Caterina Casavola

Polytechnic University of Bari Italy

Prof. Casavola is a full professor of Mechanical Design at Politecnico di Bari and she teaches Design of Innovative Materials, Experimentation on Aerostructures and Experimental Mechanics. Prof Casavola’s research activity is concerned with mechanical characterization of innovative materials, experimental stress analysis on real components (1:1 scale) and in situ inspection, study of residual stress generation, evolution and measurements (hole drilling method both with strain gage rosette and ESPI, X-Ray diffractometer, Barkhausen noise), and monitoring of electronic board and components by means of speckle interferometry. Prof. Casavola is the Scientific Director of the Laboratory of Static and Dynamic tests, Laboratory of Residual Stresses, Laboratory of Experimental Stress Analysis, Laboratory EMILIA (Experimental Mechanics Integrated Laboratory In Aerospace), and the Laboratory of Telemetry at Politecnico di Bari.

1books edited

2chapters authored

Latest work with IntechOpen by Caterina Casavola

Residual stresses (RS) are stresses present inside materials even in the absence of any applied load. They are of capital importance because they can impact greatly on the mechanical strength of the material, on its dimensional correspondence to design specifications as well as on the fatigue life of the part. RS measurement and evaluation is currently an important research topic where a lot of challenges still need to be addressed. This book aims to provide the reader with an overview of the principal novelties in this field including current limitations and potential future developments. Both radically new experimental approaches as well as recent evolutions of consolidated ones will be presented, along with the latest novelties in the area of numerical residual stress evaluation.

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New Challenges in Residual Stress Measurements and Evaluation

Edited by Caterina Casavola

Chapters authored

Application of Optical Methods to Electronic Component Stress Analysis

By Caterina Casavola, Luciano Lamberti, Vincenzo Moramarco, Giovanni Pappalettera and Carmine Pappalettere

Increasing electronic component reliability is, nowadays, a hot topic both in most advanced applications as well as in electronic devices of common use in everyday life. In fact, requirements in terms of miniaturization of electronics components introduce issues connected with heat dissipation management. Materials, packaging, heat dissipator, and even positioning of the component on the board should be optimized in order to reduce thermal stresses generated in the components, which are one of the most important failure mechanisms of electronics. Thermal stress evaluation is, however, a difficult task due to the size of the elements under testing and to the necessity of measuring small amount of strains. At the same time, any contact with the object under measurement should be avoided not to alter heat capacity of the component itself. In this work, some results of experimental stress analysis gathered using electronic speckle pattern interferometry will be described; it will be pointed out how this approach allows to put in evidence inhomogeneous stress fields undergone by the electronic components and how it is possible to highlight the presence of bad functioning and defects.

Part of the book: Application Specific Integrated Circuits

Introductory Chapter: New Challenges in Residual Stress Measurements and Evaluation

By Caterina Casavola, Claudia Barile, Vincenzo Moramarco and Giovanni Pappalettera

Part of the book: New Challenges in Residual Stress Measurements and Evaluation

Caterina Casavola

Latest work with IntechOpen by Caterina Casavola

New Challenges in Residual Stress Measurements and Evaluation

Chapters authored

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