Open access peer-reviewed Edited Volume

Soldering - New Techniques and Approaches

Ashutosh Sharma

Ajou University

A pioneering scientist in the field of advanced microelectronic packaging and fabrication technologies, holder of Extraction and Processing Division (2016) Award, TMS USA, and 17 registered patents and several publications.

Covering

Materials Conventional Soldering Modern Soldering Shear Strength Wetting Intermetallic Growth Kinetics Fracture Toughness Solder Pastes Solder-Joints Wire Bonding Flip Chip Packages Metallization

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About the book

This book on "Soldering - New Techniques and Approaches" will intend to provide a comprehensive discussion into the diverse topics in soldering and modern interconnection technology. One of the goals of the book will be to bridge this gap while moving from conventional to advanced lead-free soldering technology. Recent developments in high-density interconnection require the development of cost-effective and lightweight miniaturized devices such as flip-chip packages and through Si via technology. The micro joining of these miniaturized appliances needs low-cost interconnect materials and approaches in a practical scenario. The evolution of microelectronic devices and circuits towards drastic miniaturization and high density-high speed platforms for rapid data processing necessitates the development of new advanced and reliable solder materials. The usage of conventional Sn-Pb solders has been now regulated worldwide due to the various toxicity issues and directives, i.e., the Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment (WEEE), and End-of-Life Vehicles (ELV). This book will aim to cover a broad overview of modern soldering and micro joining materials and new technologies developed over the years in this discipline.

Publishing process

Book initiated and editor appointed

Date completed: March 25th 2022

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline for chapter proposals: June 1st 2022

Potential authors submit chapter proposals ready for review by the academic editor and our publishing review team.

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Approved chapters written in full and submitted

Deadline for full chapters: July 31st 2022

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: October 19th 2022

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

Book compiled, published and promoted

Expected publication date: December 18th 2022

All chapters are copy-checked and typesetted before being published. IntechOpen regularly submits its books to major databases for evaluation and coverage, including the Clarivate Analytics Book Citation Index in the Web of ScienceTM Core Collection. Other discipline-specific databases are also targeted, such as Web of Science's BIOSIS Previews.

About the editor

Ashutosh Sharma

Ajou University

Ashutosh Sharma is currently working in the Department of Materials Science and Engineering, Ajou University, Suwon, South Korea. He earned his Ph.D. degree in Metallurgical and Materials Engineering from the Indian Institute of Technology (IIT) Kharagpur, India. His research interests include electrochemical deposition, lead-free soldering and brazing, additive manufacturing, high entropy alloys, gas sensors, and composites. Dr. Sharma is a life member of various scientific and professional bodies. In a very short time, he has contributed more than 100 international journals, 17 patents, 7 book chapters, and 1 authored book, and 1 edited book so far. Recently, he was awarded the Extraction and Processing Division (EPD) Award by The Minerals, Metals and Materials (TMS, USA) in 2016 in recognition of his outstanding research in the area of nonferrous materials processing.

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Book chapters authored 3

Books edited 1

Introducing your Author Service Manager

Ms. Dolores Kuzelj

As an Author Service Manager my responsibilities include monitoring and facilitating all publishing activities for authors and editors. From chapter submission and review, to approval and revision, copyediting and design, until final publication, I work closely with authors and editors to ensure a simple and easy publishing process. I maintain constant and effective communication with authors, editors and reviewers, which allows for a level of personal support that enables contributors to fully commit and concentrate on the chapters they are writing, editing, or reviewing. I assist authors in the preparation of their full chapter submissions and track important deadlines and ensure they are met. I help to coordinate internal processes such as linguistic review, and monitor the technical aspects of the process. As an ASM I am also involved in the acquisition of editors. Whether that be identifying an exceptional author and proposing an editorship collaboration, or contacting researchers who would like the opportunity to work with IntechOpen, I establish and help manage author and editor acquisition and contact.

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