TY  - CHAP
AU  - Yangang Wang
AU  - Xiaoping Dai
AU  - Guoyou Liu
AU  - Yibo Wu
AU  - Yun Li and
Steve Jones
ED  - Mohamed Amine Fakhfakh
Y1  - 2016-10-05
PY  - 2016
T1  - Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles
N2  - The book presents interesting topics from the area of modeling and simulation of electric vehicles application. The results presented by the authors of the book chapters are very interesting and inspiring. The book will familiarize the readers with the solutions and enable the readers to enlarge them by their own research. It will be useful for students of Electrical Engineering; it helps them  solve  practical problems.
BT  - Modeling and Simulation for Electric Vehicle Applications
SP  - Ch. 2
UR  - https://doi.org/10.5772/64173
DO  - 10.5772/64173
SN  - 978-953-51-2637-9
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-26
ER  -