TY  - CHAP
AU  - Knut E. Aasmundtveit
AU  - Thi-Thuy Luu
AU  - Hoang-Vu Nguyen
AU  - Andreas
Larsson
AU  - Torleif A. Tollefsen
ED  - Mahmood Aliofkhazraei
Y1  - 2018-05-30
PY  - 2018
T1  - Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
N2  - Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages.
BT  - Intermetallic Compounds
SP  - Ch. 3
UR  - https://doi.org/10.5772/intechopen.75139
DO  - 10.5772/intechopen.75139
SN  - 978-1-78923-179-3
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-18
ER  -