About the book
With the noticeably accelerated development in the microelectronic industry and telecommunication technology, electronic components used in such devices have become of higher performance, lighter weight, and more miniaturized. Nowadays, high-power electronic chips are being fabricated in a limited space available for heat dissipation, which results in a high heat density within the electronic components. Accordingly, the reliability and safety of electronic devices will be jeopardized if the heat generated within them is not properly controlled. The rate of failure in electronic equipment rises seriously while increasing the operating temperatures to excessive levels. High thermal expansion due to operation under harsh thermal conditions leads to serious stresses across the solder joints of electronic components mounted on PCBs. Therefore, thermal control has become of increasing importance while designing and operating electronic equipment.
This book is dedicated to discussing a variety of cooling ways commonly utilized in electronics including the conduction cooling, cooling by natural convection and/or radiation, air forced convection cooling, liquid cooling, and immersion cooling. It is aimed to present innovative designs of such cooling techniques with the desire for having effective heat dissipation, low fabrication and operation cost, and compactness.