Paul Chu

City University of Hong KongChina

Paul K. Chu received his BS in mathematics from The Ohio State University and MS and PhD in Chemistry from Cornell University. His research interests are quite diverse encompassing plasma surface engineering, materials science and engineering, as well as surface science. He is Chair Professor of Materials Engineering in the Department of Physics and Materials Science at City University of Hong Kong. He is a Fellow of the APS, AVS, IEEE, MRS, and HKIE. He is also Fellow of the Hong Kong Academy of Engineering Sciences.

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Latest work with IntechOpen by Paul Chu

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields.

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