Chapters authored
Development of Metamaterial EBG Absorbers for Application of Wireless Inter/Intrachip Communication Systems
First, the chapter presents a novel design of electromagnetic bandgap (EBG) absorber with the characteristics of broad bandwidth, low profile, and polarization‐independence to a normal incident electromagnetic wave. The absorber is composed of three consecutive octagon or decagon loops, and highly‐resistive frequency selective surface (FSS) layers. Second, based on the feature of the designed absorber unit, a broadband, metamaterial absorber‐bounded, wireless inter/intrachip (WIIC) communication channel is constructed at the center frequency of 60 GHz. Third, in order to validate the developed methodology used in WIIC analysis, a wired channel on a conventional PCB has been measured, simulated, and analyzed. Fourth, with the extracted S‐parameters of the WIIC system and wired PCB channel, the system impulse responses and transfer functions of the investigated channels have been further extracted, which are used for validation and BER analysis of the WIIC system. Finally, it has been shown that based on the derived BER results, the performance of the designed WIIC channel is close to that of an additive Gaussian white noise (AWGN) channel when the WIIC transceivers are built in with the functionalities of forward error control (FEC), channel estimation, and equalization.
Part of the book: Metamaterials