About the book
Atomic layer deposition (ALD) is a technique with a very long history, but its applications have been limited for a long time, mainly due to its low deposition rate, compared to the thermal CVD and other thin-film growth technologies. However, the rise of nanotechnology has led to the need of deposition techniques able to achieve a high conformality on systems of nanometric size and extremely high aspect ratio, and ALD is the best suited technique to address these needs, due to its peculiar characteristics. In fact, the self-saturating growth process of ALD provides the ability to obtain high conformality, thickness control and composition control at a level that is not achievable using other techniques. While in the past the applications of ALD were limited by the small range of materials that could be grown, the number of chemical compositions that can be obtained has increased considerably in recent years, thus continuously increasing the number of possible applications. Recent research developments have also led to the achievement of ALD processes at atmospheric pressure, characterized by a lower cost and a much higher deposition rate. This book intends to present both fundamental aspects of the ALD process and recent applications, with the aim of presenting a comprehensive review of the recent research developments related to this technique.