Open access peer-reviewed chapter

Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias

By Frederic Raynal

Submitted: April 26th 2011Reviewed: October 11th 2011Published: April 11th 2012

DOI: 10.5772/33948

Downloaded: 2826

© 2012 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to cite and reference

Link to this chapter Copy to clipboard

Cite this chapter Copy to clipboard

Frederic Raynal (April 11th 2012). Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias, Electroplating, Darwin Sebayang and Sulaiman Bin Haji Hasan, IntechOpen, DOI: 10.5772/33948. Available from:

chapter statistics

2826total chapter downloads

2Crossref citations

More statistics for editors and authors

Login to your personal dashboard for more detailed statistics on your publications.

Access personal reporting

Related Content

This Book

Next chapter

Biomass Adsorbent for Removal of Toxic Metal Ions From Electroplating Industry Wastewater

By Ronaldo Ferreira do. Nascimento, Francisco Wagner de Sousa, Vicente Oliveira Sousa Neto, Pierre Basílio Almeida Fechine, Raimundo Nonato Pereira Teixeira, Paulo de Tarso C. Freire and Marcos Antônio Araujo-Silva

Related Book

First chapter

Thermodynamics of Ion Exchange

By Ayben Kilislioğlu

We are IntechOpen, the world's leading publisher of Open Access books. Built by scientists, for scientists. Our readership spans scientists, professors, researchers, librarians, and students, as well as business professionals. We share our knowledge and peer-reveiwed research papers with libraries, scientific and engineering societies, and also work with corporate R&D departments and government entities.

More About Us