About the book
This book on "Soldering - New Techniques and Approaches" will intend to provide a comprehensive discussion into the diverse topics in soldering and modern interconnection technology. One of the goals of the book will be to bridge this gap while moving from conventional to advanced lead-free soldering technology. Recent developments in high-density interconnection require the development of cost-effective and lightweight miniaturized devices such as flip-chip packages and through Si via technology. The micro joining of these miniaturized appliances needs low-cost interconnect materials and approaches in a practical scenario. The evolution of microelectronic devices and circuits towards drastic miniaturization and high density-high speed platforms for rapid data processing necessitates the development of new advanced and reliable solder materials. The usage of conventional Sn-Pb solders has been now regulated worldwide due to the various toxicity issues and directives, i.e., the Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment (WEEE), and End-of-Life Vehicles (ELV). This book will aim to cover a broad overview of modern soldering and micro joining materials and new technologies developed over the years in this discipline.