Open access peer-reviewed Edited Volume

Thin Film Deposition - Fundamentals, Processes, and Applications

Dongfang Yang

National Research Council Canada

Dr. Yang is a distinguished senior researcher and expert in laser materials processing, pulsed laser, and e-beam deposition of thin films. Previously affiliated with the University of Ottawa, University of Brunswick, and the University of Guelph, where he was awarded his Ph.D. degree in 1995. Dr. Yang was awarded the title of World's Top 2% Scientists by Stanford University and IAAM Scientist Award and Medal in 2021.


Thin-Film Photovoltaics Thin-Film Batteries Plasmonic Devices Semiconductors Organic Electronics Superconductor Oxide Films Growth Mechanisms Epitaxy Uniformity Grain Size Sputtering Pulsed Laser Deposition

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About the book

A thin film is a layer with a thickness ranging from less than a nanometer to several micrometers which are deposited on the surface of bulk solid materials. The purpose of a thin film is to provide distinct optical, electronic, magnetic, chemical, mechanical, and thermal properties that bulk solid materials do not possess. Depending on the materials used and the desired properties, thin films can be fabricated by various deposition processes. These include physical methods (e.g. sputtering, E-beam evaporation, pulsed laser deposition, cathodic arc deposition, molecular beam epitaxy, and evaporation), and chemical methods (e.g. chemical vapor deposition, sol-gel, spray pyrolysis, atomic layer deposition, and electroplating). Thin films are widely used for many industrial applications, including as optical coatings (antireflective, and self-cleaning coatings) for lenses, windows, and optoelectronic devices; for energy generation (e.g. thin-film photovoltaics) and storage (thin-film batteries and supercapacitors); in gas- and bio-sensors; in electronic semiconductor devices (e.g. transistors); as hard coatings on cutting tools, modules and dies; as decorative coatings; and as bio-compatible coatings for medical implants and thin-film drug delivery. The prevalence of thin films across so many fields of research leads to a rapidly evolving technology where many impactful strides to optimize deposition processes and realize novel applications have been made recently.

This book intends to provide a comprehensive overview of the fundamentals, challenges, and trends in thin-film technologies, the recent advances in thin film deposition techniques, as well as the characterization and applications of thin films.

Publishing process

Book initiated and editor appointed

Date completed: March 2nd 2022

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline Extended: Open for Submissions

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Deadline for full chapters: May 29th 2022

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: August 17th 2022

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

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Expected publication date: October 16th 2022

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About the editor

Dongfang Yang

National Research Council Canada

Dongfang Yang received his Ph.D. in Physical Chemistry from the University of Guelph in 1995. He joined the National Research Council Canada in London Ontario in 2001 and is now a Senior Research Officer. His current research interests include laser materials processing; pulsed laser, sputtering and e-beam deposition of thin films; new materials development for energy storage devices; chemical and optical sensors development; and electrochemical studies of organic adsorption and self-assembly monolayer. He is currently serving as an editor or editorial board member for ten scientific journals and was listed among the top 2% most-cited scientists according to a Stanford study in 2020. He also holds an adjunct professorship at Western University, Ontario, Canada.

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