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Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling

Written By

Li, Tomi Laurila, Toni Mattila, Hongbo Xu and Mervi Paulasto-Kröckel

Submitted: May 22nd, 2012 Published: February 6th, 2013

DOI: 10.5772/53820

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Written By

Li, Tomi Laurila, Toni Mattila, Hongbo Xu and Mervi Paulasto-Kröckel

Submitted: May 22nd, 2012 Published: February 6th, 2013