TY  - CHAP
AU  - Jue Li
AU  - Tomi Laurila
AU  - Toni T. Mattila
AU  - Hongbo Xu
AU  - Mervi Paulasto- Kröcke
ED  - Peter Wilson
Y1  - 2013-02-06
PY  - 2013
T1  - Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling
N2  - Recrystallization is a phenomenon moderately well documented in the geological and metallurgical literature. This book provides a timely overview of the latest research and methods in a variety of fields where recrystallization is studied and is an important factor.  The main advantage of a new look at these fields is the rapid increase in modern techniques, such as TEM, spectrometers and modeling capabilities, all of which are providing us with far better images and analysis than ever previously possible. This book will be invaluable to a wide range of research scientists; metallurgists looking to improve properties of alloys, those interested in how the latest equipment may be used to image grains and to all those who work with frozen aqueous solutions where recrystallization may be a problem.
BT  - Recent Developments in the Study of Recrystallization
SP  - Ch. 3
UR  - https://doi.org/
DO  - 
SN  - 
PB  - IntechOpen
CY  - Rijeka
Y2  - 2024-04-16
ER  -