@incollection{Kondoh19,
author = {Mitsuhiro Watanabe and Eiichi Kondoh},
title = {Room-Temperature Formation of Intermixing Layer for Adhesion Improvement of Cu/Glass Stacks},
booktitle = {Lead Free Solders},
publisher = {IntechOpen},
address = {Rijeka},
year = {2019},
editor = {Abhijit Kar},
chapter = {4},
doi = {10.5772/intechopen.84362},
url = {https://doi.org/10.5772/intechopen.84362}
}