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The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections

Written By

Toni T. Mattila and Jorma K. Kivilahti

Submitted: June 8th, 2011 Published: March 7th, 2012

DOI: 10.5772/37899

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Written By

Toni T. Mattila and Jorma K. Kivilahti

Submitted: June 8th, 2011 Published: March 7th, 2012