"sara.d@intechopen.com",biography:"As an Author Service Manager my responsibilities include monitoring and facilitating all publishing activities for authors and editors. 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These operations are often very time consuming, particularly when they are executed on conventional serial computers. Every pixel-level processing represents millions of operations when moderate image sizes are considered. These processing stages provide the set of features of interest (object edges, movement, area, shape,…) with a considerable reduction of the data flow to subsequent processing stages. Higher level processing will benefit from such data to produce an abstract description of the scene and, if needed, to make a decision.
In visual processing, a great deal of computation is made on B/W images. This is particularly relevant for intermediate level image processing. Pattern recognition, texture detection and classification, or prediction and estimation of motion, are some examples of operations managing binary data. This fact has motivated an intense research focused on the design and implementation of efficient algorithms dealing with 1-bit data flows.
Traditionally, most of the algorithms in computer vision are executed on general-purpose computers using data from imagers as inputs. Recently, new bioinspired systems integrate together both sensing and processing stages, exploiting the massively parallelism inherent to early vision. These vision systems are usually analog or mixed-signal implementations allowing high density of integration as well as fast computation, with low/moderate accuracy. Often, these systems are not optimized to compute B/W images. Nevertheless, in some practical applications, (e.g., tracking with cellular active contours), the set of operations involving binary images are the main bottleneck from the time performance point of view. Keeping in mind the main constraints featuring integrated circuits: speed, area and reliability; the design of a special unit for binary image processing would be advantageous to be part of a complete computer vision system or even like an independent module.
As for the suitable hardware platform, the ever larger availability of hardware resources and faster clock signals on today FPGAs permit to do image processing with similar time-efficiency to that of custom ASICs from the recent past. Also, the time to market of FPGA-based systems clearly outperforms that of ASICs. Altogether makes FPGAs a good candidate to host proof-of-concept systems or even ended solutions.
In this chapter, a pixel-parallel binary image computer is approached. The architecture consists of a 2D array of processing elements based on the simple instruction and multiple data paradigm. The spatial arrangement allows to associate one processor to one pixel or to a reduced number of pixels of the image and consequently to exploit the inherent parallelism in visual computing. A 48x48 processor array has been implemented and tested on a Xilinx Virtex II FPGA. Several examples of practical applications are included to show the efficiency of the proposed system. In addition, based on the International Technology Roadmap for Semiconductors an estimate of how the increasing integration density will affect both FPGA and ASIC solutions is discussed. From this study, some conclusions about the capabilities of state-of-the-art or near-future generations of FPGA to host processor arrays with practical size are made.
The development of a computer vision application is divided into three stages. In the first,
The mid-level processing steps uses a lower knowledge of the domain of the problem and a significantly lower level of abstraction than the high level vision. In the same way, the data type used also differs. Low and mid-level processing images are represented by arrays, e.g., intensity values, while high level vision only uses the relevant data, usually in a symbolic fashion, greatly reducing the information used. These data represent some kind of knowledge, like the size of an object, its shape or its relationship with other objects. In the mid-level steps, the original image is processed in order to extract these features: segmentation, extraction of the number of objects, their shape, area, etc.
The amount of data to handle is very high, the operations that are performed have low complexity and they are massively parallel in a natural way, unlike what happens during the high level processing. The high computational effort, especially when dealing with high-resolution images or with applications with very demanding time requirements, involves processing millions of data per second. One strategy to tackle this computational power is the parallelization since the processing of each pixel is independent of each other, being this one of the main characteristics of mid-level image processing.
Another strategy to increase the time performance is to have an adequate representation of the data contained in the image arrays. In other words, the fewer the number of bits, the faster the processing. Thus, many algorithms employ gray-scale images instead of a color representation. A more aggressive optimization is to process binary images, i.e., 1 bit per pixel. Binary images are the simplest type of image. They have many other advantages, including easy acquisition, lower storage and transmission requirements and greater simplicity of the algorithms so they are widely used in many industrial and medical applications. It is true that in certain cases, such as the image segmentation in certain environments (Cheng et al., 2001) or the detection and treatment of shadows (Prati et al., 2003), using color images eases the resolution of the problem and can not be used representations in gray-scale or purely binary. However, there are problems that can be solved using only binary images (Szolgay & Tomordi, 1996) (Spiliotis & Mertzios, 1997) (Rekeczky, 1999) (Tseng et al., 2002). Moreover, many algorithms, including those processing color images have modules that use binary images (Garcia & Apostolidis, 2000) (Hsu et al., 2002) (Vilariño & Rekeczky, 2005) (Park et al. 2007).
A binary image can contain two types of information. On the one hand, a scene, i.e., partial information on the intensity of radiation can be stored. This information can come from a binary sensing or a transformation of an image, e.g. a thresholding or a halftoning of a gray-scale image. Furthermore, information contained in a binary image goes beyond shrinking the range to a 1-bit representation. The
The retinal vessel-tree extraction algorithm (Alonso-Montes et al., 2008) is a good example of all the facts mentioned above. This approach is based on active contours, fitting the vessels from the outside. It consists of a controlled region growing started from seeds placed out of the vessels. The first step is a pre-segmentation of the vessels to obtain the guiding information for the active contour and its initial position. Next, the evolution is done. This algorithm was designed to operate in a pixel-parallel fashion. Some of the images, as the retinal image or the guiding information, are gray-scale images. Nevertheless, the contour evolution is performed using binary images because regions, contours, collision points, etc, only need 1 bit for its representation. In addition, as it can be extracted from (Alonso-Montes et al., 2008), the pre-segmentation step consumes the minor part of the computation. This algorithm was implemented in a vision chip (see Section 3) and this step consumes only the 3% of the time of the global computation. As a result, to speedup the computation is needed not only to pay attention to the more complex gray operations as additions or convolutions, but also to the simpler ones because in many algorithms they will limit the performance seriously.
The most straightforward platform to implement a computer vision application is the personal computer. The main advantage of the
A
To meet the high computational cost of computer vision applications it might be necessary to perform the processing steps in the focal plane. A
A
An
Low and medium image processing levels have an inherent high degree of parallelism at algorithmic level. This fact is exploited during the design and implementation of new hardware. The increase in parallelism is now in the leading-edge commercial microprocessors. The inclusion of multiple processor cores can greatly speed up computation. However, this is not enough when we talk about early vision. Moreover, the hardware specialization in floating point units is not fully suitable for image processing.
In a natural way, Single Instruction Multiple Data architecture is able to exploit such a massive parallelism. The creation of small processing units that only have to perform simple calculations in a matrix disposition, where each element of the matrix is associated with a pixel of the image, and with local connections matches the nature of early vision algorithms.
The relationship between the size and the computing power of the processing elements is critical. Small processing units allow bigger arrays at the expense of not being able to perform complex operations. Operations have to be segmented, increasing the number of required clock cycles, but with a higher level of parallelism. However, low complex Processing Elements, PEs, shorten the critical path of the design, decreasing the cycle time, so performance will not be heavily penalized with highly complex PE. In the latter, the level of parallelism is limited but complex operations can be performed easier. The complexity of the hardware and the computational power must be balanced. In the proposed architecture, an effort was made to use the smallest possible processor in order to increase parallelism and to build a large array. Being binary images, the complexity of the processing elements does not need to be high to perform an efficient computation.
Fig. 1 shows schematically the processing array. The array is composed of a single type of processing elements, named as PE, as described below. The data flow in and out of a PE to the four nearest neighbors along the NEWS distribution network, a local communication system in four directions, north, east, west and south. It allows to interact through direct physical connections to the four cardinal points of each PE. To access to a farther PE, a strategy for moving data between PEs is needed.
The Processing Array schematic. Simple PE disposed regularly with local NEWS communication and a ring of dummy cells as boundary condition.
To obtain a full functionality, a cell ring of dummy cells that provides a configurable contour condition for the array was added. These cells are formed only by a memory element that takes values 0 or 1 depending on the algorithm being executed. If a not constant condition is necessary, i.e. varies pixel by pixel, the outer ring of PEs of the array can be used, the latter, at the cost of image resolution. Nevertheless, constant and homogeneous boundary conditions are usually the case.
The schematic of Fig. 1 shows that dedicated buses to load and download data are not present. The following approach is proposed: to use the existing local connections to perform shifts to upload and to download the data contained in the local memories of each PE. Thus, the global data buses are eliminated, being only necessary to design an interface between the array and the external memories, which stores the images, and to permit loading and unloading at one column per cycle. The interface is made by a series of multiplexers connected to the adequate input port of each PE which form the first column and allow to select between the value stored in the dummy ring (during processing) or the external memory (loading and unloading data). The output interface does not need additional hardware, since it is only necessary to connect the output of the PEs to the output bus. In this way, for an NxN array, N cycles are needed to upload or download an image.
Although this setting seems limited in terms of speed, the inclusion of the two interfaces gives the same speed as implementations which include rows and columns decoders. Both cases require as many accesses to the array as rows or columns. However, the input and output interfaces improve loading times allowing to download and to upload the current and the next image simultaneously, reducing the time by a factor 2. In contrast, the array random access is not permitted. In those cases where it is necessary to extract a concrete column of the array, shifts must be performed as many times as needed. However, despite this drawback, we achieve a significant improvement in the area consumed by the array and the processing speed.
Due to the simplicity of the PE, it is expected a great regularity in the design of the array. Even in programmable architectures such as FPGAs, an automatic
The processing element, PE, is shown in Fig. 2. There are three main modules: the Logical Unit, the Memory Bank and the Routing Module. It can be checked that there is not an associated control module. The control is done globally and it is common to all of them, greatly decreasing the area. In this way, all the PEs run the same instruction synchronously. Using an appropriate set of instructions, the control unit can be implemented with very reduced hardware resources.
The Routing Module
The Routing Module acts as the interconnection between the PE and the rest of processing elements of the array. It consists of a multiplexer of four 1 bit inputs to the PEs located in the NEWS positions. A 2 bits signal controls the direction of communication, providing the value of one of the neighbors within the PE. The output provided by the PE always comes from a position of the Memory Banks, as it will be detailed later, so no additional logic is necessary for control.
Processing Element schematic. It is composed by three modules: The Memory Bank, the Logic Unit and the Routing Module.
