@incollection{Aasmundtveit18,
author = {Knut E. Aasmundtveit and Thi-Thuy Luu and Hoang-Vu Nguyen and Andreas
Larsson and Torleif A. Tollefsen},
title = {Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding},
booktitle = {Intermetallic Compounds},
publisher = {IntechOpen},
address = {Rijeka},
year = {2018},
editor = {Mahmood Aliofkhazraei},
chapter = {3},
doi = {10.5772/intechopen.75139},
url = {https://doi.org/10.5772/intechopen.75139}
}