TY  - CHAP
AU  - Michael Shearn
AU  - Xiankai Sun
AU  - M. David Henry
AU  - Amnon Yariv
AU  - Axel Scherer
ED  - Jan Grym
Y1  - 2010-04-01
PY  - 2010
T1  - Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications
N2  - Semiconductor technologies continue to evolve and amaze us. New materials, new structures, new manufacturing tools, and new advancements in modelling and simulation form a breeding ground for novel high performance electronic and photonic devices. This book covers all aspects of semiconductor technology concerning materials, technological processes, and devices, including their modelling, design, integration, and manufacturing.
BT  - Semiconductor Technologies
SP  - Ch. 5
UR  - https://doi.org/10.5772/8564
DO  - 10.5772/8564
SN  - 
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-25
ER  -