Dongfang Yang

National Research Council Canada

Dongfang Yang received his Ph.D. in physical chemistry from the University of Guelph (Ontario) in 1995. He joined the National Research Council of Canada in London, Ontario, in 2001 and is now a senior research officer. His current research interests include laser materials processing; pulsed laser, sputtering, and e-beam deposition of thin films; new materials development for energy storage devices; chemical and optical sensor development; and electrochemical studies of organic adsorption and self-assembly monolayers. He is an editor/member of the editorial board for over eleven scientific journals and was listed among the top 2% of most-cited scientists in 2020, according to a recent Stanford study. He received the IAAM Scientist Award and Medal in 2021 and was named a Vebleo Fellow in 2022.

5books edited

1chapters authored

Latest work with IntechOpen by Dongfang Yang

A thin film is a layer of material ranging from fractions of a nanometer to several micrometers in thickness. Thin films have been employed in many applications to provide surfaces that possess specific optical, electronic, chemical, mechanical and thermal properties. Through ten chapters consisting of original research studies and literature reviews written by experts from the international scientific community, this book covers the deposition and application of thin films.

Go to the book

Thin Films

Edited by Dongfang Yang

Books edited

By Katherine Lochhead, Eric Johlin and Dongfang Yang

Long-term stability is a requisite for the widespread adoption and commercialization of perovskite solar cells (PSCs). Encapsulation constitutes one of the most promising ways to extend devices for lifetime without noticeably sacrificing the high power conversion efficiencies that make this technology attractive. Among encapsulation strategies, the most investigated methods are as follows: (1) glass-to-glass encapsulation, (2) polymer encapsulation, and (3) inorganic thin film encapsulation (TFE). In particular, the use of UV-, heat-, water-, and/or oxygen-resistant thin films to encapsulate PSCs is a new and promising strategy for extending devices for lifetime. Thin films can be deposited directly onto the PSC, as in TFE, or can be used in conjunction with glass-to-glass and polymer encapsulation to effectively prevent the photo-, thermal-, oxygen-, and moisture-induced degradation of the perovskite. This chapter will outline perovskite degradation mechanisms and provide a summary of the progress made to-date in the encapsulation of PSCs, with a particular focus on the most recent and promising advances that employ thin films. Additionally, the strengths and limitations of TFE approaches will be identified and contrasted against existing encapsulation strategies. Finally, possible directions for future research that can further enhance encapsulation effectiveness and extend PSC for lifetimes towards the 25-year target will be proposed.

Part of the book: Thin Films