Open access peer-reviewed chapter

Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

By Frederic Raynal

Submitted: April 26th 2011Reviewed: October 11th 2011Published: April 11th 2012

DOI: 10.5772/33948

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Frederic Raynal (April 11th 2012). Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias, Electroplating, Darwin Sebayang and Sulaiman Bin Haji Hasan, IntechOpen, DOI: 10.5772/33948. Available from:

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