Giovanni Pappalettera

By Caterina Casavola, Luciano Lamberti, Vincenzo Moramarco, Giovanni Pappalettera and Carmine Pappalettere

Increasing electronic component reliability is, nowadays, a hot topic both in most advanced applications as well as in electronic devices of common use in everyday life. In fact, requirements in terms of miniaturization of electronics components introduce issues connected with heat dissipation management. Materials, packaging, heat dissipator, and even positioning of the component on the board should be optimized in order to reduce thermal stresses generated in the components, which are one of the most important failure mechanisms of electronics. Thermal stress evaluation is, however, a difficult task due to the size of the elements under testing and to the necessity of measuring small amount of strains. At the same time, any contact with the object under measurement should be avoided not to alter heat capacity of the component itself. In this work, some results of experimental stress analysis gathered using electronic speckle pattern interferometry will be described; it will be pointed out how this approach allows to put in evidence inhomogeneous stress fields undergone by the electronic components and how it is possible to highlight the presence of bad functioning and defects.

Part of the book: Application Specific Integrated Circuits

By Caterina Casavola, Claudia Barile, Vincenzo Moramarco and Giovanni Pappalettera

Part of the book: New Challenges in Residual Stress Measurements and Evaluation