Open access

Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

Written By

Frederic Raynal

Submitted: 26 April 2011 Published: 11 April 2012

DOI: 10.5772/33948

From the Edited Volume

Electroplating

Edited by Darwin Sebayang and Sulaiman Bin Haji Hasan

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Written By

Frederic Raynal

Submitted: 26 April 2011 Published: 11 April 2012