Mingbo Niu

Chang'an University China

Dr. Niu received a BEng in Electronic Engineering from Northwestern Polytechnical University, China, and an MSc (Eng.) (first-class) in Communication and Information Systems from the same university. Prior to his Ph.D., Dr. Niu worked at a State Key Laboratory on underwater information and signal processing. He received his Ph.D. in Electrical and Computer Engineering from the University of British Columbia, Canada. From 2008 to 2012, he was a research assistant at Optical Wireless Communications Laboratory and Integrated Optics Laboratory where he contributed to the development of ultra-high-speed optical data transmission links. Dr. Niu held a postdoctoral fellowship at Queen’s University, Canada for two years. He also worked for Public Works at Calian Tech. Ltd., where he contributed to highly efficient statistical evaluation models of MIMO compressive sensing projects. Dr. Niu has co-authored more than thirty Institute of Electrical and Electronics Engineers (IEEE) and Optical Society of America (OSA) papers and supervised numerous student projects. Currently, he serves as a Lead Guest Editor for Wireless Communications and Mobile Computing and an Academic Editor for IntechOpen. He is a member of the Internet of Things (IoT) Committee at the China Institute of Communications (CIC). Dr. Niu received numerous scholarships during his undergraduate and graduate studies, including a Chinese Government Award, two University of British Columbia University Graduate Fellowships (UGFs), and a Huawei Tech. Ltd. Special Fellowship. His current research and teaching interests include the Internet of Vehicles (IoV), vehicle-to-road (V2R) infrastructure, cooperative microgrids, massive multiple input, multiple outputs (MIMO), image signal processing, low-carbon smart cities, energy harvesting, and electronic circuit theory. Dr. Niu is a licensed professional engineer in British Columbia.

Mingbo Niu

2books edited

2chapters authored

Latest work with IntechOpen by Mingbo Niu

Intelligent electronics could shape future smart cities and promote initiatives on exploring brand-new integrated circuits, high-effective intelligent reconfigurable surfaces, nondestructive evaluation, terahertz (THz), ITS, 6G, medical and safety imaging, and signal filtering. This book presents mainstream principles, circuitry architectures, and a development roadmap for intelligent electronic systems. Its content ranges from theoretical basis to materials characteristics, and from featured advances to practical applications.

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