TY  - CHAP
AU  - Donggang Li
AU  - Qiang Wang
AU  - Agnieszka Franczak
AU  - Alexandra
Levesque
AU  - Jean-Paul Chopart
ED  - Mahmood Aliofkhazraei
Y1  - 2015-12-02
PY  - 2015
T1  - The Coupled Magnetic Field Effects on the Microstructure Evolution and Magnetic Properties of As-Deposited and Post- Annealed Nano-Scaled Co-Based Films — Part II
N2  - The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.
BT  - Electroplating of Nanostructures
SP  - Ch. 13
UR  - https://doi.org/10.5772/61349
DO  - 10.5772/61349
SN  - 
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-25
ER  -