TY  - CHAP
AU  - Sang Hoon Kim
AU  - Sangsun Yang
ED  - Ahmad Azmin Mohamad
Y1  - 2017-11-29
PY  - 2017
T1  - Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications
N2  - This book is about solders and their composition and focuses on material characterizations and the methods used to make alloys and determine their structures, physical properties and applications. Physical properties and the factors that control them and theoretical verification are the main contents of this book. Corrosion of solders is included in the coverage of the properties related to solder composition and mechanical properties.
BT  - Soldering Materials
SP  - Ch. 2
UR  - https://doi.org/10.5772/intechopen.70272
DO  - 10.5772/intechopen.70272
SN  - 978-953-51-3644-6
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-26
ER  -