Open access peer-reviewed chapter

Air Cooling Module Applications to Consumer-Electronic Products

By Jung-Chang Wang and Sih-Li Chen

Submitted: February 15th 2011Reviewed: August 10th 2011Published: December 22nd 2011

DOI: 10.5772/27031

Downloaded: 3214

© 2011 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Jung-Chang Wang and Sih-Li Chen (December 22nd 2011). Air Cooling Module Applications to Consumer-Electronic Products, Heat Transfer - Engineering Applications, Vyacheslav S. Vikhrenko, IntechOpen, DOI: 10.5772/27031. Available from:

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