This communication system is suitable for most of the low and mid-level operations as it can be extracted from the study of different algorithms in the literature or from the configuration of the coefficients in the templates listed on the Cellular Wave Computing Library (Kék et al., 2007). This library collects some of the most used templates in image processing on CNNs. Although the proposed architecture has a different operating mode than a CNN, its templates are fully representative of low-level image processing algorithms (Fernandez Garcia et al., 2008).
The Logic Unit
The Logic Unit performs only the most basic Boolean operations:
The Logic Unit has two inputs for the 1-bit operands, labeled
Operands
It is interesting to highlight some of the functions of the
The architecture of the Logic Unit allows the addition of new operations easily. For example, an algorithm may need to perform a more complex operation many times. In that case it might be worthy to add an extra operator to boost speed. In return, the size of the multiplexer increases, as the size of the global control lines does. It is also possible to replace the Logic Unit with a
The Memory Bank
The Memory Bank consists of a set of 1-bit registers. It has just an entry, labeled
The data input by
The two simultaneous outputs allow a flexible management of resources of the PE. On the one hand, they allow for internal operations to provide two operands to the Logic Unit. On the other hand, when the operation requires access to the neighborhood of the PE, an operand is provided
The configuration of the Memory Banks acts as a dual-port memory allowing to simultaneous reads and writes on the same memory position. Thus, operations such
Altogether, the necessary number of control bits is
Functionality summary
In summary, the processing elements shown in Fig. 2 can:
Select a neighbor
Select two memory values
Choose between two operation modes:
Two operands, one from the memory and other either from memory or an external element (AND, OR)
One operand from memory or from an external element (NOT, Identity)
Write the result in the memory bank
Provide a stable value as external output
The PE control
In order to increase the size of the array and as all PEs perform the same operation, it was decided to implement a global control system. It translates the high-level instruction into the signals arriving at each individual module of the PEs. This control can be implemented very easily if the instruction set is selected correctly.
OP | A | B | R | OUT | ||
A_from | A_address | Address | address | address | ||
nº bits | 2 | 1 | S | S | S | S |
Encoded instruction format for the Processing Element.
Table 1 outlines the encoding of the instruction format for the PE. The meaning of each segment is as follows
The total size of an instruction is 4S+3 bits. It should be noted that a 1 bit flag is needed to control the interruptions of the array, as specified above.
The instruction decoding of the control signals for the particular elements within each module is undertaken by the Global Control Module. From Table 1 it can be extracted that each field directly controls the elements of the PE, without needing decoding. Therefore, this module can be implemented only by distributing the coded instructions to the PEs. For example, the
By the nature of the instruction set, a Boolean equation that means how each PE changes its value according to a given neighborhood must be found. This equation can be obtained in various ways: from the original image and the expected image, observing the differences between them; translating the effects of a mask or a filter; directly designing the Boolean equation, etc. Next, a selection of algorithms to test and show as the proposed system works is listed. The examples were extracted from the Cellular Wave Computing Library, CWCL, which collects the most used templates in image processing on CNNs. This selection is not a limitation because it is a widely used platform for these tasks, being a representative set of low-level image processing operators.
In terms of notation, the following variables are used to refer to the neighborhood of the central pixel,
The well known edge detector is a good model to show how the architecture works. This operator corresponds to the binarized version of the edge detector present in the CWCL and follows the outline of Fig. 3, where the mask T is defined in Eq. (1).
Algorithm for the binary edge detection.
The interpretation of this template is simple. Only when one or more neighbours
R0 ← input image
inversion
R1 ← NOT R0
template
R2 ← north{R1}
R2 ← R2 OR east{R1}
R2 ← R2 OR west{R1}
R1 ← R2 OR south{R1}
andR1 ← R0 AND R1
In this case, a four input
Binary edge detection example.
The Hole Filling is an iterative operation. It is used to fill the holes in all the objects that are part of an image. In a synchronous architecture, as the proposed here, it is executed iteratively a number of times that can be fixed beforehand or determined during the execution. The first case is the most common and it is the considered here. The algorithm used is described in (Brea et al., 2006) and shown in Fig. 5, where
Algorithm for the Hole Filling.
The pseudo-code of this operation is as follows:
R0 ← input image
1st inversion
R1 ← NOT R0
template
R2 ← north{R1}
R2 ← R2 OR east{R1}
R2 ← R2 OR west{R1}
R1 ← R2 OR south{R1}
2nd inversion
R1 ← NOT R1
ORR1 ← R0 OR R1
A complete iteration of the algorithm requires 7 clock cycles. The number of iterations needed depends on the shape of the image and its size. The result of applying it on a test image is displayed on Fig. 6.
Finally, an implementation of the algorithm that solves the problem of the minimum path was done. The application is significantly more complex than the other examples outlined previously and it illustrates the capability of the SIMD array.
The aim is to determine the shortest path between two points, avoiding a series of obstacles. It is based on the implementation discussed in (Rekeczky, 1999), which proposed a new approach to solve this problem by using CNN computing. In line with this strategy, a wave front with constant speed explores the labyrinth from the starting point. At each branching of the labyrinth, the wave front is divided. When two wave fronts are at an intersection, the first to reach will continue evolving while the rest remains static, avoiding the collision.
Hole Filling example.
Then, a prune of all paths is done, maintaining fixed the start and end points, which are external parameters of the system, so only the shortest path between those points remains.
The algorithm has two stages, both to carry out iteratively. The first stage, the exploration, is shown in Fig. 7. The templates T1 and T2 defined in Eqs. (2) and (3) along with its translation into Boolean equations.
The second stage, the pruning, is done executing iteratively T3, defined in Eq. (4). This template is equivalent to an AND between the labyrinth and explored the result of invert the application of T2 on the explored labyrinth, so the above equations will be used again.
During the exploration phase, T1 requires 4 clock cycles, T2 9 cycles and the additional logic operations, 3 cycles. All in all, each iteration requires 16 cycles. The pruning phase is executed in 9 cycles, 8 for T2 and one for the additional operations. The number of necessary iterations for each stage depends on the labyrinth. Fig. 8 shows the different stages of each phase on a test labyrinth.
Shortest path problem: exploration step.
The pseudo-code for both stages is shown bellow.
Exploration step: R0 ← input image R1 ← start point Template T1 R2 ← north{R0} R2 ← R2 OR east{R1} R2 ← R2 OR west{R1} R2 ← R2 OR south{R1} Template T2 R3 ← west{R1} R4 ← R3 AND south{R1} R5 ← R3 OR south{R1} R3 ← R5 AND east{R1} R3 ← R3 OR R4 R4 ← R5 OR east{R1} R4 ← R4 AND north{R1} R3 ← R3 OR R4 R3 ← NOT R3 Final operations R2 ← R2 AND R3 R2 ← R2 OR R1 R1 ← R0 AND R2 | Pruning step: R7 ← end point Join start and end point images R1 ← R1 OR R7 Template T3 R3 ← west{R1} R4 ← R3 AND south{R1} R5 ← R3 OR south{R1} R3 ← R5 AND east{R1} R3 ← R3 OR R4 R4 ← R5 OR east{R1} R4 ← R4 AND north{R1} R3 ← R3 OR R4 R1 ← R1 AND R3 |
Proof of concept: FPGA synthesis
In order to test and verify the functionality of the proposed architecture, a description in VHDL was made for a subsequent implementation on a programmable architecture, specifically on an FPGA.
Fig. 9 displays the schematic view of the global configuration of the proposed architecture. As our emphasis has been put on the array, the global system architecture addressed here is not optimized and it is only intended as an operation tester of the processing array. It is made up of the following elements:
Input and Output Memory Banks: to store images to be processed and the processed images. Both of them provide a column per clock cycle.
Instruction Storage: it stores the decoded instructions, the value of the dummy ring for each instruction and the interrupt signal,
Global Control: it synchronizes all existing modules. It consists of a finite state machine and the Instruction Decoder described above.
Processing Array: has an input column data of the stored image in the memory bank and as output, a column of the processed image. The control is done through the current instruction from the Instruction Memory. The
Shortest path problem. Example
Address Generator: it calculates the address of the next instruction to execute. It allows loops in order to iteratively execute blocks of instructions, reducing memory requirements for storing the instructions.
The selected platform was an RC2000 card from Celoxica, which comprises a card with a PMC RC2000 PCI controller, which allows to insert the card into the PCI bus of a PC, and an ADM-XRC-II board by Alpha Data, with the following features:
Xilinx Virtex-II xc2v6000-4 FPGA
6 banks x 2MB RAM ZBT
2 banks x 4MB RAM ZBT
External clocks: [40KHz - 100MHz] and [25MHz – 66MHz]
Global system architecture.
The Xilinx Virtex-II xc2v6000 main characteristics are:
6M equivalent logic gates
33792 slices
1056Kbits of distributed RAM
144 dedicated multipliers
144 dedicated RAM blocks
The design and mapping process was done using the ISE 9.2i, from Xilinx.
The selected array for the synthesis has a size of 48x48 processing elements, with a Memory Bank of 8 bits per PE (S=3). The external memory banks were implemented using the dedicated RAM blocks of the FPGA. The main results are summarized in Table 2.
Occupied slices | 26,428 (78%) |
Slices Flip-Flops | 20,165 (29%) |
4-input LUTs | 50,649 (74%) |
Number of equivalent gates | 527,716 |
Maximum frequency achieved | 67,3MHz |
Main results of the FPGA implementation.
There are available resources on the FPGA which can increase the resolution of the array, the size of the PE memory, or the instruction storage. With the same configuration, the resolution can be increased to reach an array of 56x56 elements.
Table 3 gives a summary of processing times for each algorithm, considering only one iteration. The maximum working frequency for the Virtex-II FPGA xc2v6000 is 67.3MHz. It also includes the number of required memories for its implementation, including always the memory where the original image is stored and is not changed during processing, although this would not be necessary in all cases. It also includes results for other tested algorithms that have not been detailed in this chapter, but intended to illustrate more clearly the performance of the platform.
Algorithm | #cycles | Time (μs) | #memories |
Edge detector | 6 | 0.089 | 3 |
Hit and Miss | 10 | 0.149 | 3 |
Hole Filling | 7 | 0.104 | 3 |
Skeletonization | 84 | 1.248 | 5 |
Shortest Path: exploration | 16 | 0.238 | 6 |
Shortest Path: prune | 9 | 0.138 | 4 |
Processing times for the proposed sample algorithms. One iteration at 67,3MHz.
