Open access peer-reviewed Edited Volume

Charged Particle Scattering

Kuan Chee

University of Science and Technology of China Email


ultra-high vacuum (UHV) electron microscopy helium ion microscopy 2D materials Compton scattering Rutherford scattering M?ller scattering Bhabha scattering Bremsstrahlung scattering Electron beam lithography ion beam lithography Optical materials and devices

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About the book

Modern-day​ electronics have thrived on the foundations of experimental charged particle scattering results. Since the discovery of the electron by JJ Thompson in 1897, the physics of electron scattering has been extensively studied and exploited in fields ranging from the development of analytical tools and techniques for instrumentation and measurement to the study of structural, electronic and optical properties in materials and devices. Applications of charged particle scattering are found in high-resolution microscopy, studies of the structure of the nucleus and modeling of electron-beam lithography processes, for example; or understanding thin film deposition processes, transport properties in 2D materials, as well as at internal interfaces and multilayers, and at surfaces, of bulk materials.

Here, the book provides coverage on a range of advanced research that rests on the different types of scattering in particle physics, viz Compton scattering, Rutherford scattering, Møller scattering, Mott scattering, Bhabha scattering, Bremsstrahlung scattering, deep inelastic scattering, and synchrotron emission, for example. Written by a team of internationally renowned experts, with contributions from universities, research institutes and industries, this book is suitable for students and professors, researchers, engineers and scientists, who are interested in staying up to date with state-of-the-art fundamental and technological developments in the application of charged particle scattering with solids such as metals, semiconductors and insulators, for advanced characterizations of materials as well as of the limiting factors in the fabrication and performance of say, integrated circuits and transistors.

Publishing process

Book initiated and editor appointed

Date completed: November 15th 2019

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline Extended: Open for Submissions

Potential authors submit chapter proposals ready for review by the academic editor and our publishing review team.

Approved chapters written in full and submitted

Deadline for full chapters: May 16th 2020

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: August 4th 2020

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

Book compiled, published and promoted

Expected publication date: October 3rd 2020

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About the editor

Kuan Chee

University of Science and Technology of China Email

Kuan W. A. Chee is Outstanding Professor at the Shandong Academy of Sciences and head of the Optoelectronics Materials Laboratory. He is also a Chief Technology Officer in the mechatronics industry. He has a diverse background in leading high-tech industries and academia. He has published in several top journals, books, and conference proceedings and has given numerous talks at international conferences and seminars in science and engineering. His research covers electronic design, nano- and post-CMOS electronics, and photonic and optoelectronic devices. He has received prizes and awards such as from the Institution of Engineering and Technology, UK; the Institute of Physics, UK; the Institute of Electrical and Electronics Engineers, USA; the Royal Academy of Engineering, UK; the Materials Research Society; and the Cambridge Philosophical Society. Prof. Chee is supported by a science and engineering talent program in China.

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Book chapters authored 2

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