Open access peer-reviewed chapter

Insert Molding Process Employing Vapour Chamber

By Jung-Chang Wang, Tien-Li Chang and Ya-Wei Lee

Submitted: May 13th 2011Reviewed: December 16th 2011Published: March 23rd 2012

DOI: 10.5772/35621

Downloaded: 4485

© 2012 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution 3.0 License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Jung-Chang Wang, Tien-Li Chang and Ya-Wei Lee (March 23rd 2012). Insert Molding Process Employing Vapour Chamber, Some Critical Issues for Injection Molding, Jian Wang, IntechOpen, DOI: 10.5772/35621. Available from:

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