For the iterative algorithms, Table 4 shows the total execution times. The test images have the same size as the matrix, i.e., 48x48 pixels
Algorithm | #cycles | #iterations | Time (μs) |
Array load/Donwload | 1 | 48 | 0.71 |
Hole Filling | 7 | 45 | 4.68 |
Skeletonization | 84 | 40 | 49.93 |
Shortest Path: exploration | 16 | 125 | 29.72 |
Shortest Path: prune | 9 | 75 | 10.03 |
Processing times for the iterative algorithms. One iteration at 67,3MHz.
The impressive progress of new technologies, marked by Moore\'s Law (ITRS, 2007) allows increasingly integration density. This leads to more hardware resources with higher clock frequencies, increasing performance considerably. In this way, programmable systems such as FPGAs are able to get the same performance than recent past specific integrated circuits, IC, keeping the development times and the time-to-market at low(Nagy et al., 2006). In this section we examine the scaling possibilities of the SIMD architecture due to the technology evolution, both for FPGAs and ICs.
The ever-increasing density of the CMOS technology market by the Moore’s Law means that the designers can choose FPGAs as a proof of concept system (Lopich & Dudek, 2005) or even as an end system (Diaz et al., 2006). The time to market is another major reason why FPGAs are becoming increasingly competitive. A study based on the International Technology Roadmap for Semiconductors (ITRS) roadmap which estimates the increased logic capacity and speed of commercial FPGAs is shown below. Area reduction allows to integrate more logic. In this way, the parallelism that can be obtained with the proposed SIMD architecture will increase considerably, allowing large array sizes, so that the final solution could be based on an FPGA and not on an integrated circuit, cutting costs and design time. These results are shown in Fig. 10.
Scaling of the FPGA logic capability. Logic capacity in thousands of 6-input LUTs. Maximum resolution of a square matrix, in number of PEs per row.
The method used for this estimate is as follows. Given the ability of the FPGA logic for a given year, the number of logic cells, and the prediction of the ITRS, the capacity of the FPGA logic cells for the target year is:
where the subscript A refers to the known year and B to the estimate year. As the ITRS shows, the chip size remains constant over the next years, thus simplifying the above equation. This study is based on the one detailed in (Varghese & Rabaey, 2001) and is a review of the last ITRS update (ITRS, 2007). This formula is valid only if the internal architecture of the FPGA does not change.
The selected FPGA to start this study with is one of the most advanced from Xilinx, a Virtex-5 XC5VLX330. The most salient characteristics are gathered in Table 5. This FPGA has more than 50,000 logic cells, CLBs, each composed of 2 slices, each one with 4 LUTs with 6 inputs and 4 Flip-Flops per slice. The logic contained in each CLB is summarized in Table 6. The technology used in the manufacturing process is 65nm at 1.0V with triple-oxide. We must emphasize that the Virtex 5 family changed its internal architecture from 4 input LUTs to 6 input LUTs, with respect to previous family (Cosoroaba & Rivoallon, 2006) (Percey, 2007).
CLBs array | LUT-6 | Flip-Flops | Distributed RAM | Shift registers |
240x108 | 207360 | 207360 | 3420 Kb | 1710 Kb |
Virtex-5 XC5VLX330. Main hardware details.
Slices | LUT-6 | Flip-Flops | Distributed RAM | Shift registers |
2 | 8 | 8 | 256 bits | 128 Kb |
Virtex 5 family. Hardware on each CLB.
With these data, whereas the number of basic elements of the selected FPGA is 207,000 in 2006, year that Xilinx introduced the Virtex 5 family, and assuming that the chip size remains constant, in 2010 it is possible to reach 481,000 elements. Fig. 10 shows the scaling of the current Virtex 5 family. The same figure includes what would be the maximum size of the SIMD processing array. This result should be taken as an upper bound and not as a precise value because they are not included the elements employed by control, memory instructions or even new features that may include newer FPGAs.
Concerning the Virtex 5 family, each Processing Element requires 8 Flip-Flops and 14 6-LUT, keeping the same characteristics as the detailed in the previous implementation. Therefore, the limiting factor is the number of available LUTs. Thus, it appears that using the 2009 technology node it would be possible to implement a QCIF array (144x176) and that before 2013 and 2019 it is feasible to process images of 256x256 and 512x512 pixels, respectively, without dividing them into sub-windows, with a PE per pixel.
For certain applications, an FPGA-based solution can not meet the appropriate requirements such as higher performance, lower consumption and higher integration. One of its uses is as coprocessor in focal plane vision systems, accelerating the binary computation, where the integration with gray image processing units is necessary. Thus, it is interesting to discuss the features of a full custom implementation. An ASIC implementation for the Processing Element is proposed in this section in order to explore the possibilities of scaling along the ITRS predictions.
CMOS complementary logic with minimum size transistors will be used. This implementation is not optimal because using other CMOS logic families and specific design techniques, such as pseudo-nMOS or dynamic CMOS, a higher yield in both area and speed can be obtained. The different modules of the PE are conceived in the most straightforward manner. For example, a 2:1 multiplexer is formed by two 2-AND gates, an OR-2 and an inverter for the control signal. The features of the PE are the same as those detailed above: an 8-bit Memory Bank. A summary of the number of transistors per PE is given in Table 7.
Routing | Memory Bank | Logic Unit | Other | |
No. of transistors | 46 | 902 | 60 | 20 |
Number of transistors for each Processing Element using CMOS logic.
It should be noted that the area occupied by the memory banks amounts to the 87% of the total area. Each memory element is formed by a D master/slave Flip-Flop with reset and enable signals. Clearly the selected implementation is not the best. Using RAM-based elements will considerably reduce the number of transistors. This module will require a greater effort during the design to optimize the area requirements. The adequate selection of the size of the Memory Bank for a particular implementation is critical.
To determine the area occupied by each PE is assumed, similarly as for programmable architectures, that the integration density predicted by the ITRS includes the parameters that limit it. To estimate the size of the processing array it will also be assumed that the buffering is negligible compared to the processing hardware. This will not affect the precision with which the results are expected.
Scalability of the ASIC implementation.
The results are summarized in Figs. 11.a and 11.b. The first one shows the maximum amount of PEs that a given technology is able to integrate by mm2. To ease the visualization the figure also shows the Near Term Years expanded. The second figure displays, for some array sizes, the total area that would be occupied according to the technological process selected. The planned integration density will allow use a processing array as accelerator in general purpose visual processors with a very low cost in terms of area, even in high resolution. We emphasize that with the 2001 technology, an array of 128x128 elements needs 18mm2 and that, with the same area, it is possible to integrate an array of 256x256 elements in 2007. It should be remembered that this is only an estimation and that the design is not optimized. Just by using transmission gates for multiplexors and SRAM memories the area requirements are reduced by a factor of 5. With a more aggressive design strategy is feasible to reduce an order of magnitude in the occupied area.
The range of applications where binary images are used is very wide due to its particular characteristics, such as low storage and processing requirements or the simplicity of the algorithms. Many of early vision operations can be addressed using a small computer unit. Thus, the path to explore is to increase the parallelism. SIMD architectures, with simple processing elements arranged in a matrix topology with local connectivity between them, are able to efficiently exploit the characteristics of low and medium level operations.
For the development of the processing element, special attention was paid to the reduction of its size while maintaining a generic functionality. Furthermore, it is easy to extend its functionality for those critical operations of a given algorithm. A limited set of instructions allows to easily translate a mask or filter or to deduce the Boolean equation that governs the change of status of each pixel of the image according to its neighborhood.
Functionality and performance were verified using an FPGA, obtaining performance data that indicate that even on a programmable architecture, the efficiency is high. Furthermore, short term future FPGAs will allow to implement bigger arrays, achieving a higher degree of parallelism. In the same way, full-custom implementations allow to use the proposed Processing Array as co-processor on generic vision systems with low area requirements.
This work is funded by Xunta de Galicia under the project PGIDT06TIC10502PR
Designing electro-mechanical systems in the aerospace industry is a challenging task for many reasons. First, the programs may last decade, so when the design phase starts the design team must envisage how the product will be sustained and maintained in 20 or 30 years on. Second: reliability is a
In this context, the role of industrial engineering teams inside an aerospace company can play a decisive role in delivering the targeted requirements (time-cost-quality).
In order to do so, the industrial engineering team needs to be part of the design team from the beginning, even during offer proposition if needed. Moreover, its requirements, suggestions and strategies must not be seen as secondary or expendable to meet selected electrical or technical specification. On the contrary, if a particular feature needs to be sacrificed during design phase, this should be a technical performance that is not directly requested by the customer or end-user.
During the design flow, industrial engineering can be engaged in two possible ways:
In the final design stages to verify that the part designed by the electrical or electronic engineering team fulfills several conditions regarding physical dimensions, materials employed, interconnects, and so on. In practice, the role of the industrial engineering team is to give a “go ahead” or “modify” decision based on the outcome of a specific checklist compilation and know-how of the manufacturing process. In this context the industrial engineering members act as review body rather than participant of the design team. This approach often leads to difficulties when the production of the part ramps-up since some aspects related to manufacturing were overlooked during the design phase.
Early on the design stage to recommend manufacturing related views, propose suggestions and identify solutions that would have been probably rejected by a “purely” engineering team.
In essence, design for manufacturing (DFM) is a development & design issue, not a manufacturing topic. “D” stands for design and therefore “DFM” is a design challenge”.
The following sections contain indication on how the industrial engineering team can be effective during the design phase (i.e. implementing best practices for DFM) and in the subsequent production phase in order to proactively sustain and improve the manufacturing processes.
The following terms are often referred to in the rest of the chapter:
Industrial engineering: a team of people, or a better a division of the company, which is constantly involved in both engineering and manufacturing activities. Its essence is to act as the
Producible/Producibility: the attribute of a part that can be manufactured in a given time and cost constraint thorough industrial repeatable processes featuring a level of quality, for example, compliant with ISO9100 standards.
The design team should treat manufacturing requests and constraints as a requirement in the same way it tackles the technical requirements posed upon the item under development. Therefore, manufacturing aspects require a design strategy and a verification method.
