Open access peer-reviewed chapter

Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips

By Jinjia Wei and Yanfang Xue

Submitted: May 25th 2010Published: January 28th 2011

DOI: 10.5772/14466

Downloaded: 2634

© 2011 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution-NonCommercial-ShareAlike-3.0 License, which permits use, distribution and reproduction for non-commercial purposes, provided the original is properly cited and derivative works building on this content are distributed under the same license.

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Jinjia Wei and Yanfang Xue (January 28th 2011). Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips, Heat Transfer - Theoretical Analysis, Experimental Investigations and Industrial Systems, Aziz Belmiloudi, IntechOpen, DOI: 10.5772/14466. Available from:

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