Open access peer-reviewed chapter

Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding

Written By

Hsiang-Chen Hsu, Chin-Yuan Hu, Wei-Yao Chang, Chang-Lin Yeh and Yi-Shao Lai

Published: August 17th, 2010

DOI: 10.5772/intechopen.83992

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Written By

Hsiang-Chen Hsu, Chin-Yuan Hu, Wei-Yao Chang, Chang-Lin Yeh and Yi-Shao Lai

Published: August 17th, 2010