DFM strategies can be summarized as best practices or design rule. In general, rules can be strict and often are associated with the concept of violation and penalty. An alternative way of implementing the process can be obtained by giving guidelines. The latter are less strict and provide a design philosophy rather than giving strict indications.
An important feature of designing and producing parts in the aerospace industry is that large quantities of the same part to be produced are seldom encountered, as occurs in the consumer market or semiconductor industry. Apart for very specific components, for example, transmit/receive modules inside a phased array, most other parts that compose an electro-mechanical system are usually produced in a scale of a few parts per month or even less.
Trade studies are very important in the aerospace industry. They should be carried out at the beginning of the design phase to identify the most viable solution. It is important to emphasize that the Producibility requirements have the same dignity as the electromechanical requirements expressed technical specifications and the team’s objective must be to respect ALL requirements, or identify the most balanced solution among a set of proposed viable solutions.
There are multiple ways to implement a project that fulfills the given requirements and conditions.
Radar chart helps understanding design trade options.
A typical case study is here provided with the aid of Figure 1. The goal of the team is to design a microwave electromechanical assembly fulfilling some electro-mechanical requirements listed in technical specification. Moreover, the part shell be produced within a maximum cost figure (expense of components and labor) and the design cycle shall be less than 12 months long.
Electrical requirements such as gain, noise, signal linearity and DC power consumption can be summarized in REQ_1. Thermo-mechanical requirements, such as maximum temperature of operation and the capability of withstanding certain shocks and accelerations, can be associated to REQ_2. Reliability specifications are considered in REQ_3. The term
The yellow line, in Figure 1, appears to be a solution featuring high technical merit but requiring the use of some component that is not compliant with safety constraints or export limitations. This is quantified by the low value expressed in CONST_1. On the contrary, the blue line represents a solution that complies with time and material/component prescription but features low technical merit. The green and burgundy curve represent solutions that suitably trade-off between all requirements and constraints. Some requirements may be in contrast against each other. For example, higher electrical performance may be obtained at the expense of poorer reliability or vice versa. Similarly, demanding thermomechanical requirements can be fulfilled if accepting the higher costs of using advanced materials and extra labor time. Moreover, even within the same set of requirements, for example electrical performance expressed as REQ_1 there might be some conflict. Higher gain and linearity is obtained at the expense of greater power consumption.
Typically, the identified solution will cover most of the requirements leaving unsatisfied only a minimal part. Therefore, the best solution is the one having the largest area in conjunction with no points close to the origin of the radar chart, consequently the burgundy curve in Figure 1.
The project manager must work to manage the lifetime risk of the product/program linked to the failure to meet these requirements. In the event of conflict, a trade-off must be made between the electromechanical requirements and those of producibility, privileging the latter especially for series production (items with multiplicity ≥5 for one system).
Finally, design guidelines are particularly useful in contexts where most of the assembly is performed manually, whereas rules apply where the process is highly automated and product performance is obtained by-design rather by manufacturing tuning.
Production of electrical assemblies operating at high frequency requires a set of manufacturing technologies that ranges from packaging to adhesion up to interconnects. The topic is very broad and some aspects are covered in [1]. What is important for this chapter is that several of these processes are manual. While, on one side, manual assembly can help obtain desired product performance on the other it increases tuning time since the “starting point” can be quite far apart due to the larger variability of manual processes. Moreover, at microwave frequencies, interconnects and adhesives influence electrical performance due to the parasitic effects, and therefore must be taken into account during design phase.
A best practice that greatly aids design for manufacturing topics is the manufacturing organization meeting with design engineers to discuss the latest developments in manufacturing technology. Moreover, the Industrial engineering team should periodically provide a report containing investments and improvements foreseen in manufacturing over the following 2–3 years. In this way, the company and the engineering team are well aware of advances in manufacturing and can profitably orient design choices in the future.
Eutectic die attach (brazing) is a highly controlled die attach process for high reliability, high accuracy, and high performance devices. To achieve high yield, sophisticated heating and cooling mechanisms are employed. This means controlling that the device heats and cools according to a very strict parameter line. The essence of a eutectic reaction is going from liquid to solid, using eutectic heating and cooling. Eutectic alloys for soldering are composed of Sn (tin), Pb (lead), Ag (silver) and Au (gold). When different metals are combined into alloys, a range of melting temperatures are created with varying proportions of each metal used: AuSi@363°C, AuSn@280°C. The advantage is a very high conductive (thermal and electrical) adhesion obtained at the expense of a manual and very complicate processes (a few seconds or degrees difference in the brazing oven could mean success or failure of the process). Table 1 reports key attributes of alloys for brazing microelectronic parts. Important parameters to drive the choice in microelectronic components are the electro & thermal conductivity (to determine in-package device electro-thermal performance) and melt temperature (that implies manufacturing complexity). Gold-Tin alloys (Au/Sn) are typically employed in assembly of microwave devices while Tin-Lead (Sn/Pb) is preferred for the production of digital boards.
Alloy Family | Features | Composition | Melt temp. [°C] |
---|---|---|---|
SnPb | Typically used in surface mount assembly. High bond reliability. | Sn63Pb36.7Sb0.3 | 183 |
Sn60Pb39.7Sb0.3 | 183–188 | ||
Sn62Pb36Ag2 | 179 | ||
In | Elastic interconnect | In100 | 156.7 |
In50Pb50 | 180–209 | ||
AuSn | Strong bond strength. Excellent thermal and electrical conductivity. | Au80Sn20 | 280 |
Attributes of several alloys for brazing.
Tin/Lead (Sn/Pb) based alloys are the most commonly used alloys for welding on copper, nickel or silver surfaces. The addition (optional) of a small percentage of antimony prevents the transformation of the tin (beta) phase into a tin (alpha) phase called “tin plague”, with a reduction in the volume of the alloy mass and a drastic decrease in the mechanical strength of the welded joint. Silver is added to allow soldering on silver surfaces without causing the alloy to over-dissolve the plating metal. All tin-based alloys are strongly discouraged for welding gold surfaces, due to the rapid dissolution of gold in the alloy (scavenging).
Indium-based alloys are particularly useful due to their great ductility, which attenuates or eliminates failure problems resulting from fatigue failure of welded joints, and by the lower solubility of gold in such alloys. About 1% of gold must dissolve in an indium/lead based alloy before the AuIn2 solid phase can be formed, which is stable in equilibrium with lead up to 319°C and acts as a barrier, limiting the further dissolution of gold: a thin film of gold can withstand for 15 minutes in an In50Pb50 alloy bath.
Gold/Tin (Au/Sn) alloy is specifically used to weld gold surfaces without having to use flux, due to the high gold content it contains. It is normally sufficient to use a nitrogen-based inert atmosphere during the process. This alloy is able to dissolve gold in considerable proportions (up to 1–2 microns in thickness) during a normal welding cycle lasting a few minutes, which requires that the surfaces to be gilded have a thicker plating, i.e. at least 3–4 μm.
Epoxy attach (gluing), on the other hand, is a far more easier manufacturing process than brazing. It can be very often automated and the time constraints/temperature constraints of the process are much less critical than brazing. Usually the devices is cured for 30 minutes inside a curing oven at 120°C. Nowadays, silver-loaded epoxy adhesive with high thermal and electrical conductivity are available whose electrical and thermal performance are not far from the ones obtainable with chip brazing.
The purpose of the wire bond is to create an electrical connection between an IC and some type of conductor, typically a metal trace. At lower frequencies the wire bond performs as a simple electrical contact between points and is specified at a maximum current handling. However, as frequency increases, wire bonds begin to perform as inductors. The requirements on the wire bond increase as frequency is increased. Typically, the length of the wire is limited to reduce inductance. Also, the shape of the wire bond is specified and in some cases manual accomplishment becomes unavoidable. Figure 2 depicts the equivalent electric circuit and the corresponding parasitic reactance and resistance as a function of frequency of a 1 mm/25 μm diameter wire bond. As frequency increases, the parasitic effects become large and can be compensated only by decreasing wire length, and sometimes operator skill becomes mandatory.
Bond wire simplified geometry and equivalent circuit (left) and impedance vs. frequency (right).
The effect of wire length, and therefore inductance, on a high frequency circuit is demonstrated in Figure 3. A
Bond wire length effect on a RF chain around 30 GHz.
The gain is rather flat for LEN = 300 μm (highest curve, marker P1), while it becomes quite rippled and gain drops for LEN = 800 μm (lowest curve, marker P6). Consequently, length of bond wires should be carefully controlled. Occasionally operator ability is essential to obtain the desired electrical performance.
Wire bonds can be connected using ultrasonic bonding, thermos-compression bonding, and thermosonic bonding [2]. Ultrasonic bonding uses pressure and ultrasonic vibrations from a bonding tool to create the bond between the wire and the metal surface. Thermo-compression uses pressure from the bonding tool and high temperature to create the bond. Thermosonic bonding combines ultrasonic and thermos-compression methods to create the bonds.
The choice of manual or automatic assembly is driven by a some parameters. First is the electrical and thermal requirements. In some cases, the requirements could be so stringent that only a manual process is capable of performing a very fine-tuning. For example, when temperature and heat dissipation are critical, then brazing can become the only acceptable solution. The effect of interconnect parasitic were also discussed, in the previous Section 2.1.1, and how operator support can become decisive to obtain acceptable performance, especially at GHz frequencies.
Another parameter to be accounted for is the number of parts to be produced in 1 week, 1 month or 1 year. This number plays a crucial role. If a mass production is foreseen, then manual assembly is not advised due to the lengthy and costly process associated with it. On the contrary, when very few parts are to be produced then manual process is acceptable, also because automatic assembly requires the development of programs and codes with the consequent Non Recurring Expenses (NRE) for developing them.
The paradigm of design for manufacturing can be found in Additive Manufacturing (AM) technology. AM represents a key example where an advancement in production technologies enables new engineering concepts that can come to life
In the aerospace sector, AM is applied mostly on metallic parts (Aluminum, Steel, Titanium and related alloys) rather than composites (plastics) as occurs in the consumer industry. In fact, the initial investment in terms of machinery and training is very high and must be carefully accounted for in the business model.
AM in aerospace has been happening for some time now with many applications, covering everything from the creation of aircraft or helicopter parts, making lighter and more efficient engines, 3D printed turbines etc. 3D technologies generally save on time, money and create stronger, lighter, and more efficient finished products [3].
