Open access peer-reviewed Edited Volume

Electronics Cooling

Ahmed Alhusseny

University of Manchester

Dr. Alhusseny has completed his Ph.D. at the University of Manchester, with which he is still associated as a visiting researcher, and he is also the head of the Branch of Air-conditioning and Refrigeration Engineering at the University of Kufa.

Co-editors:

Nabeel Al-Zurfi

University of Manchester

Dr. Al-Zurfi received a Ph.D. in Mechanical Engineering / Heat transfer and fluid flow from the University of Manchester, England in 2016, he is an expert in turbulence numerical methods, especially, Large Eddy Simulation method.

Adel Nasser

University of Manchester

Dr. Nasser received a Ph.D. in mechanical engineering from the UMIST, the UK in 1990, later he worked in the Computer Graphics Unit at the University of Manchester and at the Information System Department in the UMIST. Currently, he is a member of academic staff at the School of Mechanical, Aerospace and Civil Engineering, University of Manchester, where he has supervised a number of postgraduates students.

Covering

Thermal Environment Cooling Load Dielectric Thermal-Conductive Materials Junction-Ambient Thermal Resistance Pin-Fins Heat Sinks Foam Heat Sinks Microchannel Heat Sinks Printed Circuit Boards Configuration Direct Cooling Indirect Cooling Two-Phase Flow Cooling Dielectric Heat Transfer Fluids

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About the book

With the noticeably accelerated development in the microelectronic industry and telecommunication technology, electronic components used in such devices have become of higher performance, lighter weight, and more miniaturized. Nowadays, high-power electronic chips are being fabricated in a limited space available for heat dissipation, which results in a high heat density within the electronic components. Accordingly, the reliability and safety of electronic devices will be jeopardized if the heat generated within them is not properly controlled. The rate of failure in electronic equipment rises seriously while increasing the operating temperatures to excessive levels. High thermal expansion due to operation under harsh thermal conditions leads to serious stresses across the solder joints of electronic components mounted on PCBs. Therefore, thermal control has become of increasing importance while designing and operating electronic equipment.

This book is dedicated to discussing a variety of cooling ways commonly utilized in electronics including the conduction cooling, cooling by natural convection and/or radiation, air forced convection cooling, liquid cooling, and immersion cooling. It is aimed to present innovative designs of such cooling techniques with the desire for having effective heat dissipation, low fabrication and operation cost, and compactness.

Publishing process

Book initiated and editor appointed

Date completed: October 5th 2020

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline for chapter proposals: November 2nd 2020

Potential authors submit chapter proposals ready for review by the academic editor and our publishing review team.

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Approved chapters written in full and submitted

Deadline for full chapters: January 1st 2021

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: March 22nd 2021

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

Book compiled, published and promoted

Expected publication date: May 21st 2021

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About the editor

Ahmed Alhusseny

University of Manchester

Ahmed Alhusseny had been awarded his BSc and MSc in air conditioning and refrigeration engineering from the University of Technology, Baghdad, Iraq in 2001 and 2005, respectively. Afterward, he worked as a member of academic staff at the Faculty of Engineering, University of Kufa, Iraq. Then, Ahmed has done a Ph.D. research entitled "Heat Transfer Enhancement Using Rotating Metallic Porous Media" at the University of Manchester, UK. Since May 2016, he has been awarded the Ph.D. degree in mechanical engineering from the School of Mechanical, Aerospace, and Civil Engineering/ University of Manchester. Dr. Alhusseny is still associated with the University of Manchester as a Visiting Researcher although he has recently returned to Iraq and restarted his former job there as a member of academic staff, where he is currently acting as an assistant professor in the Department of Mechanical Engineering and the head of the Branch of Air-conditioning and Refrigeration Engineering there. Besides his publications in a variety of leading scientific journals, he acts as a peer-reviewer for several international journals.

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