Paul K. Chu received his BS in mathematics from The Ohio State University and MS and PhD in Chemistry from Cornell University. His research interests are quite diverse encompassing plasma surface engineering, materials science and engineering, as well as surface science. He is Chair Professor of Materials Engineering in the Department of Physics and Materials Science at City University of Hong Kong. He is a Fellow of the APS, AVS, IEEE, MRS, and HKIE. He is also Fellow of the Hong Kong Academy of Engineering Sciences.