An example of AM technology and process applied to the aerospace industry is shown in Figure 4.
Metallic part optimization thanks to AM.
The part itself is not very complex, but is proves how AM can be gainfully exploited to create lighter or more complex structures than the ones previously realized with “prior” technologies.
One of the challenges of the market is the restriction of the volume of construction and the size of the product. An aircraft is made up of very large components and additive manufacturing is today limited to the volume offered by the 3D printer. Most technologies offer solutions with limited print volume, making 3D printing applicable only to small components. So, this constraint that could slow down the growth of the market. Even if so, today’s 3D technologies have already made it possible to create and qualify fairly large (approx. 30 cm) components for space [3, 4] and aviation [5]. Finally, the latest available machines (SLM500, Concept Laser Xline 20000R, EOS M 400) are capable of building even larger pieces.
Design rules can be seen as a set of physical, geometrical, chemical, mechanical limitations. They are very useful when the manufacturing process is constant and repetitive as happens in the semiconductor industries or in large scale production. This paradigm however is less stringent in the aerospace industry since there is not a mass production of items, but on the contrary, a production of a large quantity of different parts each one characterized by very small multiplicity. Moreover, while digital board assemblies can follow rules developed for the consumer market, high frequency microwave assemblies (operating at 100 MHz–30 GHz) are typical of the aerospace industry and suffer from less standardization. Consequently, for the latter guidelines rather than rules should be applied.
Anyhow, rules and guidelines should address the following features that are critical in any industrial manufacturing process:
Designing parts for “modularity”, i.e. a module is a self-contained component that is equipped with standard interfaces that allow it to be integrated into a larger system. Modularity has several benefits: the product is easy to assemble/re-assemble and most of all, in complex systems, it aids to detect quality problems or non-conformities
Designing parts to compensate for process statistics and yield, component and material deviations
Ensure the product can be assembled and manufactured using standards processes, i.e. identifiable and written in a production document or drawing without requiring ultra-specialized capabilities or different production approaches for each realized component.
Design rules are written to suit a specific production technology. In the electronics for aerospace industry important production technologies are microwave modules and digital boards.
Digital board production uses rules similar to the ones developed for consumer and telecom products, always taking into account that aerospace industry produces a relatively small amount of high-performance products as opposed to consumer market. Anyhow, well known standards can be applied, for example the IPC-2291 “Design Guideline for Printed Electronics” or IPC-2252 “Design Guide for RF/Microwave Circuit Boards” considering class 3 for the aerospace industry.
On the other hand, production of complex microwave parts is very typical to the aerospace & defense sector and seldom finds application elsewhere. This is related to the high cost involved in development and production. Design rules for these objects often end up as a few set of geometrical rules. An example of design rules applicable to hybrid microwave modules or hybrid microwave integrated circuit is given in the following:
Package dimension not to exceed a certain value so that the part can be manufactured using automatic assembly machines
Minimum distance between adjacent components, so the part can be assembled using automatic
Maximum dimension of materials and substrates to avoid cracking due to thermal expansion/compression
Metallisation and finishing of surfaces
Geometrical rules regarding thickness, angles, corner radius, shapes, etc.
Design guidelines provide indications on how to deliver a
While rules provide a PASS/FAIL criteria, often regarding geometrical or mechanical properties, guidelines provide assort of “sensible” indications so that the design has a higher probability of success. In other words, if the guidelines are followed, very limited manufacturing issues are expected later on. On the contrary, if the design team decides not to follow the guidelines, plenty manufacturing issues during the production stage should be expected.
A typical design guideline could be to avoid overcomplicating the electrical schematic, eliminating unnecessary components. Every component placed inside the schematic should answer to at least one design goal (typically performance, testability or reliability). If a component does not contribute to at least one of these “high-level” design goals, the engineering team should substantiate the reason for which it has inserted. Boothroyd and Dewhurst [6] suggests, among other topics, that unnecessary parts are those that answer “NO” to the following questions:
Does the part move relative to other parts in normal operating condition of product?
Is it necessary that the part is made of different materials or isolated from other parts such as electrical insulation, heat insulation, or vibration reduction?
Does the part have to be isolated from other parts otherwise it is impossible to assemble the products?
If the answer to all questions is “NO”, the part is unnecessary and can be integrated with other parts.
Another guideline could be to design parts so that final performance can be obtained after tuning or programming performed in reasonable time and most of all avoid using components (or electrical schematic) so that the overall module performance resides on a specific component of the module. In this case any shortcoming of the component will affect one-to-one the module’ behavior.
Design engineering team, during the initial design stages, would like to have an initial prototype to test the idea and verify in-lab any limitations that commercial CAD simulations or analysis are unable to predict.
Basically, there two types of prototyping techniques: virtual or real (fast).
Virtual prototyping relies on very accurate model-based CAD simulations. The models are often validated through a previous trial-error-correct cycle. The method is relatively inexpensive, can be very fast and deliver accurate results providing the model itself is accurate.
Additive manufacturing technologies (metal and plastic) provide fast turnaround time to realize real and fast breadboards. In this case, the prototype is real, the time constraints are guaranteed but the exercise can be expensive, compared to virtual.
The choice between real or virtual prototyping can be performed by analyzing the following parameters:
Virtual model accuracy
Available time and budget constraints
Associated Risk mitigation
If parameters 1 and 2 have higher weight then virtual prototyping appears to be the appropriate solution. On the contrary, if design uncertainties are high and risk mitigation is necessary, then real prototyping becomes useful.
The objective of a preferred part list (PPL) is to direct the user toward a limited number of component types, covering all design applications. The aim is to avoid duplication and achieve cost reduction and procurement effectiveness [7].
Consequently, you should identify a subset of typically used components to generate your custom PPL. Components belonging to the PPL should be employed “by default”, and any derogation from the list should be clearly explained and technically justified.
Definition, creation and sustainment of a PPL should be a company-funded activity and the client-related programs receive the benefit. Like any other engineering effort, the more work put in the initial stages, the less work is required on final stage.
Initial cost is only one consideration for the PPL and is compensated by the value gained over the lifetime of the product (procurement, production and maintenance). Since the cost of introducing d sustaining a PPL in a company is rather relevant at the beginning such choice must be willingly enforced and sponsored by the company’s top management (director general end director of engineering). Moreover, the director of the purchasing department has to be actively involved, since he might be tempted, over a short-term period, to prefer cheaper or readily-available parts as an alternative to the parts in PPL.
Components shall be introduced in PPL after analyzing the criteria listed in the following.
Performance history: actual field experience or extensive relevant testing.
Accessibility: parts that can be purchased from multiple sources, (vendors or/and distributors).
Alternating source: same form, fit, and function for parts, but different manufacturers’ names and part numbers. (Different manufacturers’ crossover part numbers must be equal.)
Regulatory compliance: RoHS/REACH.
Reliability figures: mean time to failures (MTTF) or mean time between failures (MTBF).
Screening: favor pre-screened or tested parts.
Life span: favor parts with higher Shelf life.
Economic order or lot quantity: Consider minimum buy.
Lead-time: consider cost vs. the desired lead time trade-off.
Bring the strategic suppliers on board the PPL project
Considering the main stages in the product’s life-cycle (from concept to maintenance), the possible savings in each phase are examined:
Research and design: Excluding a newly introduced component’s unknown performance will accelerate design validation and testing efforts. Shorter development cycles realized through less component failure issues and time taken for trouble-shooting and reworking breadboards and prototypes. Quicker proof-of-concept results. Parts used from PPL are more likely to be available, and small development quantities can be ready at-hand.
Purchasing: Material planning is more stable making part procurement less challenging. Strategic suppliers are encouraged if they is actively involved in the company’s PPL project.
Manufacturing: Less line failures using proven parts. Assembly personnel already very familiar with part handling requirements and issues.
Customer Support: Fewer returns and higher reliability. Practice with frequently used parts promotes a deeper understanding of part behavior and common failure mode and symptom identification. Customer satisfaction with longer life product and fewer returns, and fast turn-around time in repair.
The design engineer who selects the components must choose as many parts as possible from the PPL. Ideally >80% of the bill-of-materials (BOM). By selecting even a majority of the parts from the PPL, the benefits realized from the arguments presented above should be sufficient to encourage the company to validate and enforce the practice of using a PPL.
Finally, it is obvious that the PPL should be created and managed by the Industrial engineering people who are the stakeholders of the activity. In fact, PPL has a n impact on all phases of the product life-cycle. The size of PPL depends on the complexity of the typical system the company develops. For an aerospace company that designs and manufacture avionic systems (radars, electronic warfare, satellite payloads) the size of PPL could be around 2000–3000 components.
As stated many times previously, aerospace products feature high system complexity, and must provide high-performance to be delivered over time and in harsh environment and operating conditions. Consequently, the design team must take into account these aspects when designing the product. Design for Reliability, Maintenance and Test (RMT) is often referred to as design for RMT as if it were a single topic. However, different strategies are employed as clarified in the following to separately guarantee the three topics.
Design for test is a crucial aspect to guarantee the part can be efficiently produced during its life-cycle- The part must be designed so that it’s key features and characteristics are accessible and verifiable during production test. Keep in mind that in the aerospace industry, practically 100% of the realized parts are fully tested, often over temperature and in mechanically stressful condition (vibration or similar), to verify they are fully compliant to specification and free from manufacturing defects. Moreover, the test is functional and not merely structural. Manufacturing functional tests are carried out to verify that the part is working and function as expected and not just assembled correctly. Functional test on 100% realized HW parts is typical of the aerospace industry to guarantee performance and reliability of manufactured parts and is less applicable to consumer products due to the very high time and cost involved in these kind of test. Finally, aerospace modules that fail the first manufacturing test need to be analyzed and tuned so the part meets the technical specification. Given the time and cost involved in the assembly process, it is illogical that the part should be discarded if the first production test fails. Consequently, designing parts for testability greatly aids the troubleshooting phase, ensuring production people can speedily identify the shortcoming and restore the part.
Given this scenario, it is mandatory that the design team keeps into account these aspects when designing the part. The principle is to add components and interfaces to make it easier to develop and apply manufacturing tests to the designed hardware. At the same time, test engineering department should be consulted in the design phase, so they can bring provide advice and most of all start designing the Automated Test Equipment (ATE) that will be used in production phase but could also be used by the engineering team for product verification and validation. The idea underlying design for test is: Pay less now and pay more later without DFT.
