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An Inductive-Coupling Inter-Chip Link for High-Performance and Low-Power 3D System Integration

Written By

Kiichi Niitsu and Tadahiro Kuroda

Published: January 1st, 2010

DOI: 10.5772/6885

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Written By

Kiichi Niitsu and Tadahiro Kuroda

Published: January 1st, 2010