There is an increasing demand for efficient cooling techniques in computer industry to dissipate the associated heat from the newly designed and developed computer processors to accommodate for their enhanced processing power and faster operations. Such a demand necessitates researchers to explore efficient approaches for central processing unit (CPU) cooling. Consequently, heat pipes can be a viable and promising solution for this challenge. In this chapter, a CPU thermal design power (TDP), cooling methods of electronic equipments, heat pipe theory and operation, heat pipes components, such as the wall material, the wick structure, and the working fluid, are presented. Moreover, we review experimentally, analytically and numerically the types of heat pipes with their applications for electronic cooling in general and the computer cooling in particular. Summary tables that compare the content, methodology, and types of heat pipes are presented. Due to the numerous advantages of the heat pipe in electronic cooling, this chapter definitely leads to further research in computer cooling applications.
Part of the book: Electronics Cooling
It became evident nowadays that modernization influences domestic and commercial HVAC industry, and thus high technological and energy-efficient central air conditioning systems are demanded. Therefore, the selection of proper type of central air conditioning system is a crucial target in the construction industry as improper selection can maximize initial and/or running costs of the system and decreases the human comfort and indoor air quality levels. In fact, a pre-assessment of the construction type and budget available is required for selecting the proper type of central air conditioning system. Therefore, there is a continuous need for an updated material in the literature that reviews the central air conditioning systems and applications, which is the motivation of the present chapter. The present chapter reviews the central air conditioning systems and applications. Specifically, all-air systems, all-water systems, and air-water systems are discussed. In addition, all provided systems are further explored through several developed schematic diagrams enabling the identification of their various components and the understanding of their working principles. It is may be of interest to note that this chapter is suitable for undergraduate level students in the fields of HVAC and R, mechanical, and construction engineering.
Part of the book: Low-temperature Technologies