@incollection{Mumby-Croft18,
author = {Paul Mumby-Croft and Daohui Li and Xiaoping Dai and Guoyou Liu},
title = {High-Performance Packaging Technology for Wide Bandgap Semiconductor Modules},
booktitle = {Disruptive Wide Bandgap Semiconductors, Related Technologies, and Their Applications},
publisher = {IntechOpen},
address = {Rijeka},
year = {2018},
editor = {Yogesh Kumar Sharma},
chapter = {4},
doi = {10.5772/intechopen.78765},
url = {https://doi.org/10.5772/intechopen.78765}
}