The emerging fifth-generation mobile communications are envisaged to support massive number of deployment scenarios based on the respective use case requirements. The requirements can be efficiently attended with ultradense small-cell cloud radio access network (C-RAN) approach. However, the C-RAN architecture imposes stringent requirements on the transport networks. This book chapter presents high-capacity and low-latency optical wired and wireless networking solutions that are capable of attending to the network demands. Meanwhile, with optical communication evolutions, there has been advent of enhanced photonic integrated circuits (PICs). The PICs are capable of offering advantages such as low-power consumption, high-mechanical stability, low footprint, small dimension, enhanced functionalities, and ease of complex system architectures. Consequently, we exploit the PICs capabilities in designing and developing the physical layer architecture of the second standard of the next-generation passive optical network (NG-PON2) system. Apart from being capable of alleviating the associated losses of the transceiver, the proposed architectures aid in increasing the system power budget. Moreover, its implementation can significantly help in reducing the optical-electrical-optical conversions issue and the required number of optical connections, which are part of the main problems being faced in the miniaturization of network elements. Additionally, we present simulation results for the model validation.
Part of the book: Telecommunication Systems
Spatial light modulation is a technology with a demonstrated wide range of applications, especially in optical systems. Among the various spatial light modulator (SLM) technologies, e.g., liquid crystal (LC), magneto-optic, deformable mirror, multiple quantum well, and acoustic-optic Bragg cells, the ones based on liquid crystal on silicon (LCoS) have been gaining importance and relevance in a plethora of optical contexts, namely, in telecom, metrology, optical storage, and microdisplays. Their implementation in telecom has enabled the development of high-capacity optical components in system functionalities as multiplexing/demultiplexing, switching and optical signal processing. This technology combines the unique light-modulating properties of LC with the high-performance silicon complementary metal oxide semiconductor properties. Different types of modulation, i.e., phase, amplitude or combination of the two, can be achieved. In this book chapter, we address the most relevant applications of phase-only LCoS SLM for optical telecom purposes and the employment of SLM technology in photonic integrated circuits (PICs) (e.g., field-programmable silicon photonic (SiP) circuits and integrated SLM application to create versatile reconfigurable elements). Furthermore, a new SLM-based flexible coupling platform with applications in spatial division multiplexing (SDM) systems (e.g., to efficiently excite different cores in MCF) and characterization/testing of photonic integrated processors will be described.
Part of the book: Telecommunication Systems
The demand for low-cost high-speed transmission is a major challenge for 5G future networks. To meet this optical communication demand, holistic and painstaking approaches are required in designing a simplified system model. Since the demands for high bandwidth are growing at unprecedented speed as we approach the Zettabyte era, it is crucial to minimize chromatic dispersion (CD) associated to high bit-rate signals. Mitigating CD electronically comes at high cost which may not be compatible with 5G. Photonic Integrated Circuit (PIC) as an enabler for fast speed optical transmission is still undergoing its growth stage and its major speed and efficiency have not yet been attained. However, proper and right combination of components and approaches can potentiate this technology in a more cost-efficient way. Hybrid modulation (HM)-PIC presents a simplified approach in terms of cost and efficiency for 5G networks. Hybridization of existing modulation components and approaches in PIC can enhance the generation of high bit-rate signals without the need for electrical CD compensation. A detailed study of hybrid multilevel signal modulation concept as a valuable solution for Data Centers (DC) high data-rate signals and next-generation Passive Optical Networks (PONs) is proposed.
Part of the book: Network-on-Chip