@incollection{Yang17,
author = {Sang Hoon Kim and Sangsun Yang},
title = {Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications},
booktitle = {Soldering Materials},
publisher = {IntechOpen},
address = {Rijeka},
year = {2017},
editor = {Ahmad Azmin Mohamad},
chapter = {2},
doi = {10.5772/intechopen.70272},
url = {https://doi.org/10.5772/intechopen.70272}
}