Design for reliability is crucial aspect in the aerospace industry, where reliability is a must considering the mission criticality of these systems [8]. Reliability somewhat depends on the assembly process employed. One indication is to avoid those manufacturing processes that are less repeatable or controllable.
Design for maintenance shared some requirements with design for test, since any maintenance activity starts with identifying the part in failure within the system. Other aspects consist in the designing the parts in a modular way so any failed item can be easily replaced without having replace the entire system or sub-system,
Information and guidelines were provided in the previous section so industrial engineering can proactively contribute in the design team giving correct priority to manufacturing requests. While this activity strongly mitigates manufacturing risks in production stage it does not totally eliminate risks and therefore some process needs to be applied also during product manufacturing life-cycle.
Open literature refers to these processes in many ways: lean manufacturing, six sigma, continuous improvement, kaizen methods, PDCA cycle, and so on [9, 10, 11]. Each method has its uniqueness but, fundamentally, they consist in constant proactive monitoring of the manufacturing process to identify deviations in early stage, introduce improvements, observe the expected result and, if the outcome is positive, standardize the new method.
Continuous improvement can be obtained by recurrently applying the PDCA cycle to those product and process that demonstrate an intolerable defect rate or more generally deviate from the desired quality/cost/time target.
PDCA cycle consist in performing four steps as graphically visualized in Figure 5.
Plan-do-check-act cycle.
The first step (
The second step (
Ishikawa “fish bone” diagram useful for problem solving.
Ishikawa “fish bone” diagram method consists in analyzing all pertinent areas and sub-areas of a typical manufacturing process. When a quality issue arises, the industrial engineering team is notified in order to identify the root-cause of the issue and consequently propose a corrective action. This is not a simple task since there are many areas and factors to be investigated. Moreover, some of the production processes and materials may come from tier 1 suppliers and therefore occur outside the company.
Common production issues in the aerospace industry occur when information related to a specific production process is not fully written but relies on the skill of advanced operators. Therefore, a strong practice is to provide very detailed assembly instructions so that lesser skilled operators can produce the part in high quality standards.
Some issues may sometimes occur when the purchasing department, to obtain cost saving, procures a component or a material from a different supplier claiming it is equivalent form, fit and function (FFF). Rarely this is a painless change since there are always some small differences between two components identified as equivalent FFF on to the other.
Environment parameters (temperature and humidity) are rarely a cause of manufacturing deviations since the assembly process is typically carried out in clean rooms or at the least humidity/temperature controlled areas. In the aerospace industry, final assembly is performed in the company while lower level components and sub-systems may be procured from an external contractor. The same holds for some non-critical services that are occasionally outsourced. Consequently, in some cases, the investigation needs to be performed at tier 1 supplier level too in order to investigate and identify the root cause of the problem.
The final two steps are
W. Edwards Deming’s famous quote is therefore a cornerstone of this problem solving technique:
Another practice that contributes to improve product/process performance are manufacturing and engineering organizations periodically reviewing quality non conformities to determine if engineering changes are required. Creating dedicated interdisciplinary teams to perform a specific improvement project is also useful.
As stated previously, all process/product monitoring and the consequent PDCA cycle should be data driven.
A Product Manufacturing Sheet is useful from which a Product Manufacturing Figure (PMF) can be calculated. The sheet and figure are living documents and figures, in the sense that they must be periodically updated to monitor the improvement of a certain production product/process.
The Product Manufacturing Sheet contains structured information regarding its three macro-topics: design, manufacturing and purchasing.
DDP (design data package): specification, engineering drawings, data libraries, SW code, design rationale documentation, test planes, are available. List of major engineering changes ongoing, if any.
MNFR (Manufacturing and workmanship): are all the Tooling/machinery available? Personnel has been trained for the specific product? Automatic test equipment – if necessary – is available? Screening procedures are in place?
SC (SUPPLY CHAIN) quantifies on-time and on-quality purchasing of the major “buy” items that constitute the product, any obsolescence, vendor rating of the key components.
The Product Manufacturing Figure (PMF) is calculated, as indicated in Eq. (1), by summing the three previously mentioned factors, each having a weight (α, β, and γ) proportional to the importance the company gives to each factor.
The PMF is computed in the following way:
At first, the weight is set for each e parameter (the sum of the weights must be unitary). In Eq. (1), for example, α = 0.5, β = 0.25, and γ = 0.25. These weights shall remain constant all over the production process.
A figure between 0 and 100%, according to a checklist, is computed for each parameter (MNFR, DDP and SC) in Eq. (1). This figure changes in time as the three topics improve (or worsen). Checklists become handy to substantiate the figure—between 0 and 100%—associated to each parameter. Moreover, Quality Notifications can be used to obtain useful information of product non-conformities.
Consequently PMF is calculated.
PMF close to 100% indicates the part can be fully produced on-time, in-spec and on-quality. Lower values indicate that you should expect some contained derogation of one of the three parameters. PMF < 40% indicates that the product is not enough for mature for an Industrial-grade production and important improvements have to be applied to one or more of the three parameters. Furthermore, PMF is a
Evidence so the Industrial engineering team can proactively contribute to designing parts and address manufacturing issues during the design follow is provided. In this chapter, the starting point is deep knowledge and understanding of the critical technologies that apply to each manufacturing process and their impact on product assembly and performance. Once the technologies have been considered, the key-points Industrial engineering team must engage are: involvement from the early stages, definition of rules and guidelines for manufacturing.
Occasionally, the prior activities are not sufficient and some product improvement must be carried out during the production process. Specific continuous improvement activities (PDCA cycle) and also detailed tools and figure to quantify “design quality” in manufacturing have been provided.
Patrick E. Longhi would like to thank friends and colleagues at Elettronica Group in Rome (ITA) for the many fruitful and insightful technical discussions during his time spent in the company as a Microwave Design Engineer and Industrial Engineer.
The Edited Volume, also known as the IntechOpen Book, is an IntechOpen pioneered publishing product. Edited Volumes make up the core of our business - and as pioneers and developers of this Open Access book publishing format, we have helped change the way scholars and scientists publish their scientific papers - as scientific chapters.
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The toxic and allergic reactions of synthetic dyes are compelling the people to think about natural dyes. Natural dyes are renewable source of colouring materials. Besides textiles it has application in colouration of foods, medicine and in handicraft items. Though natural dyes are ecofriendly, protective to skin and pleasing colour to eyes, they are having very poor bonding with textile fibre materials, which necessitate mordanting with metallic mordants, some of which are not eco friendly, for fixation of natural dyes on textile fibres. So the supremacy of natural dyes is somewhat subdued. This necessitates newer research on application of natural dyes on different natural fibres for completely eco friendly textiles. The fundamentals of natural dyes chemistry and some of the important research work are therefore discussed in this review article.",book:{id:"9203",slug:"chemistry-and-technology-of-natural-and-synthetic-dyes-and-pigments",title:"Chemistry and Technology of Natural and Synthetic Dyes and Pigments",fullTitle:"Chemistry and Technology of Natural and Synthetic Dyes and Pigments"},signatures:"Virendra Kumar Gupta",authors:[{id:"305259",title:"Dr.",name:"Virendra",middleName:null,surname:"Kumar Gupta",slug:"virendra-kumar-gupta",fullName:"Virendra Kumar Gupta"}]},{id:"49647",title:"Fiber Selection for the Production of Nonwovens",slug:"fiber-selection-for-the-production-of-nonwovens",totalDownloads:10512,totalCrossrefCites:9,totalDimensionsCites:17,abstract:"The most significant feature of nonwoven fabric is made directly from fibers in a continuous production line. While manufacturing nonwovens, some conventional textile operations, such as carding, drawing, roving, spinning, weaving or knitting, are partially or completely eliminated. For this reason the choice of fiber is very important for nonwoven manufacturers. The commonly used fibers include natural fibers (cotton, jute, flax, wool), synthetic fibers (polyester (PES), polypropylene (PP), polyamide, rayon), special fibers (glass, carbon, nanofiber, bi-component, superabsorbent fibers). Raw materials have not only delivered significant product improvements but also benefited people using these products by providing hygiene and comfort.",book:{id:"5062",slug:"non-woven-fabrics",title:"Non-woven Fabrics",fullTitle:"Non-woven Fabrics"},signatures:"Nazan Avcioglu Kalebek and Osman Babaarslan",authors:[{id:"119775",title:"Prof.",name:"Osman",middleName:null,surname:"Babaarslan",slug:"osman-babaarslan",fullName:"Osman Babaarslan"},{id:"175829",title:"Dr.",name:"Nazan",middleName:null,surname:"Kalebek",slug:"nazan-kalebek",fullName:"Nazan Kalebek"}]},{id:"41409",title:"Surface Modification Methods for Improving the Dyeability of Textile