Open access peer-reviewed chapter

Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

Written By

Frederic Raynal

Submitted: April 26th, 2011 Reviewed: October 11th, 2011 Published: April 11th, 2012

DOI: 10.5772/33948

From the Edited Volume

Electroplating

Edited by Darwin Sebayang and Sulaiman Bin Haji Hasan

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Written By

Frederic Raynal

Submitted: April 26th, 2011 Reviewed: October 11th, 2011 Published: April 11th, 2012