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Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling

Written By

Li, Tomi Laurila, Toni Mattila, Hongbo Xu and Mervi Paulasto-Kröckel

Submitted: 22 May 2012 Published: 06 February 2013

DOI: 10.5772/53820

From the Edited Volume

Recent Developments in the Study of Recrystallization

Edited by Peter Wilson

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Written By

Li, Tomi Laurila, Toni Mattila, Hongbo Xu and Mervi Paulasto-Kröckel

Submitted: 22 May 2012 Published: 06 February 2013