Open access peer-reviewed Edited Volume

Electrospinning - Material Technology of the Future

Tomasz Arkadiusz Tański

Silesian University of Technology

A recognized expert in the field of materials engineering and nanotechnology, author of over 400 scientific studies, and winner of numerous international awards.

Covering

Electrostatic Repulsion One-Dimensional Nanostructures Mechanical Properties Optoelectronic Properties Flow Rate Nanostructural Reinforcement Semiconductors Optical Parameters Photocatalysis Biocompatibility Hybrid Nanocomposites Portable

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About the book

The evolution of virtually all fields of science and industry is inextricably linked with access to modern functional materials with special physical properties. The development of material technologies based on efficiency, economy and environmental impact is also of great importance. In view of the challenges of the future in the field of sustainable industrial development, it is necessary to constantly search for materials that enable the implementation of the designers' assumptions. One of the most promising directions for the materials engineering based on materials with special properties (electrical, optical, mechanical, chemical) is the nano-scale operation. The famous saying of prof. Richard Feynman "There's Plenty of Space at the Bottom" is a great illustration of the possibilities of nanotechnology. In the case of nano-structured materials, the reduction to the nano-scale size results in a complete change of physical properties, eg.mechanical, electrical, and causes known materials to be somehow rediscovered.

Therefore, the aim of the presented work is to briefly describe the latest research on one of the most interesting directions of material nanoengineering. The use of the modern technique of producing nanostructures, which is electrospinning, allows to obtain one-dimensional nanometric structures, both organic and inorganic, in a fast, economical process with low environmental impact. The work contains information on the basics of technology and detailed descriptions of individual parameters along with their influence on the structure and properties of the obtained materials. As shown by the available research, the perspective use of one-dimensional materials is extremely wide, it includes, among others, automotive, electronics, optics, medicine, environmental protection. Hence the necessity to collect and catalog the available information in a compact form of the presented book. In addition, the book will describe the prospects for the future development of electrospun materials with regard to applications.

Publishing process

Book initiated and editor appointed

Date completed: September 2nd 2021

Applications to edit the book are assessed and a suitable editor is selected, at which point the process begins.

Chapter proposals submitted and reviewed

Deadline for chapter proposals: September 30th 2021

Potential authors submit chapter proposals ready for review by the academic editor and our publishing review team.

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Approved chapters written in full and submitted

Deadline for full chapters: November 29th 2021

Once approved by the academic editor and publishing review team, chapters are written and submitted according to pre-agreed parameters

Full chapters peer reviewed

Review results due: February 17th 2022

Full chapter manuscripts are screened for plagiarism and undergo a Main Editor Peer Review. Results are sent to authors within 30 days of submission, with suggestions for rounds of revisions.

Book compiled, published and promoted

Expected publication date: April 18th 2022

All chapters are copy-checked and typesetted before being published. IntechOpen regularly submits its books to major databases for evaluation and coverage, including the Clarivate Analytics Book Citation Index in the Web of ScienceTM Core Collection. Other discipline-specific databases are also targeted, such as Web of Science's BIOSIS Previews.

About the editor

Tomasz Arkadiusz Tański

Silesian University of Technology

Prof. Tomasz Tański is the Head of the Department of Engineering Materials and Biomaterials Silesian University of Technology, a Member of the Metallurgy Section of Committee of Metallurgy of the Polish Academy of Sciences, a specialist in materials non-ferrous alloys, composite materials and nanostructured, manufacturing engineering, surface, study the properties and structure engineering materials, authored or co-authored more than 400 scientific publications worldwide including 15 monographs and books, more than 90 publications in the Philadelphia list, won 20awards and honors national and international, is/and or was a supervisor or contractor more than 15 research and didactic projects in Poland and abroad and reviewer and promoter of numerous scientific papers, including 8 doctoral research in the field of nanotechnology and materials.

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Book chapters authored 10

Books edited 6

Introducing your Author Service Manager

Ms. Andrea Tomurad

As an Author Service Manager my responsibilities include monitoring and facilitating all publishing activities for authors and editors. From chapter submission and review, to approval and revision, copyediting and design, until final publication, I work closely with authors and editors to ensure a simple and easy publishing process. I maintain constant and effective communication with authors, editors and reviewers, which allows for a level of personal support that enables contributors to fully commit and concentrate on the chapters they are writing, editing, or reviewing. I assist authors in the preparation of their full chapter submissions and track important deadlines and ensure they are met. I help to coordinate internal processes such as linguistic review, and monitor the technical aspects of the process. As an ASM I am also involved in the acquisition of editors. Whether that be identifying an exceptional author and proposing an editorship collaboration, or contacting researchers who would like the opportunity to work with IntechOpen, I establish and help manage author and editor acquisition and contact.

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