Fabrics",slug:"surface-modification-methods-for-improving-the-dyeability-of-textile-fabrics",totalDownloads:7038,totalCrossrefCites:13,totalDimensionsCites:36,abstract:null,book:{id:"3137",slug:"eco-friendly-textile-dyeing-and-finishing",title:"Eco-Friendly Textile Dyeing and Finishing",fullTitle:"Eco-Friendly Textile Dyeing and Finishing"},signatures:"Sheila Shahidi, Jakub Wiener and Mahmood Ghoranneviss",authors:[{id:"58854",title:"Dr.",name:null,middleName:null,surname:"Shahidi",slug:"shahidi",fullName:"Shahidi"}]}],onlineFirstChaptersFilter:{topicId:"296",limit:6,offset:0},onlineFirstChaptersCollection:[],onlineFirstChaptersTotal:0},preDownload:{success:null,errors:{}},subscriptionForm:{success:null,errors:{}},aboutIntechopen:{},privacyPolicy:{},peerReviewing:{},howOpenAccessPublishingWithIntechopenWorks:{},sponsorshipBooks:{sponsorshipBooks:[],offset:8,limit:8,total:0},allSeries:{pteSeriesList:[{id:"14",title:"Artificial Intelligence",numberOfPublishedBooks:9,numberOfPublishedChapters:89,numberOfOpenTopics:6,numberOfUpcomingTopics:0,issn:"2633-1403",doi:"10.5772/intechopen.79920",isOpenForSubmission:!0},{id:"7",title:"Biomedical Engineering",numberOfPublishedBooks:12,numberOfPublishedChapters:104,numberOfOpenTopics:3,numberOfUpcomingTopics:0,issn:"2631-5343",doi:"10.5772/intechopen.71985",isOpenForSubmission:!0}],lsSeriesList:[{id:"11",title:"Biochemistry",numberOfPublishedBooks:31,numberOfPublishedChapters:314,numberOfOpenTopics:4,numberOfUpcomingTopics:0,issn:"2632-0983",doi:"10.5772/intechopen.72877",isOpenForSubmission:!0},{id:"25",title:"Environmental Sciences",numberOfPublishedBooks:1,numberOfPublishedChapters:11,numberOfOpenTopics:4,numberOfUpcomingTopics:0,issn:"2754-6713",doi:"10.5772/intechopen.100362",isOpenForSubmission:!0},{id:"10",title:"Physiology",numberOfPublishedBooks:11,numberOfPublishedChapters:141,numberOfOpenTopics:4,numberOfUpcomingTopics:0,issn:"2631-8261",doi:"10.5772/intechopen.72796",isOpenForSubmission:!0}],hsSeriesList:[{id:"3",title:"Dentistry",numberOfPublishedBooks:8,numberOfPublishedChapters:129,numberOfOpenTopics:2,numberOfUpcomingTopics:0,issn:"2631-6218",doi:"10.5772/intechopen.71199",isOpenForSubmission:!0},{id:"6",title:"Infectious Diseases",numberOfPublishedBooks:13,numberOfPublishedChapters:113,numberOfOpenTopics:3,numberOfUpcomingTopics:1,issn:"2631-6188",doi:"10.5772/intechopen.71852",isOpenForSubmission:!0},{id:"13",title:"Veterinary Medicine and Science",numberOfPublishedBooks:11,numberOfPublishedChapters:105,numberOfOpenTopics:3,numberOfUpcomingTopics:0,issn:"2632-0517",doi:"10.5772/intechopen.73681",isOpenForSubmission:!0}],sshSeriesList:[{id:"22",title:"Business, Management and Economics",numberOfPublishedBooks:1,numberOfPublishedChapters:18,numberOfOpenTopics:2,numberOfUpcomingTopics:1,issn:"2753-894X",doi:"10.5772/intechopen.100359",isOpenForSubmission:!0},{id:"23",title:"Education and Human Development",numberOfPublishedBooks:0,numberOfPublishedChapters:5,numberOfOpenTopics:1,numberOfUpcomingTopics:1,issn:null,doi:"10.5772/intechopen.100360",isOpenForSubmission:!0},{id:"24",title:"Sustainable Development",numberOfPublishedBooks:0,numberOfPublishedChapters:14,numberOfOpenTopics:5,numberOfUpcomingTopics:0,issn:null,doi:"10.5772/intechopen.100361",isOpenForSubmission:!0}],testimonialsList:[{id:"6",text:"It is great to work with the IntechOpen to produce a worthwhile collection of research that also becomes a great educational resource and guide for future research endeavors.",author:{id:"259298",name:"Edward",surname:"Narayan",institutionString:null,profilePictureURL:"https://mts.intechopen.com/storage/users/259298/images/system/259298.jpeg",slug:"edward-narayan",institution:{id:"3",name:"University of Queensland",country:{id:null,name:"Australia"}}}},{id:"13",text:"The collaboration with and support of the technical staff of IntechOpen is fantastic. The whole process of submitting an article and editing of the submitted article goes extremely smooth and fast, the number of reads and downloads of chapters is high, and the contributions are also frequently cited.",author:{id:"55578",name:"Antonio",surname:"Jurado-Navas",institutionString:null,profilePictureURL:"https://s3.us-east-1.amazonaws.com/intech-files/0030O00002bRisIQAS/Profile_Picture_1626166543950",slug:"antonio-jurado-navas",institution:{id:"720",name:"University of Malaga",country:{id:null,name:"Spain"}}}}]},series:{item:{id:"14",title:"Artificial Intelligence",doi:"10.5772/intechopen.79920",issn:"2633-1403",scope:"Artificial Intelligence (AI) is a rapidly developing multidisciplinary research area that aims to solve increasingly complex problems. In today's highly integrated world, AI promises to become a robust and powerful means for obtaining solutions to previously unsolvable problems. 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Prior to his appointment at Stellenbosch University, he has been at the University of Pretoria, Department of Computer Science (1998-2018), where he was appointed as South Africa Research Chair in Artifical Intelligence (2007-2018), the head of the Department of Computer Science (2008-2017), and Director of the Institute for Big Data and Data Science (2017-2018). 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He is a full professor of signal processing and pattern recognition and is head of the Signals and Communications Department at ULPGC, teaching from 2001 on subjects on signal processing and learning theory. His research lines are biometrics, biomedical signals and images, data mining, classification system, signal and image processing, machine learning, and environmental intelligence. He has researched in 52 international and Spanish research projects, some of them as head researcher. He is co-author of 4 books, co-editor of 27 proceedings books, guest editor for 8 JCR-ISI international journals, and up to 24 book chapters. He has over 450 papers published in international journals and conferences (81 of them indexed on JCR – ISI - Web of Science). He has published seven patents in the Spanish Patent and Trademark Office. He has been a supervisor on 8 Ph.D. theses (11 more are under supervision), and 130 master theses. He is the founder of The IEEE IWOBI conference series and the president of its Steering Committee, as well as the founder of both the InnoEducaTIC and APPIS conference series. He is an evaluator of project proposals for the European Union (H2020), Medical Research Council (MRC, UK), Spanish Government (ANECA, Spain), Research National Agency (ANR, France), DAAD (Germany), Argentinian Government, and the Colombian Institutions. He has been a reviewer in different indexed international journals (<70) and conferences (<250) since 2001. He has been a member of the IASTED Technical Committee on Image Processing from 2007 and a member of the IASTED Technical Committee on Artificial Intelligence and Expert Systems from 2011. \n\nHe has held the general chair position for the following: ACM-APPIS (2020, 2021), IEEE-IWOBI (2019, 2020 and 2020), A PPIS (2018, 2019), IEEE-IWOBI (2014, 2015, 2017, 2018), InnoEducaTIC (2014, 2017), IEEE-INES (2013), NoLISP (2011), JRBP (2012), and IEEE-ICCST (2005)\n\nHe is an associate editor of the Computational Intelligence and Neuroscience Journal (Hindawi – Q2 JCR-ISI). He was vice dean from 2004 to 2010 in the Higher Technical School of Telecommunication Engineers at ULPGC and the vice dean of Graduate and Postgraduate Studies from March 2013 to November 2017. He won the “Catedra Telefonica” Awards in Modality of Knowledge Transfer, 2017, 2018, and 2019 editions, and awards in Modality of COVID Research in 2020.\n\nPublic References:\nResearcher ID http://www.researcherid.com/rid/N-5967-2014\nORCID https://orcid.org/0000-0002-4621-2768 \nScopus Author ID https://www.scopus.com/authid/detail.uri?authorId=6602376272\nScholar Google https://scholar.google.es/citations?user=G1ks9nIAAAAJ&hl=en \nResearchGate https://www.researchgate.net/profile/Carlos_Travieso",institutionString:null,institution:{name:"University of Las Palmas de Gran Canaria",institutionURL:null,country:{name:"Spain"}}},editorTwo:null,editorThree:null},{id:"23",title:"Computational Neuroscience",coverUrl:"https://cdn.intechopen.com/series_topics/covers/23.jpg",isOpenForSubmission:!0,editor:{id:"14004",title:"Dr.",name:"Magnus",middleName:null,surname:"Johnsson",slug:"magnus-johnsson",fullName:"Magnus Johnsson",profilePictureURL:"https://mts.intechopen.com/storage/users/14004/images/system/14004.png",biography:"Dr Magnus Johnsson is a cross-disciplinary scientist, lecturer, scientific editor and AI/machine learning consultant from Sweden. \n\nHe is currently at Malmö University in Sweden, but also held positions at Lund University in Sweden and at Moscow Engineering Physics Institute. \nHe holds editorial positions at several international scientific journals and has served as a scientific editor for books and special journal issues. \nHis research interests are wide and include, but are not limited to, autonomous systems, computer modeling, artificial neural networks, artificial intelligence, cognitive neuroscience, cognitive robotics, cognitive architectures, cognitive aids and the philosophy of mind. \n\nDr. Johnsson has experience from working in the industry and he has a keen interest in the application of neural networks and artificial intelligence to fields like industry, finance, and medicine. \n\nWeb page: www.magnusjohnsson.se",institutionString:null,institution:{name:"Malmö University",institutionURL:null,country:{name:"Sweden"}}},editorTwo:null,editorThree:null},{id:"24",title:"Computer Vision",coverUrl:"https://cdn.intechopen.com/series_topics/covers/24.jpg",isOpenForSubmission:!0,editor:{id:"294154",title:"Prof.",name:"George",middleName:null,surname:"Papakostas",slug:"george-papakostas",fullName:"George Papakostas",profilePictureURL:"https://s3.us-east-1.amazonaws.com/intech-files/0030O00002hYaGbQAK/Profile_Picture_1624519712088",biography:"George A. Papakostas has received a diploma in Electrical and Computer Engineering in 1999 and the M.Sc. and Ph.D. degrees in Electrical and Computer Engineering in 2002 and 2007, respectively, from the Democritus University of Thrace (DUTH), Greece. Dr. Papakostas serves as a Tenured Full Professor at the Department of Computer Science, International Hellenic University, Greece. Dr. Papakostas has 10 years of experience in large-scale systems design as a senior software engineer and technical manager, and 20 years of research experience in the field of Artificial Intelligence. Currently, he is the Head of the “Visual Computing” division of HUman-MAchines INteraction Laboratory (HUMAIN-Lab) and the Director of the MPhil program “Advanced Technologies in Informatics and Computers” hosted by the Department of Computer Science, International Hellenic University. He has (co)authored more than 150 publications in indexed journals, international conferences and book chapters, 1 