TY  - CHAP
AU  - Eiichi Kondoh
ED  - Masato Sone
ED  - Kazuya Masu
Y1  - 2018-11-15
PY  - 2018
T1  - Cu Wiring Fabrication by Supercritical Fluid Deposition for MEMS Devices
N2  - Gold and noble metals have been attractive to humans from ancient times because of their beautiful features. In modern society, noble metals, especially gold, play important roles as components in electronic devices because of their high electrical conductivity, chemical stability, and density. In the field of MEMS devices, the demand for continuous miniaturization and sensitivity enhancement is always high. Especially for MEMS accelerometers, sensitivity is affected by Brownian noise, and components with sufficient mass are needed to suppress this noise. Therefore, it is difficult to reduce the dimensions of components to allow further miniaturization of the device. This book presents recent progress in noble metal electrodeposition and applications of gold-based materials in the realization of highly sensitive CMOS-MEMS accelerometers.
BT  - Novel Metal Electrodeposition and the Recent Application
SP  - Ch. 3
UR  - https://doi.org/10.5772/intechopen.81636
DO  - 10.5772/intechopen.81636
SN  - 978-1-78985-296-7
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-16
ER  -