This chapter addresses recent progress in the field of polymer thermoelectric materials. It covers a brief introduction to intrinsically conductive polymers and its motivation for thermoelectric utilization. A review about important and recent literature in the field of p-type and n-type polymers for thermoelectric applications is summarized here. For a better understanding of material development issues, doping mechanisms for intrinsically conducting polymers are discussed. Special emphasis is given to n-type polymers, since this group of polymers is often neglected due to unavailability or poor stability during processing. Different possibilities in terms of generator design and fabrication are presented. Recent challenges in this scientific field are discussed in respect to current material development, uncertainty during the measurement of thermoelectric properties as well as temperature stability for the most prominent p-type polymer used for thermoelectric, PEDOT:PSS.
Part of the book: Thermoelectrics for Power Generation
This book chapter elaborates on different additive manufacturing (AM) processes of copper and copper alloys. The scope is to give the reader a basic understanding of the state-of-the-art of copper additive manufacturing by different AM technologies, such as laser powder bed fusion (LPBF), laser metal deposition (LMD), binder jetting (BJ), and metal-fused filament fabrication (M-FFF). Furthermore, we want the reader to be able to use this knowledge to find and assess potential use cases. Recently, with the commercial availability of green laser sources, the difficulties for laser processing of pure copper were overcome, which gave AM technologies, such as LPBF and LMD new momentum and increased interest. AM technologies involving a subsequent sintering step. They are relatively new and gained interest due to fast build-up rates (BJ) or ease of operation (M-FFF). We will cover important material-related properties of copper and its implications for manufacturing and application (e.g. absorption, sinterability, conductivity, and its dependency on impurities). Further, we address applications for AM copper, present the state-of-the-art for above mentioned AM technologies and share our own recent research in this field.
Part of the book: Advanced Additive Manufacturing