Vincenzo Moramarco

By Caterina Casavola, Alberto Cazzato and Vincenzo Moramarco

The friction stir welding (FSW) has become an important welding technique to join materials that are difficult to weld by traditional fusion welding technology. In this technique, the material is not led to fusion, and the joint is the result of the rotation and movement along the welding line of the tool that causes softening of material due to frictional heat and the stirring of the same. In FSW, the temperature does not reach the fusion value of the materials, and this helps to decrease the residual stress values. However, due to the higher force involved in the weld and, thus, the rigid clamping used, the residual stresses are not low in general in this technique. As the presence of high residual stress values influences the post-weld mechanical properties, e.g. fatigue properties, it is important to investigate the residual stress distribution in the FSW welds. In this chapter, two numerical models that predict temperatures and residual stresses in friction stir welding and laser-assisted friction stir welding will be described. Experimental measurements of temperatures and residual stress will be carried out to validate the prediction of the models.

Part of the book: Residual Stress Analysis on Welded Joints by Means of Numerical Simulation and Experiments

By Caterina Casavola, Luciano Lamberti, Vincenzo Moramarco, Giovanni Pappalettera and Carmine Pappalettere

Increasing electronic component reliability is, nowadays, a hot topic both in most advanced applications as well as in electronic devices of common use in everyday life. In fact, requirements in terms of miniaturization of electronics components introduce issues connected with heat dissipation management. Materials, packaging, heat dissipator, and even positioning of the component on the board should be optimized in order to reduce thermal stresses generated in the components, which are one of the most important failure mechanisms of electronics. Thermal stress evaluation is, however, a difficult task due to the size of the elements under testing and to the necessity of measuring small amount of strains. At the same time, any contact with the object under measurement should be avoided not to alter heat capacity of the component itself. In this work, some results of experimental stress analysis gathered using electronic speckle pattern interferometry will be described; it will be pointed out how this approach allows to put in evidence inhomogeneous stress fields undergone by the electronic components and how it is possible to highlight the presence of bad functioning and defects.

Part of the book: Application Specific Integrated Circuits

By Caterina Casavola, Claudia Barile, Vincenzo Moramarco and Giovanni Pappalettera

Part of the book: New Challenges in Residual Stress Measurements and Evaluation