book (in Greek), 3 edited books, and 5 journal special issues. His publications have more than 2100 citations with h-index 27 (GoogleScholar). His research interests include computer/machine vision, machine learning, pattern recognition, computational intelligence. \nDr. Papakostas served as a reviewer in numerous journals, as a program\ncommittee member in international conferences and he is a member of the IAENG, MIR Labs, EUCogIII, INSTICC and the Technical Chamber of Greece (TEE).",institutionString:null,institution:{name:"International Hellenic University",institutionURL:null,country:{name:"Greece"}}},editorTwo:null,editorThree:null},{id:"25",title:"Evolutionary Computation",coverUrl:"https://cdn.intechopen.com/series_topics/covers/25.jpg",isOpenForSubmission:!0,editor:{id:"136112",title:"Dr.",name:"Sebastian",middleName:null,surname:"Ventura Soto",slug:"sebastian-ventura-soto",fullName:"Sebastian Ventura Soto",profilePictureURL:"https://mts.intechopen.com/storage/users/136112/images/system/136112.png",biography:"Sebastian Ventura is a Spanish researcher, a full professor with the Department of Computer Science and Numerical Analysis, University of Córdoba. Dr Ventura also holds the positions of Affiliated Professor at Virginia Commonwealth University (Richmond, USA) and Distinguished Adjunct Professor at King Abdulaziz University (Jeddah, Saudi Arabia). Additionally, he is deputy director of the Andalusian Research Institute in Data Science and Computational Intelligence (DaSCI) and heads the Knowledge Discovery and Intelligent Systems Research Laboratory. He has published more than ten books and over 300 articles in journals and scientific conferences. Currently, his work has received over 18,000 citations according to Google Scholar, including more than 2200 citations in 2020. In the last five years, he has published more than 60 papers in international journals indexed in the JCR (around 70% of them belonging to first quartile journals) and he has edited some Springer books “Supervised Descriptive Pattern Mining” (2018), “Multiple Instance Learning - Foundations and Algorithms” (2016), and “Pattern Mining with Evolutionary Algorithms” (2016). He has also been involved in more than 20 research projects supported by the Spanish and Andalusian governments and the European Union. He currently belongs to the editorial board of PeerJ Computer Science, Information Fusion and Engineering Applications of Artificial Intelligence journals, being also associate editor of Applied Computational Intelligence and Soft Computing and IEEE Transactions on Cybernetics. Finally, he is editor-in-chief of Progress in Artificial Intelligence. He is a Senior Member of the IEEE Computer, the IEEE Computational Intelligence, and the IEEE Systems, Man, and Cybernetics Societies, and the Association of Computing Machinery (ACM). Finally, his main research interests include data science, computational intelligence, and their applications.",institutionString:null,institution:{name:"University of Córdoba",institutionURL:null,country:{name:"Spain"}}},editorTwo:null,editorThree:null},{id:"26",title:"Machine Learning and Data Mining",coverUrl:"https://cdn.intechopen.com/series_topics/covers/26.jpg",isOpenForSubmission:!0,editor:{id:"24555",title:"Dr.",name:"Marco Antonio",middleName:null,surname:"Aceves Fernandez",slug:"marco-antonio-aceves-fernandez",fullName:"Marco Antonio Aceves Fernandez",profilePictureURL:"https://mts.intechopen.com/storage/users/24555/images/system/24555.jpg",biography:"Dr. Marco Antonio Aceves Fernandez obtained his B.Sc. (Eng.) in Telematics from the Universidad de Colima, Mexico. He obtained both his M.Sc. and Ph.D. from the University of Liverpool, England, in the field of Intelligent Systems. He is a full professor at the Universidad Autonoma de Queretaro, Mexico, and a member of the National System of Researchers (SNI) since 2009. Dr. Aceves Fernandez has published more than 80 research papers as well as a number of book chapters and congress papers. He has contributed in more than 20 funded research projects, both academic and industrial, in the area of artificial intelligence, ranging from environmental, biomedical, automotive, aviation, consumer, and robotics to other applications. He is also a honorary president at the National Association of Embedded Systems (AMESE), a senior member of the IEEE, and a board member of many institutions. 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Dr. Aydin is currently a Fellow of Higher Education Academy, UK, a member of EPSRC College, a senior member of IEEE and a senior member of ACM. In addition to being a member of advisory committees of many international conferences, he is an Editorial Board Member of various peer-reviewed international journals. He has served as guest editor for a number of special issues of peer-reviewed international journals.",institutionString:null,institution:{name:"University of the West of England",institutionURL:null,country:{name:"United Kingdom"}}},editorTwo:null,editorThree:null}]},overviewPageOFChapters:{paginationCount:19,paginationItems:[{id:"82196",title:"Multi-Features Assisted Age Invariant Face Recognition and Retrieval Using CNN with Scale Invariant Heat Kernel Signature",doi:"10.5772/intechopen.104944",signatures:"Kamarajugadda Kishore Kumar and Movva Pavani",slug:"multi-features-assisted-age-invariant-face-recognition-and-retrieval-using-cnn-with-scale-invariant-",totalDownloads:6,totalCrossrefCites:0,totalDimensionsCites:0,authors:null,book:{title:"Pattern Recognition - New Insights",coverURL:"https://cdn.intechopen.com/books/images_new/11442.jpg",subseries:{id:"26",title:"Machine Learning and Data Mining"}}},{id:"82063",title:"Evaluating Similarities and Differences between Machine Learning and Traditional Statistical Modeling in Healthcare Analytics",doi:"10.5772/intechopen.105116",signatures:"Michele Bennett, Ewa J. Kleczyk, Karin Hayes and Rajesh Mehta",slug:"evaluating-similarities-and-differences-between-machine-learning-and-traditional-statistical-modelin",totalDownloads:6,totalCrossrefCites:0,totalDimensionsCites:0,authors:null,book:{title:"Machine Learning and Data Mining - Annual Volume 2022",coverURL:"https://cdn.intechopen.com/books/images_new/11422.jpg",subseries:{id:"26",title:"Machine Learning and Data Mining"}}},{id:"81791",title:"Self-Supervised Contrastive Representation Learning in Computer Vision",doi:"10.5772/intechopen.104785",signatures:"Yalin Bastanlar and Semih Orhan",slug:"self-supervised-contrastive-representation-learning-in-computer-vision",totalDownloads:23,totalCrossrefCites:0,totalDimensionsCites:0,authors:null,book:{title:"Pattern Recognition - New Insights",coverURL:"https://cdn.intechopen.com/books/images_new/11442.jpg",subseries:{id:"26",title:"Machine Learning and Data Mining"}}},{id:"79345",title:"Application of Jump Diffusion Models in Insurance Claim Estimation",doi:"10.5772/intechopen.99853",signatures:"Leonard Mushunje, Chiedza Elvina Mashiri, Edina Chandiwana and Maxwell Mashasha",slug:"application-of-jump-diffusion-models-in-insurance-claim-estimation-1",totalDownloads:8,totalCrossrefCites:0,totalDimensionsCites:0,authors:null,book:{title:"Data Clustering",coverURL:"https://cdn.intechopen.com/books/images_new/10820.jpg",subseries:{id:"26",title:"Machine Learning and Data Mining"}}}]},overviewPagePublishedBooks:{paginationCount:9,paginationItems:[{type:"book",id:"7723",title:"Artificial Intelligence",subtitle:"Applications in Medicine and Biology",coverURL:"https://cdn.intechopen.com/books/images_new/7723.jpg",slug:"artificial-intelligence-applications-in-medicine-and-biology",publishedDate:"July 31st 2019",editedByType:"Edited by",bookSignature:"Marco Antonio Aceves-Fernandez",hash:"a3852659e727f95c98c740ed98146011",volumeInSeries:1,fullTitle:"Artificial Intelligence - Applications in Medicine and Biology",editors:[{id:"24555",title:"Dr.",name:"Marco Antonio",middleName:null,surname:"Aceves Fernandez",slug:"marco-antonio-aceves-fernandez",fullName:"Marco Antonio Aceves Fernandez",profilePictureURL:"https://mts.intechopen.com/storage/users/24555/images/system/24555.jpg",biography:"Dr. Marco Antonio Aceves Fernandez obtained his B.Sc. (Eng.) in Telematics from the Universidad de Colima, Mexico. He obtained both his M.Sc. and Ph.D. from the University of Liverpool, England, in the field of Intelligent Systems. He is a full professor at the Universidad Autonoma de Queretaro, Mexico, and a member of the National System of Researchers (SNI) since 2009. Dr. Aceves Fernandez has published more than 80 research papers as well as a number of book chapters and congress papers. He has contributed in more than 20 funded research projects, both academic and industrial, in the area of artificial intelligence, ranging from environmental, biomedical, automotive, aviation, consumer, and robotics to other applications. He is also a honorary president at the National Association of Embedded Systems (AMESE), a senior member of the IEEE, and a board member of many institutions. 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Dr. Khalid\\'s research interests include leadership and negotiations, digital transformations, gamification, eLearning, blockchain, Big Data, and management of information technology. Dr. Bilal Khalid also serves as an academic editor at Education Research International and a reviewer for international journals.",institutionString:"KMITL Business School",institution:{name:"King Mongkut's Institute of Technology Ladkrabang",country:{name:"Thailand"}}},{id:"418514",title:"Dr.",name:"Muhammad",middleName:null,surname:"Mohiuddin",slug:"muhammad-mohiuddin",fullName:"Muhammad Mohiuddin",position:null,profilePictureURL:"https://s3.us-east-1.amazonaws.com/intech-files/0033Y000038UqSfQAK/Profile_Picture_2022-05-13T10:39:03.jpg",biography:"Dr. Muhammad Mohiuddin is an Associate Professor of International Business at Laval University, Canada. He has taught at Thompson Rivers University, Canada; University of Paris-Est, France; Osnabruck University of Applied Science, Germany; and Shanghai Institute of Technology and Tianjin University of Technology, China. He has published research in Research Policy, Applied Economics, Review of Economic Philosophy, Strategic Change, International Journal of Logistics, Sustainability, Journal of Environmental Management, Journal of Global Information Management, Journal of Cleaner Production, M@N@GEMENT, and more. He is a member of CEDIMES Institut (France), Academy of International Business (AIB), Strategic Management Society (SMS), Academy of Management (AOM), Administrative Science Association of Canada (ASAC), and Canadian council of small business and entrepreneurship (CCSBE). He is currently the director of the Research Group on Contemporary Asia (GERAC) at Laval University. 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