@incollection{Lee17,
author = {Young Chul Lee},
title = {LTCC-Based System-in-Package (SiP) Technology for Microwave System Integration},
booktitle = {Microwave Systems and Applications},
publisher = {IntechOpen},
address = {Rijeka},
year = {2017},
editor = {Sotirios K. Goudos},
chapter = {13},
doi = {10.5772/66327},
url = {https://doi.org/10.5772/66327}
}